256 Field Programmable Gate Arrays (FPGA) 1,886

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP3C16F256C7	Intel	FPGA	Other	Ball	256	LBGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS		168		1.2			Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		15408 CLBS	0 °C (32 °F)	Tin Lead	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz		168		17 mm
EP3C25U256C6	Intel	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS		156		1.2			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)		24624 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.5 mm	14 mm	No		e0	472.5 MHz		156		14 mm
EP3C25U256C6N	Intel	FPGA	Other	Ball	256	FBGA	Rectangular	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS		156		1.2			Grid Array, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)		24624 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	2.2 mm	14 mm	No		e1	472.5 MHz		156		14 mm
EP3C5F256C6	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	5136	Yes	1.25 V	5136	CMOS		182		1.2			Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		5136 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz		182		17 mm
EP3C5F256C6N	Intel	FPGA	Other	Ball	256	LBGA	Rectangular	Plastic/Epoxy	5136	Yes	1.25 V	5136	CMOS		182		1.2			Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		5136 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz		182		17 mm
EP3C5F256C8	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	5136	Yes	1.25 V	5136	CMOS		182		1.2			Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		5136 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz		182		17 mm
EP4CE15U14I7N	Intel	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	15408	Yes	1.25 V				165		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm						Bottom	S-PBGA-B256		1.5 mm	14 mm	No					165		14 mm
EP4CE22F17C6	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	22320	Yes	1.25 V	1395			153		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		1395 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz		153		17 mm
EP4CE22F17C9LN	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	22320	Yes	1.03 V	1395			153		1		1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)		1395 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	265 MHz		153		17 mm
LAMXO640C-3FTN256E	Lattice Semiconductor	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy	640	Yes	3.465 V	80		AEC-Q100	159		1.8		1.8/2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	125 °C (257 °F)		80 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also Operates at 2.5 V and 3.3 V nominal supply	e1		40 s	159	260 °C (500 °F)	17 mm
LCMXO2-1200UHC-5FTG256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	1280	Yes	3.465 V				206		2.5	Tray	2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also Operates at 3.3 V nominal supply	e1	133 MHz	30 s	206	260 °C (500 °F)	17 mm
LCMXO2-4000HC-6BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	4320	Yes	3.465 V				206		2.5	Tray	2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	2.375 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO2-4000HC-6FTG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	4320	Yes	3.465 V				206		2.5	Tray	2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	17 mm
LCMXO2-7000HC-5FTG256I	Lattice Semiconductor	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	6864	Yes	3.465 V				206		2.5	Tray	2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	17 mm
LCMXO2-7000HC-6BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	6864	Yes	3.465 V				206		2.5	Tray	2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	2.375 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO2280C-3FTN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	2280	Yes	3.465 V	285			211		1.8		1.8/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	100 °C (212 °F)		285 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No		e1		40 s	211	260 °C (500 °F)	17 mm
LCMXO3D-4300ZC-2BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	4300	Yes	3.465 V	537			206		2.5			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		2.375 V	.8 mm	100 °C (212 °F)	7 ns	537 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm		Also Operates at 3.3 V nominal supply				206		14 mm
LCMXO3L-4300C-5BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	540					2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
LCMXO3L-9400C-5BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	1175					2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		1175 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
LCMXO640C-3FT256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	640	Yes	3.465 V	80			159		1.8		1.8/2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	100 °C (212 °F)		80 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No		e0		30 s	159	225 °C (437 °F)	17 mm
LCMXO640C-3FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	640	Yes	3.465 V	80			159		1.8		1.8/2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)		80 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No		e1		40 s	159	260 °C (500 °F)	17 mm
LCMXO640C-3FTN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	640	Yes	3.465 V	80			159		1.8		1.8/2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	100 °C (212 °F)		80 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No		e1		40 s	159	260 °C (500 °F)	17 mm
LCMXO640C-5FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	640	Yes	3.465 V	80			159		1.8		1.8/2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)		80 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No		e1		40 s	159	260 °C (500 °F)	17 mm
LFE2-20SE-7FN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	20000	Yes	1.26 V	2625			193		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.304 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	420 MHz	40 s	193	250 °C (482 °F)	17 mm
LFE2M20SE-5FN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	20000	Yes	1.26 V	2375			140		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	311 MHz	40 s	140	250 °C (482 °F)	17 mm
LFE3-17EA-7FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	17000	Yes	1.26 V				133		1.2		1.2 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.335 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	420 MHz	30 s	133	260 °C (500 °F)	17 mm
LFE3-17EA-8FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	17000	Yes	1.26 V				133		1.2		1.2 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.281 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	500 MHz	30 s	133	260 °C (500 °F)	17 mm
LFE3-35EA-8FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	33000	Yes	1.26 V				133		1.2		1.2 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.281 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	500 MHz	30 s	133	260 °C (500 °F)	17 mm
LFXP2-17E-6FT256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	17000	Yes	1.26 V		CMOS		201		1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.399 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	435 MHz	30 s	201	225 °C (437 °F)	17 mm
LFXP2-30E-6FTN256I	Lattice Semiconductor	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	29000	Yes	1.26 V	3625	CMOS		201		1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.399 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	435 MHz	40 s	201	260 °C (500 °F)	17 mm
XC2S100-5FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	2.625 V	600			180	100000	2.5		1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	600 CLBS, 100000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	263 MHz	30 s	176	260 °C (500 °F)	17 mm
XC2S150-5FGG256I	Xilinx	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	3888	Yes	2.625 V	864			260	150000	2.5		1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	864 CLBS, 150000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	263 MHz	30 s	260	260 °C (500 °F)	17 mm
XC2S200-5FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176			180	200000	2.5		1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	1176 CLBS, 200000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates 200000	e0	263 MHz	30 s	176	225 °C (437 °F)	17 mm
XC2S200-5FG256I	Xilinx	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176			180	200000	2.5		1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	100 °C (212 °F)	0.7 ns	1176 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	263 MHz	30 s	176	225 °C (437 °F)	17 mm
XC2S200-5FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176			284	200000	2.5		1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	1176 CLBS, 200000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates 200000	e1	263 MHz	30 s	284	260 °C (500 °F)	17 mm
XC2S200-6FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176			284	200000	2.5		1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.6 ns	1176 CLBS, 200000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates 200000	e1	263 MHz	30 s	284	260 °C (500 °F)	17 mm
XC2S50-5FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	1728	Yes	2.625 V	384			180	50000	2.5		1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	100 °C (212 °F)	0.7 ns	384 CLBS, 50000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	263 MHz	30 s	176	225 °C (437 °F)	17 mm
XC2S50-5FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	1728	Yes	2.625 V	384			176	50000	2.5		1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	384 CLBS, 50000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates 50000	e1	263 MHz	30 s	176	260 °C (500 °F)	17 mm
XC2S50-6FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	1728	Yes	2.625 V	384			176	50000	2.5		1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.6 ns	384 CLBS, 50000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates 50000	e1	263 MHz	30 s	176	260 °C (500 °F)	17 mm
XC2V1000-6FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS		172	1000000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.35 ns	1280 CLBS, 1000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	820 MHz	30 s	172	225 °C (437 °F)	17 mm
XC2VP2-5FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	3168	Yes	1.575 V	352	CMOS		140		1.5		1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	352 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	1050 MHz	30 s	140	260 °C (500 °F)	17 mm
XC3S1000-4FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	17280	Yes	1.26 V	1920	CMOS		173	1000000	1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	1920 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	630 MHz	30 s	173	225 °C (437 °F)	17 mm
XC3S1000-5FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	17280	Yes	1.26 V	1920	CMOS		173	1000000	1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	1920 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	725 MHz	30 s	173	260 °C (500 °F)	17 mm
XC3S1200E-4FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS		190	1200000	1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	2168 CLBS, 1200000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	572 MHz	30 s	150	225 °C (437 °F)	17 mm
XC3S1200E-5FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS		190	1200000	1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.66 ns	2168 CLBS, 1200000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	657 MHz	30 s	150	225 °C (437 °F)	17 mm
XC3S1400A-4FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS		161	1400000	1.2		1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	667 MHz	30 s	148	225 °C (437 °F)	17 mm
XC3S1400A-4FT256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS		161	1400000	1.2		1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	2816 CLBS, 1400000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	667 MHz	30 s	148	225 °C (437 °F)	17 mm
XC3S1400A-5FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS		161	1400000	1.2		1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	770 MHz	30 s	148	260 °C (500 °F)	17 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.