780 Field Programmable Gate Arrays (FPGA) 1,765

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

10AX016E4F29E3LG

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

160000

Yes

.93 V

CMOS

288

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

288

29 mm

10AS027E2F29I2SP

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

270000

Yes

.93 V

10162

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

10162 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

360

29 mm

5AGZME3E2F29I3LN

Altera

FPGA

Industrial

No Lead

780

BGA

Square

Plastic/Epoxy

360000

Yes

1.18 V

13584

TSMC

342

1.15

Grid Array

BGA780,28X28,40

1.12 V

1 mm

100 °C (212 °F)

13584 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.6 mm

33 mm

342

33 mm

EP3SE110F780I3L

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

107500

Yes

CMOS

488

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin Lead

Bottom

S-PBGA-B780

1

No

e0

100 MHz

488

10AX032E2F29I1LG

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

EP2AGX190DF29C4

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

181165

Yes

.93 V

7612

372

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

85 °C (185 °F)

7612 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

2.6 mm

29 mm

e0

372

29 mm

EP2AGX45EF29C4N

Altera

FPGA

Other

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

EP2AGX190FF29I3N

Altera

FPGA

Industrial

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

EP3SL110F780C2N

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

107500

Yes

.94 V

CMOS

488

.9

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.86 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

3

3.5 mm

29 mm

No

It can also operate from 1.05 to 1.15 V supply

e1

800 MHz

30 s

488

245 °C (473 °F)

29 mm

10AX048E3F29I2LP

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

480000

Yes

.93 V

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

360

29 mm

10AX048E5F29E3SP

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

480000

Yes

.93 V

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

360

29 mm

EP3SE80F780C3LN

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

80000

Yes

CMOS

488

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin Silver Copper

Bottom

S-PBGA-B780

No

e1

100 MHz

488

EP2SGX30DF780C3

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

33880

Yes

1.25 V

33880

CMOS

361

1.2

1.2,1.2/3.3,3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

4.45 ns

33880 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

3

3.5 mm

29 mm

No

e0

717 MHz

20 s

361

220 °C (428 °F)

29 mm

EP1S30F780C6ES

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

No

e0

EP2AGX260EF29I5N

Altera

FPGA

Industrial

Ball

780

HBGA

Square

Plastic/Epoxy

244188

Yes

.93 V

CMOS

372

.9

0.9,1.2/3.3,1.5,2.5 V

Grid Array, Heat Sink/Slug

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B780

3

2.7 mm

29 mm

No

e1

500 MHz

30 s

372

250 °C (482 °F)

29 mm

EP3SL150F780I2N

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

142500

Yes

CMOS

488

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin Silver Copper

Bottom

S-PBGA-B780

No

e1

100 MHz

488

10AX048E2F29E2LG

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

480000

Yes

.93 V

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

360

29 mm

EP2AGX65DF29C5

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

60214

Yes

CMOS

364

0.9,1.2/3.3,1.5,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin Lead

Bottom

S-PBGA-B780

3

No

e0

20 s

364

220 °C (428 °F)

5AGZME3H2F29C4N

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

3.6 mm

33 mm

e1

670 MHz

33 mm

EP4SGX70DF29C4

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

72600

Yes

CMOS

372

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin Lead

Bottom

S-PBGA-B780

3

No

e0

20 s

372

220 °C (428 °F)

EP3CLS70F780C8N

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

70208

Yes

1.25 V

70208

CMOS

413

1.2

1.2,1.2/3.3,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

70208 CLBS

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B780

3

2.4 mm

29 mm

No

e1

450 MHz

30 s

413

260 °C (500 °F)

29 mm

5AGZME1K3F29I3L

Altera

FPGA

Industrial

No Lead

780

BGA

Square

Plastic/Epoxy

220000

Yes

1.18 V

8302

TSMC

342

1.15

Grid Array

BGA780,28X28,40

1.12 V

1 mm

100 °C (212 °F)

8302 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.6 mm

33 mm

342

33 mm

EP3SE50F780C4N

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

47500

Yes

.94 V

CMOS

488

.9

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.86 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

3

3.5 mm

29 mm

No

It can also operate from 1.05 to 1.15 V supply

e1

717 MHz

30 s

488

245 °C (473 °F)

29 mm

10AX027E2F29E2SG

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

270000

Yes

.93 V

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

360

29 mm

EP4CE75F29C8L

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

75408

Yes

1.03 V

4713

429

1

1,1.2/3.3,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

4713 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

3

2.4 mm

29 mm

No

e0

362 MHz

20 s

429

220 °C (428 °F)

29 mm

10AX027E3F29E2LP

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

EP2AGX95FF29I5N

Altera

FPGA

Industrial

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

EP1S40F780I6ES

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B780

No

e0

5AGZME3E2F29I3N

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B780

3.6 mm

33 mm

e1

670 MHz

33 mm

EP1AGX20CF780I6N

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.25 V

21580

230

1.2

1.2,2.5/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.15 V

1 mm

100 °C (212 °F)

21580 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

3

3.5 mm

29 mm

No

e1

640 MHz

30 s

230

245 °C (473 °F)

29 mm

EP2AGX125CF29C6

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

118143

Yes

.93 V

4964

372

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

85 °C (185 °F)

4964 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

2.6 mm

29 mm

e0

372

29 mm

EP3SE260H780C4LN

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

255000

Yes

.94 V

CMOS

488

.9

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.86 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

4

3.5 mm

33 mm

No

It can also operate from 1.05 to 1.15 V supply

e1

717 MHz

30 s

488

245 °C (473 °F)

33 mm

5AGZME3E2F29C4

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

3.6 mm

33 mm

e0

670 MHz

33 mm

10AS048E2F29E1SG

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

480000

Yes

.93 V

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

360

29 mm

10AX027E5F29E3SG

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

5SGXMA3E2H29C2LN

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

340000

Yes

.88 V

12830

CMOS

360

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.82 V

1 mm

85 °C (185 °F)

12830 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B780

3.6 mm

33 mm

No

360

33 mm

EP2AGZ350CF29C4N

Altera

FPGA

Other

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

10AS027E2F29I1LG

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

10AX027E2F29I2LP

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

EP3CLS70F780I7

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

70208

Yes

1.25 V

70208

CMOS

413

1.2

1.2,1.2/3.3,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.15 V

1 mm

100 °C (212 °F)

70208 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B780

3

2.4 mm

29 mm

No

e0

450 MHz

20 s

413

220 °C (428 °F)

29 mm

EP1S25F780I6ES

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B780

No

e0

EP2AGZ300DF29C4

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

298000

Yes

.93 V

11920

281

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

85 °C (185 °F)

11920 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

2.6 mm

29 mm

e0

281

29 mm

10AX016E3F29E2LG

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

160000

Yes

.93 V

CMOS

288

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

288

29 mm

EP4SE230F29M3N

Altera

FPGA

Military

Ball

780

BGA

Square

Plastic/Epoxy

228000

Yes

.93 V

9120

488

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

125 °C (257 °F)

9120 CLBS

-55 °C (-67 °F)

Bottom

S-PBGA-B780

3.4 mm

29 mm

488

29 mm

10AS027E4F29I3LG

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

270000

Yes

.93 V

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

360

29 mm

5SGXEA3E3H29C4

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

340000

Yes

CMOS

360

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B780

No

360

EP3SE110F780C3LN

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

107500

Yes

CMOS

488

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin Silver Copper

Bottom

S-PBGA-B780

No

e1

100 MHz

488

EP3C55F780C7

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

55856

Yes

1.25 V

55856

CMOS

377

1.2

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

55856 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

3

2.4 mm

29 mm

No

e0

472.5 MHz

20 s

377

220 °C (428 °F)

29 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.