400 Field Programmable Gate Arrays (FPGA) 186

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
LCMXO3D-9400HC-5BG400I	Lattice Semiconductor	FPGA	Industrial	Ball	400	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175			335		2.5			Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		2.375 V	.8 mm	100 °C (212 °F)	7 ns	1175 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B400		1.7 mm	17 mm		Also Operates at 3.3 V nominal supply				335		17 mm
LIFCL-40-7BG400C	Lattice Semiconductor	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI		74		1			Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B400	3	1.7 mm	17 mm					30 s	74	260 °C (500 °F)	17 mm
M2GL010T-VFG400	Microchip Technology	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	12084	Yes	1.26 V				195		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B400	3	1.51 mm	17 mm	No					195		17 mm
M2GL025T-VFG400I	Microchip Technology	FPGA	Industrial	Ball	400	LFBGA	Square	Plastic/Epoxy	27696	Yes	1.26 V		CMOS		207		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B400	3	1.51 mm	17 mm	No					207		17 mm
M2S005-1VF400	Microchip Technology	FPGA		Ball	400	LFBGA	Square	Plastic/Epoxy	6060	Yes	1.26 V				171		1.2			Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400		1.51 mm	17 mm					30 s	171	240 °C (464 °F)	17 mm
M2S005-1VFG400	Microchip Technology	FPGA		Ball	400	LFBGA	Square	Plastic/Epoxy	6060	Yes	1.26 V				171		1.2			Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.51 mm	17 mm					40 s	171	250 °C (482 °F)	17 mm
M2S005-VF400	Microchip Technology	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	4956	Yes	1.26 V		CMOS		160		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B400		1.51 mm	17 mm	No		e0		30 s	160	240 °C (464 °F)	17 mm
M2S060-VF400I	Microchip Technology	FPGA		Ball	400	LFBGA	Square	Plastic/Epoxy	56520	Yes	1.26 V				207		1.2			Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B400		1.51 mm	17 mm					30 s	207	240 °C (464 °F)	17 mm
M2S060T-1VF400I	Microchip Technology	FPGA		Ball	400	LFBGA	Square	Plastic/Epoxy	56520	Yes	1.26 V				207		1.2			Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B400		1.51 mm	17 mm					30 s	207	240 °C (464 °F)	17 mm
M2S060T-VF400	Microchip Technology	FPGA		Ball	400	LFBGA	Square	Plastic/Epoxy	56520	Yes	1.26 V				207		1.2			Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400		1.51 mm	17 mm					30 s	207	240 °C (464 °F)	17 mm
M2S060TS-VF400I	Microchip Technology	FPGA		Ball	400	LFBGA	Square	Plastic/Epoxy	56520	Yes	1.26 V				207		1.2			Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B400		1.51 mm	17 mm					30 s	207	240 °C (464 °F)	17 mm
LCMXO3D-9400HC-5BG400C	Lattice Semiconductor	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175			335		2.5			Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		2.375 V	.8 mm	85 °C (185 °F)	7 ns	1175 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B400		1.7 mm	17 mm		Also Operates at 3.3 V nominal supply				335		17 mm
LCMXO3D-9400ZC-2BG400C	Lattice Semiconductor	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175			335		2.5			Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		2.375 V	.8 mm	85 °C (185 °F)	7 ns	1175 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B400		1.7 mm	17 mm		Also Operates at 3.3 V nominal supply				335		17 mm
T35F400C4	Efinix	FPGA		Ball	400		Square	Plastic/Epoxy	31680	Yes	1.25 V		SMIC		230		1.2						1.15 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B400	3		16 mm						230	260 °C (500 °F)	16 mm
XA3S700A-4FGG400I	Xilinx	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS	AEC-Q100	311	700000	1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	4.88 ns	1472 CLBS, 700000 Gates	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	667 MHz	30 s	248	250 °C (482 °F)	21 mm
XC3S400AN-4FGG400I	Xilinx	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS		311	400000	1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	896 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	667 MHz	30 s	248	250 °C (482 °F)	21 mm
XA3S400A-4FGG400I	Xilinx	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS	AEC-Q100	311	400000	1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	4.88 ns	896 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	667 MHz	30 s	248	250 °C (482 °F)	21 mm
M2GL050-VFG400	Microchip Technology	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	56340	Yes	1.26 V				207		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B400	3	1.51 mm	17 mm	No					207		17 mm
M2S010-VFG400	Microchip Technology	FPGA		Ball	400	LFBGA	Square	Plastic/Epoxy	12084	Yes	1.26 V				195		1.2			Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.51 mm	17 mm					40 s	195	250 °C (482 °F)	17 mm
XC3S400A-4FGG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS		311	400000	1.2		1.2,2.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	896 CLBS, 400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	667 MHz	30 s	248	250 °C (482 °F)	21 mm
LCMXO3L-6900C-5BG400I	Lattice Semiconductor	FPGA		Ball	400	LFBGA	Square	Plastic/Epoxy	6900	Yes	3.465 V	858			335		2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	100 °C (212 °F)		858 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.7 mm	17 mm		Also Operates at 3.3 V nominal supply	e1		30 s	335	260 °C (500 °F)	17 mm
XA3S700A-4FGG400Q	Xilinx	FPGA	Automotive	Ball	400	BGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS	AEC-Q100	311	700000	1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)	4.88 ns	1472 CLBS, 700000 Gates	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	667 MHz	30 s	248	250 °C (482 °F)	21 mm
XC3S400AN-5FGG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS		311	400000	1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	896 CLBS, 400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	770 MHz	30 s	248	250 °C (482 °F)	21 mm
XC3S700A-4FG400I	Xilinx	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS		311	700000	1.2		1.2,2.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	1472 CLBS, 700000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e0	667 MHz	30 s	248	225 °C (437 °F)	21 mm
XC3S700A-4FGG400I	Xilinx	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS		311	700000	1.2		1.2,2.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	1472 CLBS, 700000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	667 MHz	30 s	248	250 °C (482 °F)	21 mm
M2S025-VFG400I	Microchip Technology	FPGA		Ball	400	LFBGA	Square	Plastic/Epoxy	27696	Yes	1.26 V				207		1.2			Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.51 mm	17 mm					40 s	207	250 °C (482 °F)	17 mm
M2GL010-VFG400	Microchip Technology	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	12084	Yes	1.26 V				195		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B400	3	1.51 mm	17 mm	No					195		17 mm
M2GL010-VFG400I	Microchip Technology	FPGA	Industrial	Ball	400	LFBGA	Square	Plastic/Epoxy	12084	Yes	1.26 V		CMOS		195		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B400	3	1.51 mm	17 mm	No					195		17 mm
M2GL025T-VF400	Microchip Technology	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	27696	Yes	1.26 V				207		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B400		1.51 mm	17 mm	No				20 s	207	240 °C (464 °F)	17 mm
M2S025T-1VF400I	Microchip Technology	FPGA		Ball	400	LFBGA	Square	Plastic/Epoxy	27696	Yes	1.26 V				207		1.2			Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B400		1.51 mm	17 mm					30 s	207	240 °C (464 °F)	17 mm
XC3S50AN-4FG400I	Xilinx	FPGA		Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.26 V	176	CMOS			50000	1.2			Grid Array			1.14 V	1 mm		4.88 ns	176 CLBS, 50000 Gates		Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e0	667 MHz	30 s		225 °C (437 °F)	21 mm
XC3S1200E-4FG400CS1	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS		304	1200000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	2168 CLBS, 1200000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e0	572 MHz	30 s	232	225 °C (437 °F)	21 mm
XC3S200AN-5FG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.26 V	448	CMOS			200000	1.2			Grid Array			1.14 V	1 mm	85 °C (185 °F)	4.36 ns	448 CLBS, 200000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e0	770 MHz	30 s		225 °C (437 °F)	21 mm
XC3S1400AN-5FG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.26 V	2816	CMOS			1400000	1.2			Grid Array			1.14 V	1 mm	85 °C (185 °F)	4.36 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e0	770 MHz	30 s		225 °C (437 °F)	21 mm
XC3S1200E-4FGG400I	Xilinx	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS		304	1200000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	2168 CLBS, 1200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	572 MHz	30 s	132	250 °C (482 °F)	21 mm
XC3S700AN-5FGG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.26 V	1472	CMOS			700000	1.2			Grid Array			1.14 V	1 mm	85 °C (185 °F)	4.36 ns	1472 CLBS, 700000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	770 MHz				21 mm
XA3S400A-4FGG400Q	Xilinx	FPGA	Automotive	Ball	400	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS	AEC-Q100	311	400000	1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)	4.88 ns	896 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	667 MHz	30 s	248	250 °C (482 °F)	21 mm
XC3S700A-4FG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS		311	700000	1.2		1.2,2.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	1472 CLBS, 700000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e0	667 MHz	30 s	248	225 °C (437 °F)	21 mm
XC3S50AN-5FGG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.26 V	176	CMOS			50000	1.2			Grid Array			1.14 V	1 mm	85 °C (185 °F)	4.36 ns	176 CLBS, 50000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	770 MHz	30 s		250 °C (482 °F)	21 mm
XC3S1400AN-4FG400I	Xilinx	FPGA		Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.26 V	2816	CMOS			1400000	1.2			Grid Array			1.14 V	1 mm		4.88 ns	2816 CLBS, 1400000 Gates		Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e0	667 MHz	30 s		225 °C (437 °F)	21 mm
XA3S1400A-4FGG400I	Xilinx	FPGA		Ball	400	BGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS			1400000	1.2			Grid Array			1.14 V	1 mm	100 °C (212 °F)	4.88 ns	2816 CLBS, 1400000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	667 MHz	30 s		250 °C (482 °F)	21 mm
XC3S400AN-4FG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS		311	400000	1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	896 CLBS, 400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e0	667 MHz		248		21 mm
XA3S100E-4FGG400I	Xilinx	FPGA		Ball	400	BGA	Square	Plastic/Epoxy	2160	Yes	1.26 V	240	CMOS			100000	1.2			Grid Array			1.14 V	1 mm	100 °C (212 °F)	4.88 ns	240 CLBS, 100000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	572 MHz	30 s		250 °C (482 °F)	21 mm
XC3S400A-4FGG400I	Xilinx	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS		311	400000	1.2		1.2,2.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	896 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	667 MHz	30 s	248	250 °C (482 °F)	21 mm
XC3S50AN-4FG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.26 V	176	CMOS			50000	1.2			Grid Array			1.14 V	1 mm	85 °C (185 °F)	4.88 ns	176 CLBS, 50000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e0	667 MHz	30 s		225 °C (437 °F)	21 mm
XC3S200AN-4FGG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.26 V	448	CMOS			200000	1.2			Grid Array			1.14 V	1 mm	85 °C (185 °F)	4.88 ns	448 CLBS, 200000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	667 MHz				21 mm
XC7Z010-L2CLG400I	Xilinx	FPGA SOC		Ball	400	LFBGA	Square	Plastic/Epoxy	28000	Yes	1.05 V	2200			230	430000	1			Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		.95 V	.8 mm	100 °C (212 °F)	1.05 ns	2200 CLBS, 430000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.6 mm	17 mm			e1		30 s	230	260 °C (500 °F)	17 mm
XA3S100E-4FGG400Q	Xilinx	FPGA	Automotive	Ball	400	BGA	Square	Plastic/Epoxy	2160	Yes	1.26 V	240	CMOS			100000	1.2			Grid Array			1.14 V	1 mm	125 °C (257 °F)	4.88 ns	240 CLBS, 100000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	572 MHz	30 s		250 °C (482 °F)	21 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.