400 Field Programmable Gate Arrays (FPGA) 186

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3S200AN-4FG400I	Xilinx	FPGA		Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.26 V	448	CMOS			200000	1.2		Grid Array			1.14 V	1 mm		4.88 ns	448 CLBS, 200000 Gates		Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e0	667 MHz	30 s		225 °C (437 °F)	21 mm
XC3S1600E-5FG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS		304	1600000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.66 ns	3688 CLBS, 1600000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e0	657 MHz	30 s	132	225 °C (437 °F)	21 mm
XC3S1600E-4FG400IS1	Xilinx	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS		304	1600000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	3688 CLBS, 1600000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e0	572 MHz	30 s	232	225 °C (437 °F)	21 mm
XC3S400A-5FG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS		311	400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	896 CLBS, 400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e0	770 MHz	30 s	248	225 °C (437 °F)	21 mm
XC7Z020-3CLG400I	Xilinx	FPGA SOC		Ball	400	LFBGA	Square	Plastic/Epoxy	85000	Yes	1.05 V	6650			255	1300000	1		Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		.95 V	.8 mm	100 °C (212 °F)	0.94 ns	6650 CLBS, 1300000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.6 mm	17 mm		e1		30 s	255	260 °C (500 °F)	17 mm
XC3S1200E-5FG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS		304	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.66 ns	2168 CLBS, 1200000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e0	657 MHz	30 s	132	225 °C (437 °F)	21 mm
XC3S1200E-4FG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS		304	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	2168 CLBS, 1200000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e0	572 MHz	30 s	232	225 °C (437 °F)	21 mm
XC3S1200E-5FGG400CS1	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS		304	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.66 ns	2168 CLBS, 1200000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e1	657 MHz	30 s	232	250 °C (482 °F)	21 mm
XA3S1200E-4FGG400Q	Xilinx	FPGA	Automotive	Ball	400	BGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS	AEC-Q100	304	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)	4.88 ns	2168 CLBS, 1200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e1	572 MHz	30 s	232	250 °C (482 °F)	21 mm
XC3S1200E-4FGG400IS1	Xilinx	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS		304	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	2168 CLBS, 1200000 Gates	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e1	572 MHz	30 s	232	250 °C (482 °F)	21 mm
XC3S1200E-4FG400I	Xilinx	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS		304	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	2168 CLBS, 1200000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e0	572 MHz	30 s	132	225 °C (437 °F)	21 mm
EP1C4F400I6ES	Altera	FPGA		Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.575 V	4000					1.5		Grid Array			1.425 V	1 mm			4000 CLBS		Tin Lead	Bottom	S-PBGA-B400		2.2 mm	21 mm	No	e0	405 MHz				21 mm
EP1C20F400I6ES	Altera	FPGA		Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.575 V	20060					1.5		Grid Array			1.425 V	1 mm			20060 CLBS		Tin Lead	Bottom	S-PBGA-B400		2.2 mm	21 mm	No	e0	405 MHz				21 mm
EP1C20F400C7ES	Altera	FPGA		Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.575 V	20060					1.5		Grid Array			1.425 V	1 mm			20060 CLBS		Tin Lead	Bottom	S-PBGA-B400		2.2 mm	21 mm	No	e0	320 MHz				21 mm
EP1C20F400I8	Altera	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	20060	Yes	1.575 V	2006			301		1.5	1.5,1.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)		2006 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.2 mm	21 mm	No	e0	275 MHz		301	220 °C (428 °F)	21 mm
EP1C4F400I6	Altera	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	4000	Yes	1.575 V	400			301		1.5	1.5,1.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)		400 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.2 mm	21 mm	No	e0	405 MHz		301	220 °C (428 °F)	21 mm
EP1C4F400I8	Altera	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	4000	Yes	1.575 V	400			301		1.5	1.5,1.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)		400 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.2 mm	21 mm	No	e0	275 MHz		301	220 °C (428 °F)	21 mm
EP1C20F400C7	Altera	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	20060	Yes	1.575 V	2006			301		1.5	1.5,1.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		2006 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.2 mm	21 mm	No	e0	320 MHz	20 s	301	220 °C (428 °F)	21 mm
EP1C4F400I7ES	Altera	FPGA		Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.575 V	4000					1.5		Grid Array			1.425 V	1 mm			4000 CLBS		Tin Lead	Bottom	S-PBGA-B400		2.2 mm	21 mm	No	e0	320 MHz				21 mm
EP1C4F400C7	Altera	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	4000	Yes	1.575 V	400			301		1.5	1.5,1.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		400 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.2 mm	21 mm	No	e0	320 MHz	20 s	301	220 °C (428 °F)	21 mm
EP1C20F400I6	Altera	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	20060	Yes	1.575 V	2006			301		1.5	1.5,1.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)		2006 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.2 mm	21 mm	No	e0	405 MHz		301	220 °C (428 °F)	21 mm
EP1C4F400C6	Altera	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	4000	Yes	1.575 V	400			301		1.5	1.5,1.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		400 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.2 mm	21 mm	No	e0	405 MHz	20 s	301	220 °C (428 °F)	21 mm
EP1C4F400C6ES	Altera	FPGA		Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.575 V	4000					1.5		Grid Array			1.425 V	1 mm			4000 CLBS		Tin Lead	Bottom	S-PBGA-B400		2.2 mm	21 mm	No	e0	405 MHz				21 mm
EP1C20F400C8ES	Altera	FPGA		Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.575 V	20060					1.5		Grid Array			1.425 V	1 mm			20060 CLBS		Tin Lead	Bottom	S-PBGA-B400		2.2 mm	21 mm	No	e0	275 MHz				21 mm
EP1C4F400C6N	Altera	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	4000	Yes	1.575 V	400			301		1.5	1.5,1.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		400 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.2 mm	21 mm	No	e1	405 MHz	30 s	301	260 °C (500 °F)	21 mm
EP1C4F400C8ES	Altera	FPGA		Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.575 V	4000					1.5		Grid Array			1.425 V	1 mm			4000 CLBS		Tin Lead	Bottom	S-PBGA-B400		2.2 mm	21 mm	No	e0	275 MHz				21 mm
EP1C4F400C7N	Altera	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	4000	Yes	1.575 V	400			301		1.5	1.5,1.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		400 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.2 mm	21 mm	No	e1	320 MHz	30 s	301	260 °C (500 °F)	21 mm
EP1C4F400I8ES	Altera	FPGA		Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.575 V	4000					1.5		Grid Array			1.425 V	1 mm			4000 CLBS		Tin Lead	Bottom	S-PBGA-B400		2.2 mm	21 mm	No	e0	275 MHz				21 mm
EP1C20F400C8N	Altera	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	20060	Yes	1.575 V	2006			301		1.5	1.5,1.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		2006 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.2 mm	21 mm	No	e1	275 MHz	30 s	301	260 °C (500 °F)	21 mm
EP1C4F400I7	Altera	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	4000	Yes	1.575 V	400			301		1.5	1.5,1.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)		400 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.2 mm	21 mm	No	e0	320 MHz	20 s	301	220 °C (428 °F)	21 mm
EP1C20F400I8ES	Altera	FPGA		Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.575 V	20060					1.5		Grid Array			1.425 V	1 mm			20060 CLBS		Tin Lead	Bottom	S-PBGA-B400		2.2 mm	21 mm	No	e0	275 MHz				21 mm
EP1C4F400C8	Altera	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	4000	Yes	1.575 V	400			301		1.5	1.5,1.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		400 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.2 mm	21 mm	No	e0	275 MHz	20 s	301	220 °C (428 °F)	21 mm
EP1C20F400I7	Altera	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	20060	Yes	1.575 V	2006			301		1.5	1.5,1.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)		2006 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.2 mm	21 mm	No	e0	320 MHz	20 s	301	220 °C (428 °F)	21 mm
EP1C20F400I7ES	Altera	FPGA		Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.575 V	20060					1.5		Grid Array			1.425 V	1 mm			20060 CLBS		Tin Lead	Bottom	S-PBGA-B400		2.2 mm	21 mm	No	e0	320 MHz				21 mm
EP1C20F400C7N	Altera	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	20060	Yes	1.575 V	2006			301		1.5	1.5,1.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		2006 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.2 mm	21 mm	No	e1	320 MHz	30 s	301	260 °C (500 °F)	21 mm
EP1C20F400C6N	Altera	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	20060	Yes	1.575 V	2006			301		1.5	1.5,1.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		2006 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.2 mm	21 mm	No	e1	405 MHz	30 s	301	260 °C (500 °F)	21 mm
EP1C20F400C6ES	Altera	FPGA		Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.575 V	20060					1.5		Grid Array			1.425 V	1 mm			20060 CLBS		Tin Lead	Bottom	S-PBGA-B400		2.2 mm	21 mm	No	e0	405 MHz				21 mm
EP1C4F400C7ES	Altera	FPGA		Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.575 V	4000					1.5		Grid Array			1.425 V	1 mm			4000 CLBS		Tin Lead	Bottom	S-PBGA-B400		2.2 mm	21 mm	No	e0	320 MHz				21 mm
EP1C20F400C6	Altera	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	20060	Yes	1.575 V	2006			301		1.5	1.5,1.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		2006 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.2 mm	21 mm	No	e0	405 MHz	20 s	301	220 °C (428 °F)	21 mm
EP1C4F400I7N	Altera	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	4000	Yes	1.575 V	400			301		1.5	1.5,1.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)		400 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.2 mm	21 mm	No	e1	320 MHz	30 s	301	260 °C (500 °F)	21 mm
EP1C20F400I7N	Altera	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	20060	Yes	1.575 V	2006			301		1.5	1.5,1.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)		2006 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.2 mm	21 mm	No	e1	320 MHz	30 s	301	260 °C (500 °F)	21 mm
EP1C20F400C8	Altera	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	20060	Yes	1.575 V	2006			301		1.5	1.5,1.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		2006 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.2 mm	21 mm	No	e0	275 MHz	20 s	301	220 °C (428 °F)	21 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.