400 Field Programmable Gate Arrays (FPGA) 186

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3S200AN-4FG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.26 V	448	CMOS			200000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)	4.88 ns	448 CLBS, 200000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e0	667 MHz	30 s		225 °C (437 °F)	21 mm
XC3S50AN-5FG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.26 V	176	CMOS			50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)	4.36 ns	176 CLBS, 50000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e0	770 MHz	30 s		225 °C (437 °F)	21 mm
XC3S400A-4FG400I	Xilinx	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS		311	400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	896 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e0	667 MHz	30 s	248	225 °C (437 °F)	21 mm
XC3S1600E-4FG400CS1	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS		304	1600000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	3688 CLBS, 1600000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e0	572 MHz	30 s	232	225 °C (437 °F)	21 mm
XC3S1400AN-5FGG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.26 V	2816	CMOS			1400000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)	4.36 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e1	770 MHz	30 s		250 °C (482 °F)	21 mm
XC3S1600E-4FG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS		304	1600000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	3688 CLBS, 1600000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e0	572 MHz	30 s	232	225 °C (437 °F)	21 mm
XC7Z020-1CLG400E	Xilinx	FPGA SOC		Ball	400	LFBGA	Square	Plastic/Epoxy	85000	Yes	1.05 V	6650			255	1300000	1		Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		.95 V	.8 mm	100 °C (212 °F)	1.27 ns	6650 CLBS, 1300000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.6 mm	17 mm		e1		30 s	255	260 °C (500 °F)	17 mm
XC3S1200E-5FGG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS		304	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.66 ns	2168 CLBS, 1200000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e1	657 MHz	30 s	132	250 °C (482 °F)	21 mm
XA3S500E-4FGG400I	Xilinx	FPGA		Ball	400	BGA	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS			500000	1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)	4.88 ns	1164 CLBS, 500000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e1	572 MHz	30 s		250 °C (482 °F)	21 mm
XC3S400AN-5FG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS		311	400000	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	896 CLBS, 400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e0	770 MHz		248		21 mm
XC3S1400AN-4FG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.26 V	2816	CMOS			1400000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)	4.88 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e0	667 MHz	30 s		225 °C (437 °F)	21 mm
XC3S1200E-5FG400CS1	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS		304	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.66 ns	2168 CLBS, 1200000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e0	657 MHz	30 s	232	225 °C (437 °F)	21 mm
XC7Z020-2CLG400C	Xilinx	FPGA SOC		Ball	400	LFBGA	Square	Plastic/Epoxy	85000	Yes	1.05 V	6650			255	1300000	1		Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		.95 V	.8 mm	85 °C (185 °F)	1.05 ns	6650 CLBS, 1300000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.6 mm	17 mm		e1		30 s	255	260 °C (500 °F)	17 mm
XC3S400A-5FGG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS		311	400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	896 CLBS, 400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e1	770 MHz	30 s	248	250 °C (482 °F)	21 mm
XC3S700AN-4FGG400I	Xilinx	FPGA		Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.26 V	1472	CMOS			700000	1.2		Grid Array			1.14 V	1 mm		4.88 ns	1472 CLBS, 700000 Gates		Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e1	667 MHz				21 mm
XC3S200AN-4FG400I	Xilinx	FPGA		Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.26 V	448	CMOS			200000	1.2		Grid Array			1.14 V	1 mm		4.88 ns	448 CLBS, 200000 Gates		Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e0	667 MHz	30 s		225 °C (437 °F)	21 mm
XC3S1600E-5FG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS		304	1600000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.66 ns	3688 CLBS, 1600000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e0	657 MHz	30 s	132	225 °C (437 °F)	21 mm
XC3S1600E-4FG400IS1	Xilinx	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS		304	1600000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	3688 CLBS, 1600000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e0	572 MHz	30 s	232	225 °C (437 °F)	21 mm
XC3S400A-5FG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS		311	400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	896 CLBS, 400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e0	770 MHz	30 s	248	225 °C (437 °F)	21 mm
XC7Z020-3CLG400I	Xilinx	FPGA SOC		Ball	400	LFBGA	Square	Plastic/Epoxy	85000	Yes	1.05 V	6650			255	1300000	1		Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		.95 V	.8 mm	100 °C (212 °F)	0.94 ns	6650 CLBS, 1300000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.6 mm	17 mm		e1		30 s	255	260 °C (500 °F)	17 mm
XC3S1200E-5FG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS		304	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.66 ns	2168 CLBS, 1200000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e0	657 MHz	30 s	132	225 °C (437 °F)	21 mm
XC3S1200E-4FG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS		304	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	2168 CLBS, 1200000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e0	572 MHz	30 s	232	225 °C (437 °F)	21 mm
XA3S1200E-4FGG400Q	Xilinx	FPGA	Automotive	Ball	400	BGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS	AEC-Q100	304	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)	4.88 ns	2168 CLBS, 1200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e1	572 MHz	30 s	232	250 °C (482 °F)	21 mm
XC3S1200E-5FGG400CS1	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS		304	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.66 ns	2168 CLBS, 1200000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e1	657 MHz	30 s	232	250 °C (482 °F)	21 mm
XC3S50AN-4FG400I	Xilinx	FPGA		Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.26 V	176	CMOS			50000	1.2		Grid Array			1.14 V	1 mm		4.88 ns	176 CLBS, 50000 Gates		Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e0	667 MHz	30 s		225 °C (437 °F)	21 mm
XC3S1200E-4FG400CS1	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS		304	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	2168 CLBS, 1200000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e0	572 MHz	30 s	232	225 °C (437 °F)	21 mm
XC7Z010-3CLG400C	Xilinx	FPGA SOC		Ball	400	LFBGA	Square	Plastic/Epoxy	28000	Yes	1.05 V	2200			230	430000	1		Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		.95 V	.8 mm	85 °C (185 °F)	0.94 ns	2200 CLBS, 430000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.6 mm	17 mm		e1		30 s	230	260 °C (500 °F)	17 mm
XA3S200A-4FGG400I	Xilinx	FPGA		Ball	400	BGA	Square	Plastic/Epoxy	4032	Yes	1.26 V	448	CMOS			200000	1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)	4.88 ns	448 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e1	667 MHz	30 s		250 °C (482 °F)	21 mm
XA3S1600E-4FGG400Q	Xilinx	FPGA	Automotive	Ball	400	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS	AEC-Q100	304	1600000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)	4.88 ns	3688 CLBS, 1600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e1	572 MHz	30 s	232	250 °C (482 °F)	21 mm
XC3S700AN-4FG400I	Xilinx	FPGA		Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.26 V	1472	CMOS			700000	1.2		Grid Array			1.14 V	1 mm		4.88 ns	1472 CLBS, 700000 Gates		Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e0	667 MHz	30 s		225 °C (437 °F)	21 mm
XC7Z010-3CLG400I	Xilinx	FPGA SOC		Ball	400	LFBGA	Square	Plastic/Epoxy	28000	Yes	1.05 V	2200			230	430000	1		Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		.95 V	.8 mm	100 °C (212 °F)	0.94 ns	2200 CLBS, 430000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.6 mm	17 mm		e1		30 s	230	260 °C (500 °F)	17 mm
XC7Z010-L2CLG400I	Xilinx	FPGA SOC		Ball	400	LFBGA	Square	Plastic/Epoxy	28000	Yes	1.05 V	2200			230	430000	1		Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		.95 V	.8 mm	100 °C (212 °F)	1.05 ns	2200 CLBS, 430000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.6 mm	17 mm		e1		30 s	230	260 °C (500 °F)	17 mm
XA3S100E-4FGG400Q	Xilinx	FPGA	Automotive	Ball	400	BGA	Square	Plastic/Epoxy	2160	Yes	1.26 V	240	CMOS			100000	1.2		Grid Array			1.14 V	1 mm	125 °C (257 °F)	4.88 ns	240 CLBS, 100000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e1	572 MHz	30 s		250 °C (482 °F)	21 mm
XC3S1200E-4FG400IS1	Xilinx	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS		304	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	2168 CLBS, 1200000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e0	572 MHz	30 s	232	225 °C (437 °F)	21 mm
XC3S1400AN-4FG400I	Xilinx	FPGA		Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.26 V	2816	CMOS			1400000	1.2		Grid Array			1.14 V	1 mm		4.88 ns	2816 CLBS, 1400000 Gates		Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e0	667 MHz	30 s		225 °C (437 °F)	21 mm
XA3S1400A-4FGG400I	Xilinx	FPGA		Ball	400	BGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS			1400000	1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)	4.88 ns	2816 CLBS, 1400000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e1	667 MHz	30 s		250 °C (482 °F)	21 mm
XC3S1200E-4FGG400IS1	Xilinx	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS		304	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	2168 CLBS, 1200000 Gates	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e1	572 MHz	30 s	232	250 °C (482 °F)	21 mm
XC3S1200E-4FG400I	Xilinx	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS		304	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	2168 CLBS, 1200000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e0	572 MHz	30 s	132	225 °C (437 °F)	21 mm
XC3S700AN-4FGG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.26 V	1472	CMOS			700000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)	4.88 ns	1472 CLBS, 700000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e1	667 MHz				21 mm
XC7Z010-2CLG400C	Xilinx	FPGA SOC		Ball	400	LFBGA	Square	Plastic/Epoxy	28000	Yes	1.05 V	2200			230	430000	1		Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		.95 V	.8 mm	85 °C (185 °F)	1.05 ns	2200 CLBS, 430000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.6 mm	17 mm		e1		30 s	230	260 °C (500 °F)	17 mm
XA3S200A-4FGG400Q	Xilinx	FPGA	Automotive	Ball	400	BGA	Square	Plastic/Epoxy	4032	Yes	1.26 V	448	CMOS			200000	1.2		Grid Array			1.14 V	1 mm	125 °C (257 °F)	4.88 ns	448 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e1	667 MHz	30 s		250 °C (482 °F)	21 mm
XC3S200AN-5FGG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.26 V	448	CMOS			200000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)	4.36 ns	448 CLBS, 200000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e1	770 MHz	30 s		250 °C (482 °F)	21 mm
XC7Z020-L2CLG400I	Xilinx	FPGA SOC		Ball	400	LFBGA	Square	Plastic/Epoxy	85000	Yes	1.05 V	6650			255	1300000	1		Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		.95 V	.8 mm	100 °C (212 °F)	1.05 ns	6650 CLBS, 1300000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.6 mm	17 mm		e1		30 s	255	260 °C (500 °F)	17 mm
XC3S400A-4FG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS		311	400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	896 CLBS, 400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e0	667 MHz	30 s	248	225 °C (437 °F)	21 mm
XC3S1600E-5FGG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS		304	1600000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.66 ns	3688 CLBS, 1600000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e1	657 MHz	30 s	132	250 °C (482 °F)	21 mm
XC3S1600E-4FG400I	Xilinx	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS		304	1600000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	3688 CLBS, 1600000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e0	572 MHz	30 s	132	225 °C (437 °F)	21 mm
XC3S700A-4FG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS		311	700000	1.2	1.2,2.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	1472 CLBS, 700000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e0	667 MHz	30 s	248	225 °C (437 °F)	21 mm
XC3S50AN-5FGG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.26 V	176	CMOS			50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)	4.36 ns	176 CLBS, 50000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e1	770 MHz	30 s		250 °C (482 °F)	21 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.