256 Field Programmable Gate Arrays (FPGA) 1,886

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP3C5F256C7N	Intel	FPGA	Other	Ball	256	LBGA	Rectangular	Plastic/Epoxy	5136	Yes	1.25 V	5136	CMOS	182		1.2			Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		5136 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz		182		17 mm
10M08DAF256A7G	Intel	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	8000	Yes	1.25 V	500		250		1.2			Grid Array	BGA256,16X16,40		1.15 V	1 mm	125 °C (257 °F)		500 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm			e1			250		17 mm
APA300-FG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	8192	Yes	2.7 V		CMOS	186	300000	2.5	Tray	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.3 V	1 mm	85 °C (185 °F)		300000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e0	180 MHz	20 s	186	225 °C (437 °F)	17 mm
LCMXO3LF-6900C-5BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	858				2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		858 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
LFD2NX-40-7BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	111		1			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm			e1		30 s	111	260 °C (500 °F)	14 mm
M2GL025-VFG256I	Microchip Technology	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	27696	Yes	1.26 V			138		1.2	Tray		Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.56 mm	14 mm						138		14 mm
XC6SLX16-3FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS	186		1.2		1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	1139 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	862 MHz	30 s	186	260 °C (500 °F)	17 mm
LIFCL-40-7BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	74		1			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.7 mm	14 mm					30 s	74	260 °C (500 °F)	14 mm
EP4CE22F17C7N	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	22320	Yes	1.25 V	1395		153		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		1395 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz		153		17 mm
10M16DAF256C8G	Intel	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000		320		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		1000 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			320		17 mm
EP3C5F256I7N	Intel	FPGA	Industrial	Ball	256	LBGA	Rectangular	Plastic/Epoxy	5136	Yes	1.25 V	5136	CMOS	182		1.2			Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		5136 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz		182		17 mm
LIFCL-40-7BG256A	Lattice Semiconductor	FPGA	Automotive	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	74		1			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		.95 V	.8 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.7 mm	14 mm					30 s	74	260 °C (500 °F)	14 mm
M2GL005-1VFG256	Microchip Technology	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2	Tray		Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B256	3	1.56 mm	14 mm					30 s		260 °C (500 °F)	14 mm
LCMXO2-2000HC-4FTG256I	Lattice Semiconductor	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	2112	Yes	3.465 V			206		2.5	Tray	2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also Operates at 3.3 V nominal supply	e1	133 MHz	30 s	206	260 °C (500 °F)	17 mm
LCMXO2-4000HC-4BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	4320	Yes	3.465 V			206		2.5	Tray	2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	2.375 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
XC7A75T-1FTG256C	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900		300		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.27 ns	5900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	1098 MHz	30 s	300	260 °C (500 °F)	17 mm
A3P1000-FG256	Microchip Technology	FPGA	Commercial	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS		1000000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No			350 MHz				17 mm
A3P600-FG256	Microchip Technology	FPGA	Commercial	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	13824	CMOS		600000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		13824 CLBS, 600000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No			350 MHz				17 mm
EP1C6F256C8N	Intel	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	5980	Yes	1.575 V	598		185		1.5		1.5,1.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		598 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No		e1	275 MHz		185		17 mm
XC7A15T-2FTG256C	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300		250		1			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.95 V	1 mm	85 °C (185 °F)	1.05 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1286 MHz	30 s	250	260 °C (500 °F)	17 mm
10CL006YU256C6G	Intel	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	392				1.2			Grid Array, Low Profile, Fine Pitch			1.15 V	.8 mm	85 °C (185 °F)		392 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm								14 mm
EP2C20F256I8N	Intel	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	18752	Yes	1.25 V	1172	CMOS	152		1.2		1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm			1172 CLBS		Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also requires 3.3 V supply	e1	402.5 MHz		136		17 mm
EP4CE22U14I7N	Intel	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	22320	Yes	1.25 V			153		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm					Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.5 mm	14 mm	No		e1		30 s	153	260 °C (500 °F)	14 mm
5CEBA2F17I7N	Intel	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	25000	Yes	1.13 V		CMOS	128		1.1		1.1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.07 V	1 mm						Bottom	S-PBGA-B256		1.55 mm	17 mm	No					128		17 mm
XC3S200A-4FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	4032	Yes	1.26 V	448	CMOS	195	200000	1.2		1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	448 CLBS, 200000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	667 MHz	30 s	160	260 °C (500 °F)	17 mm
XC3S700A-4FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS	161	700000	1.2		1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	1472 CLBS, 700000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	667 MHz	30 s	148	260 °C (500 °F)	17 mm
EP2C5F256I8N	Intel	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	4608	Yes	1.25 V	288	CMOS	158		1.2		1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm			288 CLBS		Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also requires 3.3 V supply	e1			150		17 mm
EP3C25U256I7N	Intel	FPGA	Industrial	Ball	256	FBGA	Rectangular	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	156		1.2			Grid Array, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	100 °C (212 °F)		24624 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	2.2 mm	14 mm	No		e1	472.5 MHz		156		14 mm
XC3S200AN-4FT256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	4032	Yes	1.26 V	448	CMOS	195	200000	1.2		1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	448 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	667 MHz	30 s	160	240 °C (464 °F)	17 mm
LCMXO2280C-3FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	2280	Yes	3.465 V	285		211		1.8		1.8/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)		285 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No		e1		40 s	211	260 °C (500 °F)	17 mm
LCMXO2-4000HC-4BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	4320	Yes	3.465 V			206		2.5	Tray	2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	2.375 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LIFCL-17-7BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V			48		1			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.7 mm	14 mm					30 s	48	260 °C (500 °F)	14 mm
EP4CE6U14I7N	Intel	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	6272	Yes	1.25 V			179		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm						Bottom	S-PBGA-B256		1.5 mm	14 mm	No					179		14 mm
10CL016YU256A7G	Intel	FPGA	Automotive	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	963				1.2			Grid Array, Low Profile, Fine Pitch			1.15 V	.8 mm	125 °C (257 °F)		963 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm								14 mm
10M16DCF256I7G	Intel	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000		320		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		1000 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			320		17 mm
10M50DAF256C7G	Intel	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	50000	Yes	1.25 V	3125		500		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		3125 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			500		17 mm
EP4CE10F17C7N	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	10320	Yes	1.25 V	645		179		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		645 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz		179		17 mm
M2GL025-VFG256	Microchip Technology	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2	Tray		Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B256	3	1.56 mm	14 mm								14 mm
10CL010YU256C6G	Intel	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	645				1.2			Grid Array, Low Profile, Fine Pitch			1.15 V	.8 mm	85 °C (185 °F)		645 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm								14 mm
LCMXO3L-2100C-5BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	264				2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
A3P250-FGG256	Microchip Technology	FPGA	Commercial	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS		250000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		6144 CLBS, 250000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e1	350 MHz	30 s		250 °C (482 °F)	17 mm
APA300-FG256M	Microchip Technology	FPGA	Military	Ball	256	BGA	Square	Plastic/Epoxy	8192	Yes	2.7 V		CMOS	186	300000	2.5	Tray	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.3 V	1 mm	125 °C (257 °F)		300000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e0	180 MHz	20 s	186	225 °C (437 °F)	17 mm
M1A3P600-FG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	13824	CMOS		600000	1.5	Tray		Grid Array			1.425 V	1 mm	100 °C (212 °F)		13824 CLBS, 600000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No							17 mm
10M16DAF256C7G	Intel	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000		320		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		1000 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			320		17 mm
10M50DAF256C8G	Intel	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	50000	Yes	1.25 V	3125		500		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		3125 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1		30 s	500	260 °C (500 °F)	17 mm
EP3C25F256C7N	Intel	FPGA	Other	Ball	256	LBGA	Rectangular	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	156		1.2			Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		24624 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz		156		17 mm
XC3S1200E-4FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS	190	1200000	1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	2168 CLBS, 1200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	572 MHz	30 s	150	260 °C (500 °F)	17 mm
XC6SLX25-2FT256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS	186		1.2		1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	1879 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	667 MHz	30 s	186	225 °C (437 °F)	17 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.