780 Field Programmable Gate Arrays (FPGA) 1,765

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

10AX022E3F29I1SP

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

220000

Yes

.93 V

8033

CMOS

288

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

8033 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

288

29 mm

10AX022E3F29I1LP

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

10AX032E4F29I3SP

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

EP2AGZ300CF29C3

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

298000

Yes

.93 V

11920

281

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

85 °C (185 °F)

11920 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

2.6 mm

29 mm

e0

281

29 mm

EP4SGX230DF29I3

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

228000

Yes

.93 V

9120

CMOS

372

.9

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

9120 CLBS

Tin Lead

Bottom

S-PBGA-B780

4

3.5 mm

29 mm

No

e0

717 MHz

20 s

372

220 °C (428 °F)

29 mm

EP3C55F780I6

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

55856

Yes

1.25 V

CMOS

377

1.2

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.15 V

1 mm

Tin Lead

Bottom

S-PBGA-B780

1

2.4 mm

29 mm

No

e0

377

29 mm

5SGSMD3E2H29I3

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

236000

Yes

.88 V

8900

CMOS

360

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.82 V

1 mm

100 °C (212 °F)

8900 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.6 mm

33 mm

No

360

33 mm

EP3SL50F780I3L

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

47500

Yes

CMOS

488

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin Lead

Bottom

S-PBGA-B780

1

No

e0

100 MHz

488

EP2AGX190DF29I5N

Altera

FPGA

Industrial

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

EP2AGX65EF29I5

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

60214

Yes

.93 V

2530

364

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

100 °C (212 °F)

2530 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B780

2.7 mm

29 mm

e0

364

29 mm

10AX027E2F29E2SP

Altera

FPGA

Ball

780

BGA

Square

Plastic

270000

Yes

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B780

No

360

EP2AGX190HF29I3

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

181165

Yes

.93 V

7612

372

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

100 °C (212 °F)

7612 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B780

2.6 mm

29 mm

e0

372

29 mm

EP3SL200H780C2

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

200000

Yes

.94 V

CMOS

488

.9

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.86 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

3

3.5 mm

33 mm

No

It can also operate from 1.05 to 1.15 V supply

e0

800 MHz

20 s

488

220 °C (428 °F)

33 mm

EP2AGX125CF29I5N

Altera

FPGA

Industrial

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

EP3C40F780C7

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

39600

Yes

1.25 V

39600

CMOS

535

1.2

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

39600 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

3

2.4 mm

29 mm

No

e0

472.5 MHz

20 s

535

220 °C (428 °F)

29 mm

10AX027E2F29I2SG

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

270000

Yes

.93 V

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

360

29 mm

EP3SL200H780I3LN

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

200000

Yes

CMOS

488

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin Silver Copper

Bottom

S-PBGA-B780

No

e1

100 MHz

488

EP2AGX45CF29C4

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

42959

Yes

.93 V

1805

364

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

85 °C (185 °F)

1805 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

2.7 mm

29 mm

e0

364

29 mm

10AX032E1F29I1LG

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

10AX016E3F29E2LP

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

10AS027E5F29E3SP

Altera

FPGA

Ball

780

BGA

Square

Plastic

270000

Yes

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B780

No

360

EP1AGX60EF780I6N

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.25 V

60100

1.2

Grid Array

1.15 V

1 mm

100 °C (212 °F)

60100 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B780

29 mm

No

29 mm

EP3SE260H780C3LN

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

255000

Yes

CMOS

488

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin Silver Copper

Bottom

S-PBGA-B780

No

e1

100 MHz

488

5SGXMA3E1H29C1N

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

340000

Yes

.93 V

12830

CMOS

360

.9

0.9,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

12830 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B780

3.6 mm

33 mm

No

360

33 mm

EP4SGX180DF29I4

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

175750

Yes

.93 V

7030

CMOS

372

.9

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

7030 CLBS

Tin Lead

Bottom

S-PBGA-B780

4

3.5 mm

29 mm

No

e0

717 MHz

20 s

372

220 °C (428 °F)

29 mm

10AX048E1F29I1LP

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

EP3SE260F780I4N

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

255000

Yes

CMOS

488

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin/Silver/Copper

Bottom

S-PBGA-B780

No

e1

100 MHz

480

10AS027E1F29I1SG

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

EP1S30F780I5

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

32470

Yes

1.575 V

CMOS

726

1.5

1.5,1.5/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.425 V

1 mm

Tin Lead

Bottom

S-PBGA-B780

3

No

e0

726

220 °C (428 °F)

5AGZME1E3F29I3L

Altera

FPGA

Industrial

No Lead

780

BGA

Square

Plastic/Epoxy

220000

Yes

1.18 V

8302

TSMC

342

1.15

Grid Array

BGA780,28X28,40

1.12 V

1 mm

100 °C (212 °F)

8302 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.6 mm

33 mm

342

33 mm

EP2AGX45CF29C6

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

42959

Yes

.93 V

1805

364

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

85 °C (185 °F)

1805 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

2.7 mm

29 mm

e0

364

29 mm

10AS048E2F29E2SG

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

480000

Yes

.93 V

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

360

29 mm

EP2AGX260HF29C4

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

244188

Yes

.93 V

10260

372

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

85 °C (185 °F)

10260 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

2.6 mm

29 mm

e0

372

29 mm

EP4SGX360FH29C3

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

353600

Yes

.93 V

14144

CMOS

289

.9

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

14144 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

4

3.4 mm

33 mm

No

e0

717 MHz

20 s

289

220 °C (428 °F)

33 mm

10AS032E2F29I2SG

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

320000

Yes

.93 V

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

360

29 mm

EP3C120F780A7N

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

119088

Yes

CMOS

531

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin/Silver/Copper

Bottom

S-PBGA-B780

No

e1

531

5SGXMA3E2H29C1

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

340000

Yes

.93 V

12830

CMOS

360

.9

0.9,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

12830 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B780

3.6 mm

33 mm

No

360

33 mm

10AX027E1F29E1SG

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

270000

Yes

.93 V

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

360

29 mm

10AS032E1F29E1LP

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

10AS022E4F29E3LP

Altera

FPGA

Ball

780

BGA

Square

Plastic

220000

Yes

CMOS

288

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B780

No

288

EP2AGX260DF29C6

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

244188

Yes

.93 V

10260

372

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

85 °C (185 °F)

10260 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

2.6 mm

29 mm

e0

372

29 mm

EP3SE80F780C4N

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

80000

Yes

.94 V

CMOS

488

.9

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.86 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

3

3.5 mm

29 mm

No

It can also operate from 1.05 to 1.15 V supply

e1

717 MHz

30 s

488

245 °C (473 °F)

29 mm

EP2AGZ300FF29C4

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

298000

Yes

.93 V

11920

281

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

85 °C (185 °F)

11920 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

2.6 mm

29 mm

e0

281

29 mm

EP2SGX60DF780C5

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

60440

Yes

1.25 V

60440

CMOS

364

1.2

1.2,1.2/3.3,3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

5.962 ns

60440 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

3

3.5 mm

29 mm

No

e0

640 MHz

20 s

364

220 °C (428 °F)

29 mm

EP1S10F780C7ES

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

No

e0

EP2AGX260DF29C4N

Altera

FPGA

Other

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

5AGZME3K2F29I3LN

Altera

FPGA

Industrial

No Lead

780

BGA

Square

Plastic/Epoxy

360000

Yes

1.18 V

13584

TSMC

342

1.15

Grid Array

BGA780,28X28,40

1.12 V

1 mm

100 °C (212 °F)

13584 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.6 mm

33 mm

342

33 mm

10AX027E3F29I2SG

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

270000

Yes

.93 V

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

360

29 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.