780 Field Programmable Gate Arrays (FPGA) 1,765

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5AGZME1H3F29I3L	Altera	FPGA	Industrial	No Lead	780	BGA	Square	Plastic/Epoxy	220000	Yes	1.18 V	8302	TSMC	342	1.15		Grid Array	BGA780,28X28,40		1.12 V	1 mm	100 °C (212 °F)		8302 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.6 mm	33 mm						342		33 mm
EP3SE110F780C2LN	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	107500	Yes			CMOS	488		1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B780				No		e1	100 MHz		488
EP3SE260H780C3N	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	255000	Yes	.94 V		CMOS	488	.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	4	3.5 mm	33 mm	No	It can also operate from 1.05 to 1.15 V supply	e1	717 MHz	30 s	488	245 °C (473 °F)	33 mm
EP2AGZ300HF29I3N	Altera	FPGA	Industrial	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
EP2AGX190CF29I3N	Altera	FPGA	Industrial	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
EP2AGX190CF29C6	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	181165	Yes	.93 V	7612		372	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	85 °C (185 °F)		7612 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm			e0			372		29 mm
EP2AGX65HF29I3N	Altera	FPGA	Industrial	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
EP4SE360H29I2	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	353600	Yes	.93 V	14144	TSMC	488	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	100 °C (212 °F)		14144 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.4 mm	33 mm						488		33 mm
EP1AGX50CF780C6N	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.25 V	50160			1.2		Grid Array			1.15 V	1 mm	85 °C (185 °F)		50160 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780			29 mm	No							29 mm
EP1S60F780C5	Altera	FPGA	Commercial Extended	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780				No		e0
EP3SE80F780I3	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	80000	Yes	.94 V		CMOS	488	.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm					Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply	e0	717 MHz	20 s	488	220 °C (428 °F)	29 mm
EP1S40F780C6N	Altera	FPGA	Commercial Extended	Ball	780	BGA	Square	Plastic/Epoxy	41250	Yes	1.575 V	4697	CMOS	822	1.5	1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		4697 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e1		40 s	822	245 °C (473 °F)	29 mm
EP2AGX45EF29C6	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		364	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	85 °C (185 °F)		1805 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780		2.7 mm	29 mm			e0			364		29 mm
10AX027E1F29E1LG	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm								29 mm
10AS022E3F29E2LP	Altera	FPGA		Ball	780	BGA	Square	Plastic	220000	Yes			CMOS	288	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B780				No					288
EP3SE110F780C2L	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	107500	Yes			CMOS	488		1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B780	1			No		e0	100 MHz		488
10AS032E4F29I3LG	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	320000	Yes	.93 V		CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					360		29 mm
EP3SL200F780C4N	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	200000	Yes			CMOS	488		1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper	Bottom	S-PBGA-B780				No		e1	100 MHz		480
EP2SGX60CF780I3N	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	60440	CMOS	364	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	2.99 ns	60440 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B780		3.5 mm	29 mm	No		e1	622.08 MHz	40 s	364	245 °C (473 °F)	29 mm
EP2AGZ300CF29C4N	Altera	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
EP2AGX45CF29C5N	Altera	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
10AX032E3F29E2LG	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	320000	Yes	.93 V		CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					360		29 mm
EP3SE80F780C2LN	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	80000	Yes			CMOS	488		1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B780				No		e1	100 MHz		488
EP1S25F780C6	Altera	FPGA	Commercial Extended	Ball	780	BGA	Square	Plastic/Epoxy	25660	Yes	1.575 V	2852	CMOS	706	1.5	1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		2852 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e0		20 s	706	220 °C (428 °F)	29 mm
EP3C80F780A7N	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	81264	Yes			CMOS	429		1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper	Bottom	S-PBGA-B780				No		e1			429
EP3SL50F780I3LN	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	47500	Yes			CMOS	488		1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B780				No		e1	100 MHz		488
EP2AGZ300DF29C4N	Altera	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
5AGZME1K2F29I3L	Altera	FPGA	Industrial	No Lead	780	BGA	Square	Plastic/Epoxy	220000	Yes	1.18 V	8302	TSMC	342	1.15		Grid Array	BGA780,28X28,40		1.12 V	1 mm	100 °C (212 °F)		8302 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.6 mm	33 mm						342		33 mm
EP4SGX110DF29C3N	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	105600	Yes	.93 V	4224	CMOS	372	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		4224 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	3.3 mm	29 mm	No		e1	717 MHz	30 s	372	245 °C (473 °F)	29 mm
EP1S20F780C5N	Altera	FPGA	Commercial Extended	Ball	780	BGA	Square	Plastic/Epoxy	18460	Yes	1.575 V	2132	CMOS	586	1.5	1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		2132 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e1		40 s	586	245 °C (473 °F)	29 mm
EP2AGZ300HF29I4	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	298000	Yes	.93 V	11920		281	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	100 °C (212 °F)		11920 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm			e0			281		29 mm
10AX032E2F29I1SP	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm								29 mm
EP2AGX190CF29C5	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	181165	Yes	.93 V	7612		372	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	85 °C (185 °F)		7612 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm			e0			372		29 mm
10AS048E4F29E3LP	Altera	FPGA		Ball	780	BGA	Square	Plastic	480000	Yes			CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B780				No					360
10AX048E1F29E1LG	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm								29 mm
EP3SL70F780I4LN	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	67500	Yes	.94 V		CMOS	488	.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply	e1	717 MHz	30 s	488	245 °C (473 °F)	29 mm
EP2AGX190DF29C5	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	181165	Yes	.93 V	7612		372	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	85 °C (185 °F)		7612 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm			e0			372		29 mm
10AS032E5F29E3SG	Altera	FPGA		Ball	780	BGA	Square	Plastic	320000	Yes			CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B780				No					360
EP4SGX230DF29M3	Altera	FPGA	Military	Ball	780	BGA	Square	Plastic/Epoxy	228000	Yes	.93 V	9120		372	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	125 °C (257 °F)		9120 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B780		3.5 mm	29 mm						372		29 mm
10AS048E5F29I3SG	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	480000	Yes	.93 V		CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					360		29 mm
10AX032E1F29I1SG	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm								29 mm
EP1S20F780C6	Altera	FPGA	Commercial Extended	Ball	780	BGA	Square	Plastic/Epoxy	18460	Yes	1.575 V	2132	CMOS	586	1.5	1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		2132 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e0		20 s	586	220 °C (428 °F)	29 mm
EP2AGX95CF29I5	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	89178	Yes	.93 V	3747		372	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	100 °C (212 °F)		3747 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm			e0			372		29 mm
EP2AGX95EF29C5N	Altera	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy	89178	Yes	.93 V	93675	CMOS	372	.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		93675 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B780	3	2.7 mm	29 mm	No		e1	500 MHz	30 s	372	250 °C (482 °F)	29 mm
EP2AGX65CF29C5N	Altera	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
EP2SGX60CF780I5	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	60440	CMOS	364	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	4.006 ns	60440 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B780		3.5 mm	29 mm	No		e0	622.08 MHz		364		29 mm
EP3CLS150F780C8N	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	150848	Yes	1.25 V	150848	CMOS	413	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		150848 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B780	3	2.4 mm	29 mm	No		e1	450 MHz	30 s	413	260 °C (500 °F)	29 mm
5AGZME1H2F29C4	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780		3.6 mm	33 mm			e0	670 MHz				33 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.