780 Field Programmable Gate Arrays (FPGA) 1,765

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

EP2AGZ350CF29I3

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

348500

Yes

.93 V

13940

281

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

100 °C (212 °F)

13940 CLBs

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B780

2.6 mm

29 mm

e0

281

29 mm

5SGXEA3E2H29C2N

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

340000

Yes

CMOS

360

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B780

No

360

10AS032E1F29I1LG

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

EP2AGX95EF29C4

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

89178

Yes

CMOS

372

0.9,1.2/3.3,1.5,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin Lead

Bottom

S-PBGA-B780

3

No

e0

20 s

372

220 °C (428 °F)

EP3CLS200F780

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.25 V

47

1.2

Grid Array

1.15 V

1 mm

47 CLBS

Bottom

S-PBGA-B780

2.4 mm

29 mm

29 mm

10AX027E2F29I1LG

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

10AS016E3F29E1LP

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

EP4SGX360FH29C2XN

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

353600

Yes

.93 V

14144

CMOS

289

.9

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

14144 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

4

3.4 mm

33 mm

No

e1

800 MHz

30 s

289

245 °C (473 °F)

33 mm

5SGXEA3E2H29I3

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

340000

Yes

CMOS

360

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B780

No

360

EP2AGX260FF29C6N

Altera

FPGA

Other

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

EP3SE260H780C4

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

255000

Yes

.94 V

CMOS

488

.9

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.86 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

3

3.5 mm

33 mm

No

It can also operate from 1.05 to 1.15 V supply

e0

717 MHz

20 s

488

220 °C (428 °F)

33 mm

10AS048E2F29I2SG

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

480000

Yes

.93 V

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

360

29 mm

5SGSMD4E2H29C1

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

360000

Yes

.93 V

13584

CMOS

360

.9

0.9,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

13584 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B780

3.6 mm

33 mm

No

360

33 mm

EP3SE110F780I2

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

107500

Yes

CMOS

488

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin Lead

Bottom

S-PBGA-B780

1

No

e0

100 MHz

488

10AX022E3F29I2SG

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

220000

Yes

.93 V

CMOS

288

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

288

29 mm

EP1S20F780I6N

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

18460

Yes

1.575 V

2132

CMOS

586

1.5

1.5,1.5/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.425 V

1 mm

2132 CLBS

Tin/Silver/Copper

Bottom

S-PBGA-B780

3

3.5 mm

29 mm

No

e1

40 s

586

245 °C (473 °F)

29 mm

10AX048E2F29I1MG

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

EP4CE55F29C7

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

55856

Yes

1.25 V

3491

377

1.2

1.2,1.2/3.3,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

3491 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

3

2.4 mm

29 mm

No

e0

472.5 MHz

20 s

377

220 °C (428 °F)

29 mm

5AGZME3E3F29C4

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

3.6 mm

33 mm

e0

670 MHz

33 mm

EP2AGZ350HF29I3

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

348500

Yes

.93 V

13940

281

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

100 °C (212 °F)

13940 CLBs

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B780

2.6 mm

29 mm

e0

281

29 mm

10AS032E1F29E1MP

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

EP3SE50F780C2L

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

47500

Yes

CMOS

488

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin Lead

Bottom

S-PBGA-B780

1

No

e0

100 MHz

488

EP4CE115F29C9L

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

114480

Yes

1.03 V

7155

531

1

1,1.2/3.3,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

7155 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

3

2.4 mm

29 mm

No

e0

265 MHz

20 s

531

220 °C (428 °F)

29 mm

10AX032E4F29E3SP

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

EP1AGX20CF780C6

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.25 V

21580

230

1.2

1.2,2.5/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

21580 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

3

3.5 mm

29 mm

No

e0

640 MHz

20 s

230

220 °C (428 °F)

29 mm

EP2AGZ300EF29C3N

Altera

FPGA

Other

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

10AX048E3F29E2LG

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

480000

Yes

.93 V

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

360

29 mm

EP4SGX360FH29C4N

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

353600

Yes

.93 V

14144

CMOS

289

.9

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

14144 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

4

3.4 mm

33 mm

No

e1

717 MHz

30 s

289

245 °C (473 °F)

33 mm

EP2AGZ350FF29I3

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

348500

Yes

.93 V

13940

281

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

100 °C (212 °F)

13940 CLBs

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B780

2.6 mm

29 mm

e0

281

29 mm

10AX022E5F29E3SP

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

EP1S80F780I5

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B780

No

e0

10AS032E2F29E2LP

Altera

FPGA

Ball

780

BGA

Square

Plastic

320000

Yes

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B780

No

360

10AS032E2F29I1MG

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

EP2AGX260CF29I5N

Altera

FPGA

Industrial

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

EP3SE50F780I2LN

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

47500

Yes

CMOS

488

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin Silver Copper

Bottom

S-PBGA-B780

No

e1

100 MHz

488

EP4CE55F29C8N

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

55856

Yes

1.25 V

3491

377

1.2

1.2,1.2/3.3,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

3491 CLBS

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B780

3

2.4 mm

29 mm

No

e1

472.5 MHz

30 s

377

260 °C (500 °F)

29 mm

10AS048E4F29E3SP

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

480000

Yes

.93 V

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

360

29 mm

10AS048E1F29E1MG

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

10AX032E2F29I1MG

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

10AX022E4F29I3LP

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

220000

Yes

.93 V

8033

CMOS

288

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

8033 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

288

29 mm

EP4CE55F29C9LN

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

55856

Yes

1.03 V

3491

377

1

1,1.2/3.3,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

3491 CLBS

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B780

3

2.4 mm

29 mm

No

e1

265 MHz

30 s

377

260 °C (500 °F)

29 mm

EP2S90F780I5

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

90960

Yes

1.25 V

4828

CMOS

534

1.2

1.2,1.5/3.3,3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.15 V

1 mm

4828 CLBS

Tin Lead

Bottom

S-PBGA-B780

3

3.5 mm

29 mm

No

e0

526

220 °C (428 °F)

29 mm

10AS022E3F29I1MG

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

5SGXMA3E2H29I2L

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

340000

Yes

.88 V

CMOS

360

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.82 V

1 mm

Bottom

S-PBGA-B780

3.6 mm

33 mm

No

360

33 mm

EP2AGX95CF29C5N

Altera

FPGA

Other

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

EP2AGX95FF29I5

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

89178

Yes

.93 V

3747

372

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

100 °C (212 °F)

3747 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B780

2.6 mm

29 mm

e0

372

29 mm

EP1S10F780I6ES

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B780

No

e0

10AS022E3F29E1LP

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.