68 Field Programmable Gate Arrays (FPGA) 180

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
A40MX04-PLG68I	Microchip Technology	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	547	CMOS			6000	3.3	Tube		Chip Carrier			3 V	1.27 mm	85 °C (185 °F)	2.7 ns	547 CLBS, 6000 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J68	3	4.572 mm	24.2316 mm	No	Also Operates at 5 V supply		80 MHz				24.2316 mm
A40MX04-PL68I	Microchip Technology	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	547	CMOS			6000	3.3			Chip Carrier			3 V	1.27 mm	85 °C (185 °F)	2.7 ns	547 CLBS, 6000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J68	3	4.572 mm	24.2316 mm	No	Also Operates at 5 V supply	e0	80 MHz	20 s		225 °C (437 °F)	24.2316 mm
A40MX04-PL68	Microchip Technology	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	547	CMOS			6000	3.3			Chip Carrier			3 V	1.27 mm	70 °C (158 °F)	2.7 ns	547 CLBS, 6000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68		4.572 mm	24.2316 mm	No	Also Operates at 5 V supply	e0	80 MHz				24.2316 mm
A40MX04-PL68M	Microsemi	FPGA	Military	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	547	CMOS			6000	3.3			Chip Carrier			3 V	1.27 mm	125 °C (257 °F)	2.7 ns	547 CLBS, 6000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-PQCC-J68	3	4.572 mm	24.2316 mm	No	Also Operates at 5 V supply	e0	80 MHz				24.2316 mm
A40MX04-PLG68M	Microchip Technology	FPGA	Military	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	547	CMOS			6000	3.3	Tube		Chip Carrier			3 V	1.27 mm	125 °C (257 °F)	2.7 ns	547 CLBS, 6000 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-PQCC-J68	3	4.572 mm	24.2316 mm	No	Also Operates at 5 V supply	e3	80 MHz				24.2316 mm
A40MX04-PLG68	Microchip Technology	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	547	CMOS			6000	3.3	Tube		Chip Carrier			3 V	1.27 mm	70 °C (158 °F)	2.7 ns	547 CLBS, 6000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J68	3	4.572 mm	24.2316 mm	No	Also Operates at 5 V supply	e3	80 MHz				24.2316 mm
AGLN020V5-QNG68I	Microchip Technology	FPGA	Industrial	No Lead	68	HVQCCN	Square			Yes	1.575 V	520	CMOS			20000	1.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile			1.425 V	.4 mm	85 °C (185 °F)		520 CLBS, 20000 Gates	-40 °C (-40 °F)		Quad	S-XQCC-N68	3	1 mm	8 mm	No							8 mm
A3P030-QNG68I	Microchip Technology	FPGA	Industrial	No Lead	68	HVQCCN	Square			Yes	1.575 V	768	CMOS			30000	1.5			Chip Carrier, Heat Sink/Slug, Very Thin Profile			1.425 V	.4 mm	100 °C (212 °F)		768 CLBS, 30000 Gates	-40 °C (-40 °F)		Quad	S-XQCC-N68	3	1 mm	8 mm	No							8 mm
AGLN020V2-QNG68I	Microchip Technology	FPGA	Industrial	No Lead	68	HVQCCN	Square			Yes	1.575 V	520	CMOS			20000	1.2			Chip Carrier, Heat Sink/Slug, Very Thin Profile			1.14 V	.4 mm	85 °C (185 °F)		520 CLBS, 20000 Gates	-40 °C (-40 °F)		Quad	S-XQCC-N68	3	1 mm	8 mm	No							8 mm
AGLN020V5-QNG68	Microchip Technology	FPGA	Other	No Lead	68	HVQCCN	Square			Yes	1.575 V	520	CMOS			20000	1.5			Chip Carrier, Heat Sink/Slug, Very Thin Profile			1.425 V	.4 mm	70 °C (158 °F)		520 CLBS, 20000 Gates	-20 °C (-4 °F)		Quad	S-XQCC-N68	3	1 mm	8 mm	No							8 mm
XC3020-50PC68I	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS		58	2000	5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)		64 CLBS, 2000 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J68	1	4.699 mm	24.2316 mm	No	MAX 58 I/OS; 256 flip-flops		50 MHz		58		24.2316 mm
XC3130-4PC68C	Rochester Electronics	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS			2000	5			Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	3.3 ns	100 CLBS, 2000 Gates	0 °C (32 °F)		Quad	S-PQCC-J68	1	4.445 mm	24.2316 mm	No	MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700		230 MHz				24.2316 mm
XC3020-50PC68C	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS		58	2000	5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)		64 CLBS, 2000 Gates	0 °C (32 °F)		Quad	S-PQCC-J68	1	4.699 mm	24.2316 mm	No	MAX 58 I/OS; 256 flip-flops		50 MHz		58		24.2316 mm
ATT3030-70M68I	Lucent Technologies	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS		58	1500	5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	9 ns	100 CLBS, 1500 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J68				No	Typical gates = 1500-2000	e0	70 MHz		58
XC2064-70PC68C	Xilinx	FPGA	Other	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS		58	600	5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	10 ns	64 CLBS, 600 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68	1	4.445 mm	24.2316 mm	No	122 flip-flops; typical gates = 600-1000	e0	70 MHz		58		24.2316 mm
XC3020A-7PC68C	Xilinx	FPGA	Other	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS		58	1000	5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	5.1 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin/Lead	Quad	S-PQCC-J68	3	5.08 mm	24.2316 mm	No	Max usable 1500 Logic gates	e0	113 MHz	30 s	58	225 °C (437 °F)	24.2316 mm
XC3030A-7PC68I	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS		58	1500	5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	5.1 ns	100 CLBS, 1500 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J68	3	5.08 mm	24.2316 mm	No	Max usable 2000 Logic gates	e0	113 MHz		58		24.2316 mm
A3P030-1QNG68I	Microchip Technology	FPGA	Industrial	No Lead	68	HVQCCN	Square			Yes	1.575 V	768	CMOS			30000	1.5			Chip Carrier, Heat Sink/Slug, Very Thin Profile			1.425 V	.4 mm	100 °C (212 °F)		768 CLBS, 30000 Gates	-40 °C (-40 °F)		Quad	S-XQCC-N68	3	1 mm	8 mm	No							8 mm
A40MX02-PLG68I	Microchip Technology	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	295	CMOS			3000	3.3	Tube		Chip Carrier			3 V	1.27 mm	85 °C (185 °F)	2.7 ns	295 CLBS, 3000 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J68	3	4.572 mm	24.2316 mm	No	Also Operates at 5 V supply		80 MHz				24.2316 mm
TPC1010APB-068M	Texas Instruments	FPGA	Military	Pin/Peg	68	PGA		Ceramic	295	No			CMOS		57		5		5 V	Grid Array	PGA68(UNSPEC)	Field Programmable Gate Arrays			125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular					No					57
TPC1020BFN-068I2	Texas Instruments	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	547	Yes			CMOS		69		5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays		1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)		Quad	S-PQCC-J68				No					69
TPC1020BFN-068I1	Texas Instruments	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	547	Yes			CMOS		69		5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays		1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)		Quad	S-PQCC-J68				No					69
TPC1010BFN-068I	Texas Instruments	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	295	Yes	5.5 V	295	CMOS		57	1200	5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	17.82 ns	295 CLBS, 1200 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J68		4.57 mm	24.2316 mm	No	MAX 57 I/OS; 130 flip-flops		100 MHz		57		24.2316 mm
TPC1020AFN-068I	Texas Instruments	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	547	Yes	5.5 V	547	CMOS		69	2000	5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	17.82 ns	547 CLBS, 2000 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J68		4.57 mm	24.2316 mm	No	MAX 57 I/OS; 273 flip-flops		100 MHz		69		24.2316 mm
TPC1010AFN-068I	Texas Instruments	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	295	Yes	5.5 V	295	CMOS		57	1200	5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	17.82 ns	295 CLBS, 1200 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J68		4.57 mm	24.2316 mm	No	MAX 57 I/OS; 130 flip-flops		100 MHz		57		24.2316 mm
TPC1010BFN-068I2	Texas Instruments	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	295	Yes			CMOS		57		5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays		1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)		Quad	S-PQCC-J68				No					57
TPC1020BFN-068C	Texas Instruments	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	547	Yes			CMOS		69		5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	S-PQCC-J68				No					69
M38510/60603BXX	Texas Instruments	FPGA	Military	Pin/Peg	68	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V		CMOS			3000	5			Grid Array			4.5 V		125 °C (257 °F)		3000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P68				No
TPC1010APB-068I	Texas Instruments	FPGA	Industrial	Pin/Peg	68	PGA		Ceramic	295	No			CMOS		57		5		5 V	Grid Array	PGA68(UNSPEC)	Field Programmable Gate Arrays			85 °C (185 °F)			-40 °C (-40 °F)		Perpendicular					No					57
TPC1010AFN-068C	Texas Instruments	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	295	Yes	5.25 V	295	CMOS		57	1200	5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	16.632 ns	295 CLBS, 1200 Gates	0 °C (32 °F)		Quad	S-PQCC-J68		4.57 mm	24.2316 mm	No	MAX 57 I/OS; 130 flip-flops		100 MHz		57		24.2316 mm
TPC1020AFN-068C	Texas Instruments	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	547	Yes	5.25 V	547	CMOS		69	2000	5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	16.632 ns	547 CLBS, 2000 Gates	0 °C (32 °F)		Quad	S-PQCC-J68		4.57 mm	24.2316 mm	No	MAX 57 I/OS; 273 flip-flops				69		24.2316 mm
TPC1020BFN-068C2	Texas Instruments	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	547	Yes			CMOS		69		5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	S-PQCC-J68				No					69
TPC1020AFN-068C1	Texas Instruments	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	547	Yes	5.25 V	547	CMOS		69	2000	5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	13.824 ns	547 CLBS, 2000 Gates	0 °C (32 °F)		Quad	S-PQCC-J68		4.57 mm	24.2316 mm	No	MAX 57 I/OS; 273 flip-flops				69		24.2316 mm
TPC1020BFN-068C1	Texas Instruments	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	547	Yes			CMOS		69		5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	S-PQCC-J68				No					69
TPC1020AFN-068I1	Texas Instruments	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	547	Yes	5.5 V	547	CMOS		69	2000	5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	14.796 ns	547 CLBS, 2000 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J68		4.57 mm	24.2316 mm	No	MAX 57 I/OS; 273 flip-flops				69		24.2316 mm
TPC1010BFN-068I1	Texas Instruments	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	295	Yes	5.5 V	295	CMOS		57	1200	5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	14.796 ns	295 CLBS, 1200 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J68		4.57 mm	24.2316 mm	No	MAX 57 I/OS; 130 flip-flops				57		24.2316 mm
TPC1010AFN-068I1	Texas Instruments	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	295	Yes	5.5 V	295	CMOS		57	1200	5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	14.796 ns	295 CLBS, 1200 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J68		4.57 mm	24.2316 mm	No	MAX 57 I/OS; 130 flip-flops				57		24.2316 mm
TPC1010BFN-068C	Texas Instruments	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	295	Yes	5.25 V	295	CMOS		57	1200	5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	16.632 ns	295 CLBS, 1200 Gates	0 °C (32 °F)		Quad	S-PQCC-J68		4.57 mm	24.2316 mm	No	MAX 57 I/OS; 130 flip-flops		100 MHz		57		24.2316 mm
TPC1020BFN-068I	Texas Instruments	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	547	Yes			CMOS		69		5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays		1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)		Quad	S-PQCC-J68				No					69
TPC1010BFN-068C2	Texas Instruments	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	295	Yes			CMOS		57		5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	S-PQCC-J68				No					57
TPC1010AFN-068C1	Texas Instruments	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	295	Yes	5.25 V	295	CMOS		57	1200	5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	13.824 ns	295 CLBS, 1200 Gates	0 °C (32 °F)		Quad	S-PQCC-J68		4.57 mm	24.2316 mm	No	MAX 57 I/OS; 130 flip-flops				57		24.2316 mm
M38510/60604BXX	Texas Instruments	FPGA	Military	Pin/Peg	68	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V		CMOS			4000	5			Grid Array			4.5 V		125 °C (257 °F)		4000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P68				No
TPC1010AMGB68B	Texas Instruments	FPGA	Military	Pin/Peg	68	PGA		Ceramic	295	No			CMOS	38535Q/M;38534H;883B	57		5		5 V	Grid Array	PGA68(UNSPEC)	Field Programmable Gate Arrays			125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular					No					57
TPC1010BFN-068C1	Texas Instruments	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	295	Yes	5.25 V	295	CMOS		57	1200	5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	13.824 ns	295 CLBS, 1200 Gates	0 °C (32 °F)		Quad	S-PQCC-J68		4.57 mm	24.2316 mm	No	MAX 57 I/OS; 130 flip-flops				57		24.2316 mm
TPC1010APB-068C	Texas Instruments	FPGA	Commercial	Pin/Peg	68	PGA		Ceramic	295	No			CMOS		57		5		5 V	Grid Array	PGA68(UNSPEC)	Field Programmable Gate Arrays			70 °C (158 °F)			0 °C (32 °F)		Perpendicular					No					57
XC3020-70PC68ISPC0110	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	64	CMOS			2000	5			Chip Carrier			4.5 V	1.27 mm	85 °C (185 °F)	9 ns	64 CLBS, 2000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J68		4.699 mm	24.2316 mm	No	MAX 58 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz				24.2316 mm
XC3030-70PC68ISPC0107	Xilinx	FPGA		J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	100	CMOS			1500	5			Chip Carrier			4.5 V	1.27 mm		9 ns	100 CLBS, 1500 Gates		Tin Lead	Quad	S-PQCC-J68		4.445 mm	24.2316 mm	No	360 flip-flops; typical gates = 1500-2000	e0	70 MHz				24.2316 mm
XC3030A-7PCG68I	Xilinx	FPGA		J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	100	CMOS			1500	5			Chip Carrier			4.5 V	1.27 mm		5.1 ns	100 CLBS, 1500 Gates			Quad	S-PQCC-J68		5.08 mm	24.2316 mm		Max usable 2000 Logic gates		113 MHz				24.2316 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.