48 Field Programmable Gate Arrays (FPGA) 24

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
LCMXO2-640HC-4SG48I	Lattice Semiconductor	FPGA		No Lead	48	HVQCCN	Square		640	Yes	3.6 V	80		40		2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC48,.27SQ,20		2.375 V	.5 mm	100 °C (212 °F)		80 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N48	3	1 mm	7 mm		Also Operates at 3.3 V nominal supply				40	260 °C (500 °F)	7 mm
ICE40UP5K-SG48I	Lattice Semiconductor	FPGA		No Lead	48	HVQCCN	Square		5280	Yes	1.26 V	660	CMOS	39		1.2	Tape and Reel		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC48,.24SQ,20		1.14 V	.5 mm	100 °C (212 °F)		660 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N48	3	1 mm	7 mm					30 s	39	260 °C (500 °F)	7 mm
ICE40UP5K-SG48ITR50	Lattice Semiconductor	FPGA		No Lead	48	HVQCCN	Square		5280	Yes	1.26 V	660	CMOS	39		1.2	Tape and Reel		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC48,.24SQ,20		1.14 V	.5 mm	100 °C (212 °F)		660 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N48	3	1 mm	7 mm					30 s	39	260 °C (500 °F)	7 mm
ICE40UP5K-SG48ITR	Lattice Semiconductor	FPGA		No Lead	48	HVQCCN	Square		5280	Yes	1.26 V	660	CMOS	39		1.2	Tape and Reel		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC48,.24SQ,20		1.14 V	.5 mm	100 °C (212 °F)		660 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N48	3	1 mm	7 mm					30 s	39	260 °C (500 °F)	7 mm
LCMXO2-640HC-4SG48C	Lattice Semiconductor	FPGA		No Lead	48	HVQCCN	Square		640	Yes	3.6 V	80		40		2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC48,.27SQ,20		2.375 V	.5 mm	85 °C (185 °F)		80 CLBS	0 °C (32 °F)		Quad	S-XQCC-N48	3	1 mm	7 mm		Also Operates at 3.3 V nominal supply				40	260 °C (500 °F)	7 mm
LCMXO2-256HC-4SG48C	Lattice Semiconductor	FPGA		No Lead	48	HVQCCN	Square		256	Yes	3.6 V	32		40		2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC48,.27SQ,20		2.375 V	.5 mm	85 °C (185 °F)		32 CLBS	0 °C (32 °F)		Quad	S-XQCC-N48	3	1 mm	7 mm		Also Operates at 3.3 V nominal supply				40	260 °C (500 °F)	7 mm
LCMXO2-256HC-4SG48I	Lattice Semiconductor	FPGA		No Lead	48	HVQCCN	Square		256	Yes	3.6 V	32		40		2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC48,.27SQ,20		2.375 V	.5 mm	100 °C (212 °F)		32 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N48	3	1 mm	7 mm		Also Operates at 3.3 V nominal supply				40	260 °C (500 °F)	7 mm
A3P030-QNG48I	Microchip Technology	FPGA	Industrial	No Lead	48	HQCCN	Square			Yes	1.575 V	768	CMOS		30000	1.5			Chip Carrier, Heat Sink/Slug			1.425 V	.4 mm	100 °C (212 °F)		768 CLBS, 30000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-XQCC-N48	3		6 mm	No		e3		30 s		260 °C (500 °F)	6 mm
AGLN010V2-QNG48I	Microchip Technology	FPGA	Industrial	No Lead	48	HVQCCN	Square			Yes	1.575 V	260	CMOS		10000	1.2			Chip Carrier, Heat Sink/Slug, Very Thin Profile			1.14 V	.4 mm	85 °C (185 °F)		260 CLBS, 10000 Gates	-40 °C (-40 °F)		Quad	S-XQCC-N48	3	1 mm	6 mm	No							6 mm
A3PN010-QNG48I	Microchip Technology	FPGA	Industrial	No Lead	48	HVQCCN	Square		260	Yes	1.575 V		CMOS	34	10000	1.5			Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC48,.24SQ,16		1.425 V	.4 mm	100 °C (212 °F)		10000 Gates	-40 °C (-40 °F)		Quad	S-XQCC-N48	3	1 mm	6 mm	No					34		6 mm
A3PN010-QNG48	Microchip Technology	FPGA	Other	No Lead	48	HVQCCN	Square		260	Yes	1.575 V		CMOS	34	10000	1.5			Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC48,.24SQ,16		1.425 V	.4 mm	85 °C (185 °F)		10000 Gates	-20 °C (-4 °F)		Quad	S-XQCC-N48	3	1 mm	6 mm	No					34		6 mm
A3PN010-1QNG48I	Microchip Technology	FPGA	Industrial	No Lead	48	HQCCN	Square			Yes	1.575 V	260	CMOS		10000	1.5	Tray		Chip Carrier, Heat Sink/Slug			1.425 V	.4 mm	85 °C (185 °F)		260 CLBS, 10000 Gates	-40 °C (-40 °F)		Quad	S-XQCC-N48	3		6 mm	No							6 mm
AGLN010V2-QNG48	Microchip Technology	FPGA	Other	No Lead	48	HVQCCN	Square			Yes	1.575 V	260	CMOS		10000	1.2			Chip Carrier, Heat Sink/Slug, Very Thin Profile			1.14 V	.4 mm	70 °C (158 °F)		260 CLBS, 10000 Gates	-20 °C (-4 °F)	Matte Tin	Quad	S-XQCC-N48	3	1 mm	6 mm	No		e3		30 s		260 °C (500 °F)	6 mm
A3P030-1QNG48	Microchip Technology	FPGA	Commercial	No Lead	48	HQCCN	Square			Yes	1.575 V	768	CMOS		30000	1.5	Tray		Chip Carrier, Heat Sink/Slug			1.425 V	.4 mm	85 °C (185 °F)		768 CLBS, 30000 Gates	0 °C (32 °F)		Quad	S-XQCC-N48	3		6 mm	No			350 MHz				6 mm
LCMXO2-640HC-6SG48C	Lattice Semiconductor	FPGA		No Lead	48	HVQCCN	Square		640	Yes	3.6 V	80		40		2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC48,.27SQ,20		2.375 V	.5 mm	85 °C (185 °F)		80 CLBS	0 °C (32 °F)		Quad	S-XQCC-N48	3	1 mm	7 mm		Also Operates at 3.3 V nominal supply				40	260 °C (500 °F)	7 mm
A3P030-QNG48	Microchip Technology	FPGA	Commercial	No Lead	48	HQCCN	Square			Yes	1.575 V	768	CMOS		30000	1.5			Chip Carrier, Heat Sink/Slug			1.425 V	.4 mm	85 °C (185 °F)		768 CLBS, 30000 Gates	0 °C (32 °F)		Quad	S-XQCC-N48	3		6 mm	No			350 MHz				6 mm
LCMXO2-256HC-6SG48C	Lattice Semiconductor	FPGA		No Lead	48	HVQCCN	Square		256	Yes	3.6 V	32		40		2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC48,.27SQ,20		2.375 V	.5 mm	85 °C (185 °F)		32 CLBS	0 °C (32 °F)		Quad	S-XQCC-N48	3	1 mm	7 mm		Also Operates at 3.3 V nominal supply				40	260 °C (500 °F)	7 mm
LCMXO2-640HC-6SG48I	Lattice Semiconductor	FPGA		No Lead	48	HVQCCN	Square		640	Yes	3.6 V	80		40		2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC48,.27SQ,20		2.375 V	.5 mm	100 °C (212 °F)		80 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N48	3	1 mm	7 mm		Also Operates at 3.3 V nominal supply				40	260 °C (500 °F)	7 mm
XC2064-33CD48I	Xilinx	FPGA	Industrial	Through-Hole	48	DIP	Rectangular	Ceramic	64	No			CMOS	40		5		5 V	In-Line	DIP48,.6	Field Programmable Gate Arrays		2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)		Dual	R-XDIP-T48				No			33 MHz		40
XC2064-50CD48I	Xilinx	FPGA	Industrial	Through-Hole	48	DIP	Rectangular	Ceramic, Metal-Sealed Cofired	64	No	5.5 V	64	CMOS	40	1200	5		5 V	In-Line	DIP48,.6	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	15 ns	64 CLBS, 1200 Gates	-40 °C (-40 °F)	Tin Lead	Dual	R-CDIP-T48	1	9.271 mm	15.24 mm	No	MAX 40 I/OS; 122 flip-flops	e0	50 MHz		40		60.96 mm
XC2064-33PD48C	Xilinx	FPGA	Commercial	Through-Hole	48	DIP	Rectangular	Plastic/Epoxy	64	No			CMOS	40		5		5 V	In-Line	DIP48,.6	Field Programmable Gate Arrays		2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T48				No			33 MHz		40
XC2064-33CD48M	Xilinx	FPGA	Military	Through-Hole	48	DIP	Rectangular	Ceramic	64	No			CMOS	40		5		5 V	In-Line	DIP48,.6	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T48				No			33 MHz		40
XC2064-70PD48C	Xilinx	FPGA	Commercial	Through-Hole	48	DIP	Rectangular	Plastic	64	No			CMOS	40		5		5 V	In-Line	DIP48,.6	Field Programmable Gate Arrays		2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T48				No			70 MHz		40
XC2064-50PD48C	Xilinx	FPGA	Commercial	Through-Hole	48	DIP	Rectangular	Plastic/Epoxy	64	No	5.25 V	64	CMOS	40	600	5		5 V	In-Line	DIP48,.6	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	15 ns	64 CLBS, 600 Gates	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T48	1	4.826 mm	15.24 mm	No	MAX 58 I/OS; 122 flip-flops; typical gates = 600 - 1000	e0	50 MHz		40		61.7855 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.