256 Field Programmable Gate Arrays (FPGA) 1,886

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCV200-4BG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176	CMOS		180	236666	2.5	1.2/3.6,2.5 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	2.375 V	1.27 mm		0.8 ns	1176 CLBS, 236666 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0	250 MHz	30 s	180	225 °C (437 °F)	27 mm
XC6SLX25-3FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS		186		1.2	1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	1879 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	862 MHz	30 s	186	225 °C (437 °F)	17 mm
XC2V250-5FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	3456	Yes	1.575 V	384	CMOS		172	250000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	384 CLBS, 250000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	750 MHz	30 s	172	225 °C (437 °F)	17 mm
XC4028XLA-09BGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	1024	CMOS			18000	3.3		Grid Array			3 V	1.27 mm		1.1 ns	1024 CLBS, 18000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Can also use 50000 gates	e1	227 MHz	30 s		250 °C (482 °F)	27 mm
XCV300-4BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS			322970	2.5		Grid Array			2.375 V	1.27 mm	85 °C (185 °F)	0.6 ns	1536 CLBS, 322970 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0					27 mm
XC4013XL-1BGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS			10000	3.3		Grid Array			3 V	1.27 mm		1.3 ns	576 CLBS, 10000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Max usable 13000 Logic gates	e1	200 MHz	30 s		250 °C (482 °F)	27 mm
XC4013XLA-08BG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS		192	10000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm		1 ns	576 CLBS, 10000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Can also use 30000 gates	e0	263 MHz	30 s	192	225 °C (437 °F)	27 mm
XC2V40-4FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	576	Yes	1.575 V	64	CMOS		88	40000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	64 CLBS, 40000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	650 MHz	30 s	88	225 °C (437 °F)	17 mm
XC4020XL-1BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	784	CMOS			13000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)	1.3 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Max usable 20000 Logic gates	e1	200 MHz	30 s		250 °C (482 °F)	27 mm
XC3S1500-5FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array, Low Profile			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1		30 s		260 °C (500 °F)	17 mm
XC2VP2-7FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	3168	Yes	1.575 V	352	CMOS		140		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	352 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	1350 MHz	30 s	140	225 °C (437 °F)	17 mm
XC7A50T-L2FTG256C	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	52160	Yes	.93 V	4075			250		0.9		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.87 V	1 mm	85 °C (185 °F)	1.51 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	250	260 °C (500 °F)	17 mm
XC4013XLA-9BGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS			10000	3.3		Grid Array			3 V	1.27 mm		1.1 ns	576 CLBS, 10000 Gates		Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e1	227 MHz				27 mm
XC4010XL-3BG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	400	Yes	3.6 V	400	CMOS		160	7000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.6 ns	400 CLBS, 7000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Max usable 10000 Logic gates	e0	166 MHz	30 s	160	225 °C (437 °F)	27 mm
XCV50-5FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	1728	Yes	2.625 V	384	CMOS		176	57906	2.5	1.2/3.6,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	384 CLBS, 57906 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	294 MHz	30 s	176	225 °C (437 °F)	17 mm
XCV200-6FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	2.625 V	1176	CMOS			236666	2.5		Grid Array			2.375 V	1 mm	85 °C (185 °F)	0.6 ns	1176 CLBS, 236666 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	333 MHz				17 mm
XCV300-4FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS			322970	2.5		Grid Array			2.375 V	1 mm	85 °C (185 °F)	0.6 ns	1536 CLBS, 322970 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1					17 mm
XC2VP2-5FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	3168	Yes	1.575 V	352	CMOS		140		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	352 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	1050 MHz	30 s	140	225 °C (437 °F)	17 mm
XC7A200T-1FTG256E	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825			500		1		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.95 V	1 mm	100 °C (212 °F)	1.27 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1098 MHz	30 s	500	260 °C (500 °F)	17 mm
XC3S4000-5FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array, Low Profile			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1		30 s		260 °C (500 °F)	17 mm
XCV150-4FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	3888	Yes	2.625 V	864	CMOS		176	164674	2.5	1.2/3.6,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm		0.8 ns	864 CLBS, 164674 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	250 MHz	30 s	176	225 °C (437 °F)	17 mm
XA6SLX16-2FTG256Q	Xilinx	FPGA		Ball	256	BGA	Square	Plastic	14579	Yes				AEC-Q100	186			1.2,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B256	3			No		e1	62.5 MHz	30 s	186	260 °C (500 °F)
XC3S1000L-4FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	17280	Yes		1920	CMOS		173	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		1920 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0		30 s	173	225 °C (437 °F)	17 mm
XC4013XL-3BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS			10000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)	1.6 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Max usable 13000 Logic gates	e1	166 MHz	30 s		250 °C (482 °F)	27 mm
XC4020XL-09CBGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	784	CMOS			13000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)	1.2 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Max usable 20000 Logic gates	e1	217 MHz				27 mm
XCV100-5BG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	2.625 V	600	CMOS		180	108904	2.5	1.5/3.3,2.5 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	2.375 V	1.27 mm		0.7 ns	600 CLBS, 108904 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0	294 MHz	30 s	180	225 °C (437 °F)	27 mm
XC2V1000-4FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS		172	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	1280 CLBS, 1000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	650 MHz	30 s	172	225 °C (437 °F)	17 mm
XC4013XLA-7BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS			10000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)	0.9 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0	294 MHz				27 mm
XCV200-6BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176	CMOS		180	236666	2.5	1.2/3.6,2.5 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	85 °C (185 °F)	0.6 ns	1176 CLBS, 236666 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0	333 MHz	30 s	180	225 °C (437 °F)	27 mm
XCV50E-8FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	1728	Yes	1.89 V	384	CMOS		176	20736	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.4 ns	384 CLBS, 20736 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	416 MHz	30 s	176	225 °C (437 °F)	17 mm
XCS40XL-4BG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	1862	Yes	3.6 V	784	CMOS		205	13000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.1 ns	784 CLBS, 13000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Maximum usable gates 40000	e0	217 MHz	30 s	205	225 °C (437 °F)	27 mm
XCV200-6FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176	CMOS		176	236666	2.5	1.2/3.6,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.6 ns	1176 CLBS, 236666 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	333 MHz	30 s	176	225 °C (437 °F)	17 mm
XC4028XLA-07BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	1024	CMOS			18000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)	0.9 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Can also use 50000 gates	e1	294 MHz	30 s		250 °C (482 °F)	27 mm
XCV200-5BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	2.625 V	1176	CMOS			236666	2.5		Grid Array			2.375 V	1.27 mm	85 °C (185 °F)	0.7 ns	1176 CLBS, 236666 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e1	294 MHz	30 s		250 °C (482 °F)	27 mm
XCV200-5FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	2.625 V	1176	CMOS			236666	2.5		Grid Array			2.375 V	1 mm	85 °C (185 °F)	0.7 ns	1176 CLBS, 236666 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	294 MHz				17 mm
XC2V1000-4FGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS		172	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	1280 CLBS, 1000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	650 MHz	30 s	172	260 °C (500 °F)	17 mm
XC7A200T-L2FTG256E	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	215360	Yes	.93 V	16825			500		0.9		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.87 V	1 mm	100 °C (212 °F)	1.51 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	500	260 °C (500 °F)	17 mm
XA3S200-4FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	4320	Yes	1.26 V	480		AEC-Q100	173	200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)		480 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	125 MHz	30 s	173	260 °C (500 °F)	17 mm
XC6SLX9-3NFTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Low Profile			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	806 MHz				17 mm
XC7A35T-L1FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	33280	Yes	.98 V	2600			250		0.95		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1098 MHz	30 s	250	260 °C (500 °F)	17 mm
XC6SLX16-N3FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS		186		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	1139 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	806 MHz	30 s	186	225 °C (437 °F)	17 mm
XC6SLX9-3NFT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Low Profile			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	806 MHz				17 mm
XC2S50E-7FTGG256C	Xilinx	FPGA	Commercial Extended	B	256	FBGA	Square	Plastic/Epoxy		Yes	1.89 V	864				52000	1.8		Grid Array, Fine Pitch			1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No	Maximum usable gates = 150000	e1	357 MHz				17 mm
XC2V250-5FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	3456	Yes	1.575 V	384	CMOS		172	250000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	384 CLBS, 250000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	750 MHz	30 s	172	225 °C (437 °F)	17 mm
XC2V250-6FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	3456	Yes	1.575 V	384	CMOS		172	250000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.35 ns	384 CLBS, 250000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	820 MHz	30 s	172	225 °C (437 °F)	17 mm
XCS150E-6FT256I	Xilinx	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	3888	Yes	1.89 V		CMOS		265		1.8	1.8,2.5,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	100 °C (212 °F)	0.47 ns		-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3		17 mm	No		e0	357 MHz		265		17 mm
XC7A12T-1FTG256E	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG		150		1		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.95 V	1 mm	100 °C (212 °F)	1.27 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1098 MHz	30 s	150	260 °C (500 °F)	17 mm
XC2VP2-8FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	352	CMOS				1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)		352 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1					17 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.