780 Field Programmable Gate Arrays (FPGA) 1,765

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP3SE260H780C3L	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	255000	Yes			CMOS	488		1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B780	1			No		e0	100 MHz		488
EP4SGX70DF29C3N	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	72600	Yes	.93 V	2904	CMOS	372	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		2904 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	3.3 mm	29 mm	No		e1	717 MHz	30 s	372	245 °C (473 °F)	29 mm
EP2AGX95EF29C4N	Altera	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy	89178	Yes	.93 V		CMOS	372	.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B780	3	2.7 mm	29 mm	No		e1	500 MHz	30 s	372	250 °C (482 °F)	29 mm
5SGXMA3E1H29I2	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	340000	Yes	.93 V	12830	CMOS	360	.9	0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		12830 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.6 mm	33 mm	No					360		33 mm
10AS048E3F29E2LP	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	480000	Yes	.93 V		CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					360		29 mm
10AS016E3F29I1MP	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm								29 mm
EP3SL200F780I3	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	200000	Yes			CMOS	488		1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B780				No			100 MHz		480
EP2AGX45HF29I3	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		364	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	100 °C (212 °F)		1805 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B780		2.7 mm	29 mm			e0			364		29 mm
10AS016E3F29E2SP	Altera	FPGA		Ball	780	BGA	Square	Plastic	160000	Yes			CMOS	288	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B780				No					288
EP3SE260H780C2L	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	255000	Yes			CMOS	488		1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B780	1			No		e0	100 MHz		488
EP2SGX30CF780C4	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	33880	Yes	1.25 V	33880	CMOS	361	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5.117 ns	33880 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e0	717 MHz	20 s	361	220 °C (428 °F)	29 mm
EP4SGX360FH29I2XN	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	353600	Yes	.93 V	14144		289	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	100 °C (212 °F)		14144 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.4 mm	33 mm						289		33 mm
EP2AGZ300EF29I4N	Altera	FPGA	Industrial	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
EP4SGX290FH29I3N	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	291200	Yes	.93 V	11648	CMOS	289	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm			11648 CLBS		Tin Silver Copper	Bottom	S-PBGA-B780	4	3.4 mm	33 mm	No		e1	717 MHz	30 s	289	245 °C (473 °F)	33 mm
EP3C55F780I8N	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	55856	Yes	1.25 V		CMOS	377	1.2		Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B780		2.4 mm	29 mm	No		e1			377		29 mm
EP2S130F780C4	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	132540	Yes	1.25 V	53016	CMOS	534	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5.117 ns	53016 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e0	717 MHz	20 s	526	220 °C (428 °F)	29 mm
EP2SGX30DF780C5N	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	33880	Yes	1.25 V	33880	CMOS	361	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5.962 ns	33880 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e1	640 MHz	30 s	361	245 °C (473 °F)	29 mm
EP1S30F780C8	Altera	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy	32470	Yes	1.575 V	3819	CMOS	726	1.5	1.5,1.5/3.3 V	Grid Array, Heat Sink/Slug	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		3819 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e0		20 s	726	220 °C (428 °F)	29 mm
5SGSMD3E1H29C1	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	236000	Yes	.93 V	8900	CMOS	360	.9	0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		8900 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.6 mm	33 mm	No					360		33 mm
10AS027E2F29E1SG	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	270000	Yes	.93 V		CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					360		29 mm
5SGXEA3E1H29C2N	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	340000	Yes			CMOS	360		0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B780				No					360
EP4SGX70DF29I2XN	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	72600	Yes	.93 V	2904		372	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	100 °C (212 °F)		2048 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.3 mm	29 mm						372		29 mm
EP3SE50F780C4	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	47500	Yes	.94 V		CMOS	488	.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply	e0	717 MHz	20 s	488	220 °C (428 °F)	29 mm
5AGZME1H3F29C4	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780		3.6 mm	33 mm			e0	670 MHz				33 mm
EP3CLS100F780I7	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	100448	Yes	1.25 V	100448	CMOS	413	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		100448 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B780	3	2.4 mm	29 mm	No		e0	450 MHz	20 s	413	220 °C (428 °F)	29 mm
EP4SE230F29C2	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	228000	Yes	.93 V	9120	CMOS	488	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		9120 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	4	3.4 mm	29 mm	No		e0	800 MHz	20 s	488	220 °C (428 °F)	29 mm
EP1S25F780I5ES	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V						Tin Lead	Bottom	S-PBGA-B780				No		e0
5SGSMD3E3H29C2	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	236000	Yes	.93 V	8900	CMOS	360	.9	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		8900 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.6 mm	33 mm	No					360		33 mm
10AS016E3F29I2SG	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	160000	Yes	.93 V		CMOS	288	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					288		29 mm
10AX027E4F29I3LG	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	270000	Yes	.93 V		CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					360		29 mm
5AGZME1H3F29C4N	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		3.6 mm	33 mm			e1	670 MHz				33 mm
EP2AGX190CF29C5N	Altera	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
EP4CE115F29C8L	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	114480	Yes	1.03 V	7155		531	1	1,1.2/3.3,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)		7155 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	2.4 mm	29 mm	No		e0	362 MHz	20 s	531	220 °C (428 °F)	29 mm
EP3SL150F780I2	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	142500	Yes			CMOS	488		1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B780	1			No		e0	100 MHz		488
EP2AGX125HF29I5	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	118143	Yes	.93 V	4964		372	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	100 °C (212 °F)		4964 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm			e0			372		29 mm
EP4CE55F29I8L	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	55856	Yes	1.03 V	3491		377	1	1,1.2/3.3,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.97 V	1 mm			3491 CLBS		Tin Lead	Bottom	S-PBGA-B780	3	2.4 mm	29 mm	No		e0	362 MHz	20 s	377	220 °C (428 °F)	29 mm
EP2AGX95HF29I3	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	89178	Yes	.93 V	3747		372	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	100 °C (212 °F)		3747 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm			e0			372		29 mm
EP3SL110F780C4N	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	107500	Yes	.94 V		CMOS	488	.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply	e1	717 MHz	30 s	488	245 °C (473 °F)	29 mm
5SGXEA3E2H29C3N	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	340000	Yes			CMOS	360		0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B780				No					360
10AX048E2F29I2LP	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	480000	Yes	.93 V		CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					360		29 mm
EP1S30F780C6N	Altera	FPGA	Commercial Extended	Ball	780	BGA	Square	Plastic/Epoxy	32470	Yes	1.575 V	3819	CMOS	726	1.5	1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		3819 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e1		30 s	726	245 °C (473 °F)	29 mm
EP2AGX65EF29I3N	Altera	FPGA	Industrial	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
10AX016E4F29I3LG	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	160000	Yes	.93 V		CMOS	288	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					288		29 mm
10AX016E3F29I2LP	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm								29 mm
EP3SE110F780C4N	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	107500	Yes	.94 V		CMOS	488	.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply	e1	717 MHz	30 s	488	245 °C (473 °F)	29 mm
EP2AGX125HF29C6N	Altera	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
EP1AGX20CF780I6	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.25 V	21580		230	1.2	1.2,2.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm			21580 CLBS		Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e0	640 MHz	20 s	230	220 °C (428 °F)	29 mm
EP2AGX65HF29C4N	Altera	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.