68 Field Programmable Gate Arrays (FPGA) 180

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Peak Reflow Temperature (C)	Length
XC2064-33PG68C	Xilinx	FPGA	Commercial	Pin/Peg	68	PGA	Square	Ceramic	64	No			CMOS	58		5	5 V	Grid Array	PGA68,11X11	Field Programmable Gate Arrays		2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Perpendicular	S-XPGA-P68				No			33 MHz	58
XC3130A-2PC68C	Xilinx	FPGA	Other	J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	58	1500	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	2.2 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No	Max usable 2000 Logic gates	e0	323 MHz	58		24.2316 mm
XC3020-100PC68ISPC0107	Xilinx	FPGA		J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	64	CMOS		1000	5		Chip Carrier			4.5 V	1.27 mm		7 ns	64 CLBS, 1000 Gates			Quad	S-PQCC-J68		4.445 mm	24.2316 mm	No	256 flip-flops; typical gates = 1000-1500		100 MHz			24.2316 mm
XC3030-70PC68C	Xilinx	FPGA	Other	J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	58	1500	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	9 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68	1	4.445 mm	24.2316 mm	No	360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA	e0	70 MHz	58		24.2316 mm
XC3330A-3PC68I	Xilinx	FPGA		J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes			CMOS			5		Chip Carrier				1.27 mm						Quad	S-PQCC-J68		5.08 mm	24.2316 mm	No						24.2316 mm
XC2064-70PC68I	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS	58	600	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	10 ns	64 CLBS, 600 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J68	1	4.445 mm	24.2316 mm	No	122 flip-flops; typical gates = 600-1000		70 MHz	58	225 °C (437 °F)	24.2316 mm
XC3130A-4PCG68C	Xilinx	FPGA	Other	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS		1500	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	3.3 ns	100 CLBS, 1500 Gates	0 °C (32 °F)		Quad	S-PQCC-J68		5.08 mm	24.2316 mm		Max usable 2000 Logic gates		227 MHz			24.2316 mm
XC3030-125PC68CSPC0107	Xilinx	FPGA	Other	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS		1500	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	5.5 ns	100 CLBS, 1500 Gates	0 °C (32 °F)		Quad	S-PQCC-J68		4.445 mm	24.2316 mm	No	360 flip-flops; typical gates = 1500-2000		125 MHz			24.2316 mm
XC3020A-2PC68C	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes			CMOS	58		5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68				No		e0	325 MHz	58
XC2064-70PG68I	Xilinx	FPGA	Industrial	Pin/Peg	68	PGA	Square	Ceramic, Metal-Sealed Cofired	64	No	5.5 V	64	CMOS	58	600	5	5 V	Grid Array	PGA68,11X11	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	10 ns	64 CLBS, 600 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P68		4.064 mm	27.94 mm	No	122 flip-flops; typical gates = 600-1000		70 MHz	58		27.94 mm
XC2018-50PC68C	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	58	1000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	15 ns	100 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68	1	4.445 mm	24.2316 mm	No	MAX 74 I/OS; 174 flip-flops; typical gates = 1000 - 1500	e0	50 MHz	58		24.2316 mm
XC2064-33PC68C	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes			CMOS	58		5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	S-PQCC-J68				No			33 MHz	58
XC3120A-1PC68C	Xilinx	FPGA	Other	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	58	1000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	1.75 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No	Max usable 1500 Logic gates	e0	323 MHz	58		24.2316 mm
XC3120-3PC68C	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	58	1000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	2.7 ns	64 CLBS, 1000 Gates	0 °C (32 °F)		Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No	Typical gates = 1000-1500		270 MHz	58		24.2316 mm
XC2318L-70PC68I	Xilinx	FPGA		J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes			CMOS			3.3		Chip Carrier				1.27 mm						Quad	S-PQCC-J68		5.08 mm	24.2316 mm	No			70 MHz			24.2316 mm
XC2318-70PC68C	Xilinx	FPGA		J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes			CMOS			5		Chip Carrier				1.27 mm						Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No			70 MHz			24.2316 mm
XC3120A-4PC68C	Xilinx	FPGA	Other	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	58	1000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	3.3 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No	Max usable 1500 Logic gates	e0	227 MHz	58		24.2316 mm
XC2064-33PG68M	Xilinx	FPGA	Military	Pin/Peg	68	PGA	Square	Ceramic	64	No			CMOS	58		5	5 V	Grid Array	PGA68,11X11	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-XPGA-P68				No			33 MHz	58
XC3030-50PC68CSPC0104	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS		3000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		100 CLBS, 3000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68		4.699 mm	24.2316 mm	No	MAX 58 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz			24.2316 mm
XC3120-5PC68C	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	58	1000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	4.1 ns	64 CLBS, 1000 Gates	0 °C (32 °F)		Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No	Typical gates = 1000-1500		188 MHz	58		24.2316 mm
XC2018-33PC68C	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes			CMOS	58		5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	S-PQCC-J68				No			33 MHz	58
XC3120A-3PC68I	Xilinx	FPGA		J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS	58	1000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm		2.7 ns	64 CLBS, 1000 Gates		Tin Lead	Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No	Max usable 1500 Logic gates	e0	270 MHz	58		24.2316 mm
XC3020-100PC68C	Xilinx	FPGA	Other	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	58	1000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	7 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68	1	4.445 mm	24.2316 mm	No	256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA	e0	100 MHz	58		24.2316 mm
XC3020A-7PCG68I	Xilinx	FPGA		J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	64	CMOS		1000	5		Chip Carrier			4.5 V	1.27 mm		5.1 ns	64 CLBS, 1000 Gates			Quad	S-PQCC-J68		5.08 mm	24.2316 mm		Max usable 1500 Logic gates		113 MHz			24.2316 mm
XC3130A-5PC68C	Xilinx	FPGA	Other	J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	58	1500	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4.1 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No	Typical gates = 1500-2000	e0	188 MHz	58		24.2316 mm
XC3020A-6PC68C	Xilinx	FPGA	Other	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	58	1000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4.1 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68	3	5.08 mm	24.2316 mm	No	Max usable 1500 Logic gates	e0	135 MHz	58		24.2316 mm
XC2064-100PC68I	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS	58	600	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	8 ns	64 CLBS, 600 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J68	1	4.445 mm	24.2316 mm	No	122 flip-flops; typical gates = 600-1000	e0	100 MHz	58		24.2316 mm
XC3030-50PC68I	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS	58	3000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)		100 CLBS, 3000 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J68	1	4.699 mm	24.2316 mm	No	MAX 58 I/OS; 360 flip-flops		50 MHz	58		24.2316 mm
XC3030-125PC68CSPC0104	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS		3000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	5.5 ns	100 CLBS, 3000 Gates	0 °C (32 °F)		Quad	S-PQCC-J68		4.699 mm	24.2316 mm	No	MAX 58 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C		125 MHz			24.2316 mm
XC3030-50PC68ISPC0107	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	100	CMOS		3000	5		Chip Carrier			4.5 V	1.27 mm	85 °C (185 °F)		100 CLBS, 3000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J68		4.699 mm	24.2316 mm	No	MAX 58 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz			24.2316 mm
XC3120-09PC68C	Xilinx	FPGA		J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		1000	5		Chip Carrier			4.75 V	1.27 mm		1.5 ns	64 CLBS, 1000 Gates			Quad	S-PQCC-J68		5.08 mm	24.2316 mm	No	Typical gates = 1000-1500		370 MHz			24.2316 mm
XC3030-70PC68ISPC0104	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	100	CMOS		3000	5		Chip Carrier			4.5 V	1.27 mm	85 °C (185 °F)	9 ns	100 CLBS, 3000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J68		4.699 mm	24.2316 mm	No	MAX 58 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz			24.2316 mm
XC2064-100PG68I	Xilinx	FPGA	Industrial	Pin/Peg	68	PGA	Square	Ceramic, Metal-Sealed Cofired	64	No	5.5 V	64	CMOS	58	600	5	5 V	Grid Array	PGA68,11X11	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	8 ns	64 CLBS, 600 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P68		4.064 mm	27.94 mm	No	122 flip-flops; typical gates = 600-1000		100 MHz	58		27.94 mm
XC2064-33PC68I	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes			CMOS	58		5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays		1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)		Quad	S-PQCC-J68				No			33 MHz	58
XC3020-50PC68CSPC0107	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		2000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)		64 CLBS, 2000 Gates	0 °C (32 °F)		Quad	S-PQCC-J68		4.699 mm	24.2316 mm	No	MAX 58 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C		50 MHz			24.2316 mm
XC3020-50PC68ISPC0110	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	64	CMOS		2000	5		Chip Carrier			4.5 V	1.27 mm	85 °C (185 °F)		64 CLBS, 2000 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J68		4.699 mm	24.2316 mm	No	MAX 58 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C		50 MHz			24.2316 mm
5962-01-309-5037	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes			CMOS	58		5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	S-PQCC-J68				No			70 MHz	58
XC3120-1PC68C	Xilinx	FPGA		J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		1000	5		Chip Carrier			4.75 V	1.27 mm		1.8 ns	64 CLBS, 1000 Gates			Quad	S-PQCC-J68		5.08 mm	24.2316 mm	No	Typical gates = 1000-1500		323 MHz			24.2316 mm
XC3120-5PC68I	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS	58	1000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	4.1 ns	64 CLBS, 1000 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No	Typical gates = 1000-1500		188 MHz	58		24.2316 mm
XC2064-70PG68M	Xilinx	FPGA	Military	Pin/Peg	68	PGA	Square	Ceramic, Metal-Sealed Cofired	64	No	5.5 V	64	CMOS	58	600	5	5 V	Grid Array	PGA68,11X11	Field Programmable Gate Arrays	4.5 V	2.54 mm	125 °C (257 °F)	10 ns	64 CLBS, 600 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P68		4.064 mm	27.94 mm	No	122 flip-flops; typical gates = 600-1000		70 MHz	58		27.94 mm
XC3130A-1PC68C	Xilinx	FPGA	Other	J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	58	1500	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	1.75 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No	Max usable 2000 Logic gates	e0	323 MHz	58		24.2316 mm
XC3020-70PC68CSPC0110	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		2000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	9 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68		4.699 mm	24.2316 mm	No	MAX 58 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz			24.2316 mm
XC3020-70PC68ISPC0110	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	64	CMOS		2000	5		Chip Carrier			4.5 V	1.27 mm	85 °C (185 °F)	9 ns	64 CLBS, 2000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J68		4.699 mm	24.2316 mm	No	MAX 58 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz			24.2316 mm
XC3030-70PC68ISPC0107	Xilinx	FPGA		J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	100	CMOS		1500	5		Chip Carrier			4.5 V	1.27 mm		9 ns	100 CLBS, 1500 Gates		Tin Lead	Quad	S-PQCC-J68		4.445 mm	24.2316 mm	No	360 flip-flops; typical gates = 1500-2000	e0	70 MHz			24.2316 mm
XC3030A-7PCG68I	Xilinx	FPGA		J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	100	CMOS		1500	5		Chip Carrier			4.5 V	1.27 mm		5.1 ns	100 CLBS, 1500 Gates			Quad	S-PQCC-J68		5.08 mm	24.2316 mm		Max usable 2000 Logic gates		113 MHz			24.2316 mm
XC3020-100PC68CSPC0110	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		2000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	7 ns	64 CLBS, 2000 Gates	0 °C (32 °F)		Quad	S-PQCC-J68		4.699 mm	24.2316 mm	No	MAX 58 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C		100 MHz			24.2316 mm
XC3020-125PC68C	Xilinx	FPGA	Other	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	58	1000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	5.5 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68	1	4.445 mm	24.2316 mm	No	256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA	e0	125 MHz	58		24.2316 mm
XC2018-33PC68I	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes			CMOS	58		5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays		1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)		Quad	S-PQCC-J68				No			33 MHz	58

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.