256 Field Programmable Gate Arrays (FPGA) 1,886

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC2VP4-7FGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	752	CMOS				1.5		Grid Array			1.425 V	1 mm		0.28 ns	752 CLBS		Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	1350 MHz				17 mm
XA6SLX25-2FTG256Q	Xilinx	FPGA		Ball	256	BGA	Square	Plastic	24051	Yes				AEC-Q100	186			1.2,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B256	3			No		e1	62.5 MHz	30 s	186	260 °C (500 °F)
XC2S50E-6FT256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	1728	Yes	1.89 V	384	CMOS		182	23000	1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	384 CLBS, 23000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates = 50000	e0	357 MHz	30 s	182	225 °C (437 °F)	17 mm
XA6SLX9-2FTG256Q	Xilinx	FPGA		Ball	256	BGA	Square	Plastic	9152	Yes				AEC-Q100	186			1.2,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	125 °C (257 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3			No		e1	62.5 MHz	30 s	186	260 °C (500 °F)
XCS40-4BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	5.25 V	784	CMOS			13000	5		Grid Array			4.75 V	1.27 mm	85 °C (185 °F)	1.2 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Maximum usable gates 40000	e1	166 MHz	30 s		250 °C (482 °F)	27 mm
XCS30XL-4BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	1368	Yes	3.6 V	576	CMOS		192	10000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.1 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Maximum usable gates 30000	e1	217 MHz	30 s	192	250 °C (482 °F)	27 mm
XC3S5000-4FTG256I	Xilinx	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array, Low Profile			1.14 V	1 mm			192 CLBS, 50000 Gates		Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1		30 s		260 °C (500 °F)	17 mm
XQV100-4BGG256N	Xilinx	FPGA	Military	Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	2.625 V	600	CMOS	MIL-PRF-38535		108904	2.5		Grid Array			2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	600 CLBS, 108904 Gates	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e1		30 s		250 °C (482 °F)	27 mm
XC2VP4-5FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	6768	Yes	1.575 V	752	CMOS		140		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	752 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	1050 MHz	30 s	140	225 °C (437 °F)	17 mm
XC2VP4-8FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	752	CMOS				1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)		752 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0		30 s		225 °C (437 °F)	17 mm
XCV300E-7FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS		176	82944	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	1536 CLBS, 82944 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	400 MHz	30 s	176	225 °C (437 °F)	17 mm
XC4013XL-09CBG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	1368	Yes	3.6 V	576	CMOS		192	10000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.2 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Max usable 13000 Logic gates	e0	217 MHz	30 s	192	225 °C (437 °F)	27 mm
XC2S400E-7FT256C	Xilinx	FPGA	Commercial Extended	Ball	256	BGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	864	CMOS		410	52000	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates = 150000	e0	357 MHz	30 s	410	240 °C (464 °F)	17 mm
XS2S50-5-FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	1728	Yes			CMOS		176			1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	100 °C (212 °F)	0.7 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3		17 mm	No		e0		30 s	176	225 °C (437 °F)	17 mm
XCV50-5FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	1728	Yes	2.625 V	384	CMOS		176	57906	2.5	1.2/3.6,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm		0.7 ns	384 CLBS, 57906 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	294 MHz	30 s	176	225 °C (437 °F)	17 mm
XA3S100E-4FTG256I	Xilinx	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	2160	Yes	1.26 V	240	CMOS			100000	1.2		Grid Array, Low Profile			1.14 V	1 mm	100 °C (212 °F)	4.88 ns	240 CLBS, 100000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	572 MHz	30 s		260 °C (500 °F)	17 mm
XC7A12T-1FTG256C	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG		150		1		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.95 V	1 mm	85 °C (185 °F)	1.27 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1098 MHz	30 s	150	260 °C (500 °F)	17 mm
XCS30XL-5BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	1368	Yes	3.6 V	576	CMOS		192	10000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Maximum usable gates 30000	e1	250 MHz	30 s	192	250 °C (482 °F)	27 mm
XC2V40-4FGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	576	Yes	1.575 V	64	CMOS		88	40000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	64 CLBS, 40000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	650 MHz	30 s	88	260 °C (500 °F)	17 mm
XC2V80-5FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	1152	Yes	1.575 V	128	CMOS		120	80000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	128 CLBS, 80000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	750 MHz	30 s	120	225 °C (437 °F)	17 mm
XC2V80-5FGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	1152	Yes	1.575 V	128	CMOS		120	80000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	128 CLBS, 80000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	750 MHz	30 s	120	260 °C (500 °F)	17 mm
XCV50-4BGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	2.625 V	384	CMOS			57906	2.5		Grid Array			2.375 V	1.27 mm		0.8 ns	384 CLBS, 57906 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e1	250 MHz	30 s		250 °C (482 °F)	27 mm
XC2VP2-6FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	3168	Yes	1.575 V	352	CMOS		140		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	352 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	1200 MHz	30 s	140	260 °C (500 °F)	17 mm
XCV200E-7FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS		176	63504	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	1176 CLBS, 63504 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	400 MHz	30 s	176	260 °C (500 °F)	17 mm
XC2VP4-7FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	6768	Yes	1.575 V	752	CMOS		140		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.28 ns	752 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	1350 MHz	30 s	140	225 °C (437 °F)	17 mm
XCV50E-8FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	1728	Yes	1.89 V	384	CMOS		176	20736	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	384 CLBS, 20736 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	416 MHz	30 s	176	225 °C (437 °F)	17 mm
XA2S200E-6FT256Q	Xilinx	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS	AEC-Q100	182		1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	125 °C (257 °F)		1176 CLBS	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3			No		e0	357 MHz	30 s	182	240 °C (464 °F)
XCV100-4BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	2.625 V	600	CMOS		180	108904	2.5	1.5/3.3,2.5 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	85 °C (185 °F)	0.8 ns	600 CLBS, 108904 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0	250 MHz	30 s	180	225 °C (437 °F)	27 mm
XC2VP2-7FGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	352	CMOS				1.5		Grid Array			1.425 V	1 mm		0.28 ns	352 CLBS		Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	1350 MHz				17 mm
XC4020XL-1BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	784	Yes	3.6 V	784	CMOS		224	13000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.3 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Max usable 20000 Logic gates	e0	200 MHz	30 s	224	225 °C (437 °F)	27 mm
XCV100E-6FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS		176	32400	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	600 CLBS, 32400 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	357 MHz	30 s	176	225 °C (437 °F)	17 mm
XCS50E-6FT256I	Xilinx	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	1728	Yes	1.89 V		CMOS		182		1.8	1.8,2.5,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	100 °C (212 °F)	0.47 ns		-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3		17 mm	No		e0	357 MHz		182		17 mm
XCV200-4FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176	CMOS		176	236666	2.5	1.2/3.6,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.8 ns	1176 CLBS, 236666 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	250 MHz	30 s	176	225 °C (437 °F)	17 mm
XC6SLX25-3NFTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Low Profile			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	806 MHz				17 mm
XC2V500-4FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	6912	Yes	1.575 V	768	CMOS		172	500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	768 CLBS, 500000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	650 MHz	30 s	172	225 °C (437 °F)	17 mm
XC6SLX16-N3FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS		186		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	1139 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	806 MHz		186		17 mm
XC4028XLA-8BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	1024	CMOS			18000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)	1 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Can also use 50000 gates	e1	263 MHz				27 mm
XC7A75T-2FTG256E	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900			300		1		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.95 V	1 mm	100 °C (212 °F)	1.05 ns	5900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1286 MHz	30 s	300	260 °C (500 °F)	17 mm
XC4020XL-3BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	784	CMOS			13000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)	1.6 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Max usable 20000 Logic gates	e1	166 MHz	30 s		250 °C (482 °F)	27 mm
XCV200-5FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176	CMOS		176	236666	2.5	1.2/3.6,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm		0.7 ns	1176 CLBS, 236666 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	294 MHz	30 s	176	225 °C (437 °F)	17 mm
XC2S200E-6FTGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.89 V	864				52000	1.8		Grid Array			1.71 V	1 mm		0.47 ns	864 CLBS, 52000 Gates		Tin Silver Copper	Bottom	S-PBGA-B256		2 mm	17 mm	No	Maximum usable gates = 150000	e1	357 MHz				17 mm
XC3S4000-5FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array, Low Profile			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0					17 mm
XC3S4000-4FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array, Low Profile			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1		30 s		260 °C (500 °F)	17 mm
XC3S200A-4FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	4032	Yes	1.26 V	448	CMOS		195	200000	1.2	1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	448 CLBS, 200000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	667 MHz	30 s	160	225 °C (437 °F)	17 mm
XC7A25T-1FTG256E	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG		150		1		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.95 V	1 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1098 MHz	30 s	150	260 °C (500 °F)	17 mm
XC4013XLA-8BG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS			10000	3.3		Grid Array			3 V	1.27 mm		1 ns	576 CLBS, 10000 Gates		Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0	263 MHz				27 mm
XC2S600E-6FTGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.89 V	864				52000	1.8		Grid Array			1.71 V	1 mm		0.47 ns	864 CLBS, 52000 Gates		Tin Silver Copper	Bottom	S-PBGA-B256		2 mm	17 mm	No	Maximum usable gates = 150000	e1	357 MHz				17 mm
XQ4013XL-3BG256N	Xilinx	FPGA	Military	Ball	256	BGA	Square	Plastic/Epoxy	1368	Yes	3.6 V	576	CMOS	MIL-PRF-38535	192	10000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Typical gates = 10000 to 30000	e0	166 MHz	30 s	192	225 °C (437 °F)	27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.