780 Field Programmable Gate Arrays (FPGA) 1,765

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5SGXEA3E2H29C3	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	340000	Yes			CMOS	360		0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B780				No					360
EP2AGX45EF29C5	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		364	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	85 °C (185 °F)	1805 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780		2.7 mm	29 mm			e0			364		29 mm
EP2AGX95FF29C6N	Altera	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
10AS016E4F29E3SP	Altera	FPGA		Ball	780	BGA	Square	Plastic	160000	Yes			CMOS	288	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B780				No					288
EP2AGX45EF29C4	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		364	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	85 °C (185 °F)	1805 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780		2.7 mm	29 mm			e0			364		29 mm
5SGSMD4E2H29I3L	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	360000	Yes	.88 V	13584	CMOS	360	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)	13584 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.6 mm	33 mm	No					360		33 mm
EP3SL200F780C2	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	200000	Yes			CMOS	488		1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B780				No			100 MHz		480
EP2AGX260CF29I3	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	244188	Yes	.93 V	10260		372	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	100 °C (212 °F)	10260 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm			e0			372		29 mm
EP3SL150F780C4L	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	142500	Yes	.94 V		CMOS	488	.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply	e0	717 MHz	20 s	488	220 °C (428 °F)	29 mm
EP3SE50F780C2LN	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	47500	Yes			CMOS	488		1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm				Tin Silver Copper	Bottom	S-PBGA-B780				No		e1	100 MHz		488
EP2AGZ300HF29C3	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	298000	Yes	.93 V	11920		281	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	85 °C (185 °F)	11920 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm			e0			281		29 mm
5AGZME3K3F29I3	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Lead	Bottom	S-PBGA-B780		3.6 mm	33 mm			e0	670 MHz				33 mm
EP2AGX125DF29C5N	Altera	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
5SGSMD3E2H29C2N	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	236000	Yes	.93 V	8900	CMOS	360	.9	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	8900 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.6 mm	33 mm	No					360		33 mm
EP2AGX95DF29I3N	Altera	FPGA	Industrial	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
EP4SGX290FH29M3	Altera	FPGA	Military	Ball	780	BGA	Square	Plastic/Epoxy	291200	Yes	.93 V	11648		289	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	125 °C (257 °F)	11648 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B780		3.4 mm	33 mm						289		33 mm
EP3SE50F780C4LN	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	47500	Yes	.94 V		CMOS	488	.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply	e1	717 MHz	30 s	488	245 °C (473 °F)	29 mm
10AS027E2F29E2LP	Altera	FPGA		Ball	780	BGA	Square	Plastic	270000	Yes			CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B780				No					360
10AX048E1F29E1LP	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm								29 mm
EP2AGX260EF29C5	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	244188	Yes			CMOS	372		0.9,1.2/3.3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm				Tin Lead	Bottom	S-PBGA-B780	3			No		e0		20 s	372	220 °C (428 °F)
EP2AGX260DF29C5	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	244188	Yes	.93 V	10260		372	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	85 °C (185 °F)	10260 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm			e0			372		29 mm
5SGXEA3E3H29C2N	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	340000	Yes			CMOS	360		0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B780				No					360
EP4SGX290FH29I2XN	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	291200	Yes	.93 V	11648		289	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	100 °C (212 °F)	11648 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.4 mm	33 mm						289		33 mm
EP2AGZ300EF29I4	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	298000	Yes	.93 V	11920		281	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	100 °C (212 °F)	11920 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm			e0			281		29 mm
EP1AGX35CF780I6N	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.25 V	33520			1.2		Grid Array			1.15 V	1 mm	100 °C (212 °F)	33520 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780			29 mm	No							29 mm
5AGZME1K3F29C4	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780		3.6 mm	33 mm			e0	670 MHz				33 mm
10AS027E1F29E1LP	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm								29 mm
EP2AGX260EF29C5N	Altera	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy	244188	Yes	.93 V		CMOS	372	.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B780	3	2.7 mm	29 mm	No		e1	500 MHz	30 s	372	250 °C (482 °F)	29 mm
EP2AGZ350FH29C3N	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	348500	Yes			CMOS	281		0.9,1.2/3.3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B780				No					281
EP4SE360H29C4N	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	353600	Yes	.93 V	14144	CMOS	488	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	14144 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	4	3.4 mm	33 mm	No		e1	717 MHz	30 s	488	245 °C (473 °F)	33 mm
10AS016E4F29I3SP	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	160000	Yes	.93 V	6151	CMOS	288	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	6151 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					288		29 mm
EP3SL110F780C2LN	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	107500	Yes			CMOS	488		1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm				Tin Silver Copper	Bottom	S-PBGA-B780				No		e1	100 MHz		488
EP2AGX125CF29C5N	Altera	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
10AX048E2F29I1LG	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm								29 mm
EP3SL70F780I3L	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	67500	Yes			CMOS	488		1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm				Tin Lead	Bottom	S-PBGA-B780	1			No		e0	100 MHz		488
10AX022E3F29E1SP	Altera	FPGA		Ball	780	BGA	Square	Plastic	220000	Yes			CMOS	288	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B780				No					288
EP2AGX45CF29I3N	Altera	FPGA	Industrial	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
EP4SE360H29I4N	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	353600	Yes	.93 V	14144	CMOS	488	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm		14144 CLBS		Tin Silver Copper	Bottom	S-PBGA-B780	4	3.4 mm	33 mm	No		e1	717 MHz	30 s	488	245 °C (473 °F)	33 mm
5SGXEA3E3H29I4	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	340000	Yes			CMOS	360		0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B780				No					360
EP3SL70F780C2LN	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	67500	Yes			CMOS	488		1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm				Tin Silver Copper	Bottom	S-PBGA-B780				No		e1	100 MHz		488
EP2AGX45DF29C4	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	42959	Yes			CMOS	364		0.9,1.2/3.3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm				Tin Lead	Bottom	S-PBGA-B780	3			No		e0		20 s	364	220 °C (428 °F)
10AS048E3F29E2SG	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	480000	Yes	.93 V		CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					360		29 mm
EP3SE80F780I2N	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	80000	Yes			CMOS	488		1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm				Tin Silver Copper	Bottom	S-PBGA-B780				No		e1	100 MHz		488
EP2AGX190HF29C6N	Altera	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
10AS048E2F29E1SP	Altera	FPGA		Ball	780	BGA	Square	Plastic	480000	Yes			CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B780				No					360
EP2AGX45HF29C6N	Altera	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
EP3SE80F780I3LN	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	80000	Yes			CMOS	488		1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm				Tin Silver Copper	Bottom	S-PBGA-B780				No		e1	100 MHz		488
10AS027E2F29I2LP	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	270000	Yes	.93 V	10162	CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	10162 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					360		29 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.