780 Field Programmable Gate Arrays (FPGA) 1,765

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

EP2AGX65DF29

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

Bottom

S-PBGA-B780

2.7 mm

29 mm

29 mm

EP4SE230F29C3

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

228000

Yes

.93 V

9120

CMOS

488

.9

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

9120 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

4

3.4 mm

29 mm

No

e0

717 MHz

20 s

488

220 °C (428 °F)

29 mm

10AX022E3F29E2SP

Altera

FPGA

Ball

780

BGA

Square

Plastic

220000

Yes

CMOS

288

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B780

No

288

EP4CE40F29C6

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

39600

Yes

1.25 V

2475

535

1.2

1.2,1.2/3.3,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

2475 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

3

2.4 mm

29 mm

No

e0

472.5 MHz

20 s

535

220 °C (428 °F)

29 mm

10AS016E3F29I2SP

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

160000

Yes

.93 V

6151

CMOS

288

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

6151 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

288

29 mm

10AS032E5F29E3SP

Altera

FPGA

Ball

780

BGA

Square

Plastic

320000

Yes

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B780

No

360

EP2AGX65DF29I5N

Altera

FPGA

Industrial

Ball

780

HBGA

Square

Plastic/Epoxy

60214

Yes

.93 V

63250

CMOS

364

.9

0.9,1.2/3.3,1.5,2.5 V

Grid Array, Heat Sink/Slug

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

63250 CLBS

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B780

3

2.7 mm

29 mm

No

e1

500 MHz

30 s

364

250 °C (482 °F)

29 mm

EP4SE360H29I2N

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

353600

Yes

.93 V

14144

TSMC

488

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

100 °C (212 °F)

14144 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.4 mm

33 mm

488

33 mm

EP3SE110F780I3LN

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

107500

Yes

CMOS

488

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin Silver Copper

Bottom

S-PBGA-B780

No

e1

100 MHz

488

EP2AGX95CF29C4N

Altera

FPGA

Other

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

5SGXEA3E3H29C4N

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

340000

Yes

CMOS

360

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B780

No

360

5AGZME3E3F29I3

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B780

3.6 mm

33 mm

e0

670 MHz

33 mm

10AS027E4F29E3LP

Altera

FPGA

Ball

780

BGA

Square

Plastic

270000

Yes

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B780

No

360

10AS032E3F29I2SG

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

320000

Yes

.93 V

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

360

29 mm

EP3SE260H780I4

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

255000

Yes

.94 V

CMOS

488

.9

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.86 V

1 mm

Tin Lead

Bottom

S-PBGA-B780

3

3.5 mm

33 mm

No

It can also operate from 1.05 to 1.15 V supply

e0

717 MHz

20 s

488

220 °C (428 °F)

33 mm

EP1S40F780C7

Altera

FPGA

Commercial Extended

Ball

780

BGA

Square

Plastic/Epoxy

41250

Yes

1.575 V

4697

CMOS

822

1.5

1.5,1.5/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.425 V

1 mm

85 °C (185 °F)

4697 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

3

3.5 mm

29 mm

No

e0

20 s

822

220 °C (428 °F)

29 mm

EP2AGX45HF29C4N

Altera

FPGA

Other

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

EP3SE50F780C2

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

47500

Yes

.94 V

CMOS

488

.9

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.86 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

3

3.5 mm

29 mm

No

It can also operate from 1.05 to 1.15 V supply

e0

800 MHz

20 s

488

220 °C (428 °F)

29 mm

EP4SGX180DF29C4N

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

175750

Yes

.93 V

7030

CMOS

372

.9

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

7030 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

4

3.5 mm

29 mm

No

e1

717 MHz

30 s

372

245 °C (473 °F)

29 mm

EP2AGX95DF29I3

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

89178

Yes

.93 V

3747

372

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

100 °C (212 °F)

3747 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B780

2.6 mm

29 mm

e0

372

29 mm

EP1S80F780I6

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B780

No

e0

EP2AGX65FF29I3N

Altera

FPGA

Industrial

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

EP3SE50F780I2

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

47500

Yes

CMOS

488

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin Lead

Bottom

S-PBGA-B780

1

No

e0

100 MHz

488

10AX022E3F29E1LP

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

EP3SL150F780I3LN

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

142500

Yes

CMOS

488

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin Silver Copper

Bottom

S-PBGA-B780

No

e1

100 MHz

488

EP2AGX45HF29I3N

Altera

FPGA

Industrial

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

10AS032E5F29I3SP

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

320000

Yes

.93 V

11990

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

11990 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

360

29 mm

EP2AGX190FF29C4

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

181165

Yes

.93 V

7612

372

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

85 °C (185 °F)

7612 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

2.6 mm

29 mm

e0

372

29 mm

5SGXMA3E3H29C2LN

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

340000

Yes

.88 V

12830

CMOS

360

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.82 V

1 mm

85 °C (185 °F)

12830 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B780

3.6 mm

33 mm

No

360

33 mm

EP2AGX260HF29C4N

Altera

FPGA

Other

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

EP2AGX125DF29I3N

Altera

FPGA

Industrial

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

HC1S30F780

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

32470

Yes

597

1.5,1.5/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B780

No

597

5SGSMD3E1H29C2LN

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

236000

Yes

.88 V

8900

CMOS

360

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.82 V

1 mm

85 °C (185 °F)

8900 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B780

3.6 mm

33 mm

No

360

33 mm

10AX016E5F29E3SP

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

10AX016E4F29E3SP

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

5AGZME1E3H29I4N

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

220000

Yes

.88 V

8302

342

0.85

Grid Array

BGA780,28X28,40

.82 V

1 mm

100 °C (212 °F)

8302 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.6 mm

33 mm

342

33 mm

EP2AGX125DF29C4N

Altera

FPGA

Other

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

10AX016E3F29I1MG

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

EP2AGX260DF29C4

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

244188

Yes

.93 V

10260

372

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

85 °C (185 °F)

10260 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

2.6 mm

29 mm

e0

372

29 mm

10AS022E5F29E3SP

Altera

FPGA

Ball

780

BGA

Square

Plastic

220000

Yes

CMOS

288

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B780

No

288

10AS016E4F29I3LP

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

160000

Yes

.93 V

6151

CMOS

288

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

6151 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

288

29 mm

EP3SL150F780C2

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

142500

Yes

.94 V

CMOS

488

.9

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.86 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

3

3.5 mm

29 mm

No

It can also operate from 1.05 to 1.15 V supply

e0

800 MHz

20 s

488

220 °C (428 °F)

29 mm

10AX048E3F29I2SG

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

480000

Yes

.93 V

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

360

29 mm

EP4SGX360FH29C2X

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

353600

Yes

.93 V

14144

CMOS

289

.9

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

14144 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

4

3.4 mm

33 mm

No

e0

800 MHz

20 s

289

220 °C (428 °F)

33 mm

EP1S30F780I8

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

32470

Yes

CMOS

726

1.5,1.5/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin Lead

Bottom

S-PBGA-B780

3

No

e0

726

220 °C (428 °F)

EP3SE80F780C4

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

80000

Yes

.94 V

CMOS

488

.9

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.86 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

3

3.5 mm

29 mm

No

It can also operate from 1.05 to 1.15 V supply

e0

717 MHz

20 s

488

220 °C (428 °F)

29 mm

EP3SL150F780I2LN

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

142500

Yes

CMOS

488

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin Silver Copper

Bottom

S-PBGA-B780

No

e1

100 MHz

488

EP2AGX65EF29C6N

Altera

FPGA

Other

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.