780 Field Programmable Gate Arrays (FPGA) 1,765

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
10AS027E2F29E1SP	Altera	FPGA		Ball	780	BGA	Square	Plastic	270000	Yes			CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B780				No					360
10AX027E3F29I2LP	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm								29 mm
EP2AGZ350CF29C3	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	348500	Yes	.93 V	13940		281	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	85 °C (185 °F)		13940 CLBs	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm			e0			281		29 mm
10AX027E3F29E2SP	Altera	FPGA		Ball	780	BGA	Square	Plastic	270000	Yes			CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B780				No					360
EP2AGX260HF29I5N	Altera	FPGA	Industrial	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
EP2AGX95FF29C5N	Altera	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
5SGSMD4E2H29C3N	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	360000	Yes	.88 V	13584	CMOS	360	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)		13584 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.6 mm	33 mm	No					360		33 mm
10AS022E3F29I2SP	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	220000	Yes	.93 V	8033	CMOS	288	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		8033 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					288		29 mm
EP4SGX290FH29M3N	Altera	FPGA	Military	Ball	780	BGA	Square	Plastic/Epoxy	291200	Yes	.93 V	11648			0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	125 °C (257 °F)		11648 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B780		3.4 mm	33 mm								33 mm
EP2AGX260HF29I3N	Altera	FPGA	Industrial	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
EP2SGX60CF780C3	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	60440	CMOS	364	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	4.45 ns	60440 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e0	717 MHz	20 s	364	220 °C (428 °F)	29 mm
EP2SGX30DF780I5N	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	33380	Yes	1.25 V	33880	CMOS	361	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	4.006 ns	33880 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B780		3.5 mm	29 mm	No		e1	622.08 MHz	40 s	361	245 °C (473 °F)	29 mm
EP2AGX125FF29C6	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	118143	Yes	.93 V	4964		372	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	85 °C (185 °F)		4964 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm			e0			372		29 mm
EP2AGX125EF29C6	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	118143	Yes			CMOS	372		0.9,1.2/3.3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B780	3			No		e0		20 s	372	220 °C (428 °F)
HC1S40F780	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	41250	Yes				613		1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B780				No					613
HC1S30F780N	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	32470	Yes				597		1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B780				No					597
5AGZME3K3F29C4	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780		3.6 mm	33 mm			e0	670 MHz				33 mm
EP2SGX60DF780I3N	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	60440	CMOS	364	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	2.99 ns	60440 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B780		3.5 mm	29 mm	No		e1	622.08 MHz	40 s	364	245 °C (473 °F)	29 mm
EP2AGZ350HF29I4	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	348500	Yes	.93 V	13940		281	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	100 °C (212 °F)		13940 CLBs	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm			e0			281		29 mm
EP2AGX95DF29C4	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	89178	Yes	.93 V	3747		372	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	85 °C (185 °F)		3747 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm			e0			372		29 mm
EP2AGZ350DF29I3	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	348500	Yes	.93 V	13940		281	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	100 °C (212 °F)		13940 CLBs	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm			e0			281		29 mm
EP2AGX65EF29C5N	Altera	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
10AS027E4F29I3LP	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	270000	Yes	.93 V	10162	CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		10162 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					360		29 mm
EP1S60F780C6	Altera	FPGA	Commercial Extended	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780				No		e0
EP4SGX290FH29C2XN	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	291200	Yes	.93 V	11648	CMOS	289	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		11648 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	4	3.4 mm	33 mm	No		e1	800 MHz	30 s	289	245 °C (473 °F)	33 mm
10AS032E2F29I1LP	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm								29 mm
EP3SE80F780I4L	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	80000	Yes	.94 V		CMOS	488	.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm					Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply	e0	717 MHz	20 s	488	220 °C (428 °F)	29 mm
EP2AGX95CF29C6N	Altera	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
EP4SGX360FH29I3N	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	353600	Yes	.93 V	14144	CMOS	289	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm			14144 CLBS		Tin Silver Copper	Bottom	S-PBGA-B780	4	3.4 mm	33 mm	No		e1	717 MHz	30 s	289	245 °C (473 °F)	33 mm
EP4CE75F29I8L	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	75408	Yes	1.03 V	4713		429	1	1,1.2/3.3,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.97 V	1 mm			4713 CLBS		Tin Lead	Bottom	S-PBGA-B780	3	2.4 mm	29 mm	No		e0	362 MHz	20 s	429	220 °C (428 °F)	29 mm
EP2SGX30DF780C4	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	33880	Yes	1.25 V	33880	CMOS	361	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5.117 ns	33880 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e0	717 MHz	20 s	361	220 °C (428 °F)	29 mm
EP2AGX190DF29I5	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	181165	Yes	.93 V	7612		372	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	100 °C (212 °F)		7612 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm			e0			372		29 mm
EP4SGX110DF29I3	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	105600	Yes	.93 V	4224	CMOS	372	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm			4224 CLBS		Tin Lead	Bottom	S-PBGA-B780	3	3.3 mm	29 mm	No		e0	717 MHz	20 s	372	220 °C (428 °F)	29 mm
10AS022E4F29I3SG	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	220000	Yes	.93 V		CMOS	288	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					288		29 mm
10AS032E1F29E1SP	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm								29 mm
10AX048E3F29E2SG	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	480000	Yes	.93 V		CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					360		29 mm
EP2SGX60CF780C5	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	60440	CMOS	364	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5.962 ns	60440 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e0	640 MHz	20 s	364	220 °C (428 °F)	29 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.