860 Field Programmable Gate Arrays (FPGA) 36

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCV1600E-7FG860C	Xilinx	FPGA	Other	Ball	860	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	660	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	7776 CLBS, 419904 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e0	400 MHz	30 s	660	225 °C (437 °F)	42.5 mm
XCV2000E-7FG860C	Xilinx	FPGA	Other	Ball	860	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	660	518400	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	9600 CLBS, 518400 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e0	400 MHz	30 s	660	225 °C (437 °F)	42.5 mm
XCV2000E-8FG860I	Xilinx	FPGA		Ball	860	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	660	518400	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.4 ns	9600 CLBS, 518400 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e0	416 MHz	30 s	660	225 °C (437 °F)	42.5 mm
XCV1600E-6FGG860I	Xilinx	FPGA		Ball	860	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	660	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	7776 CLBS, 419904 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e1	357 MHz	30 s	660	245 °C (473 °F)	42.5 mm
XCV1600E-7FG860I	Xilinx	FPGA		Ball	860	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	660	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	7776 CLBS, 419904 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e0	400 MHz	30 s	660	225 °C (437 °F)	42.5 mm
XCV1000E-6FG860C	Xilinx	FPGA	Other	Ball	860	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS	660	331776	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	6144 CLBS, 331776 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e0	357 MHz	30 s	660	225 °C (437 °F)	42.5 mm
XCV1000E-8FG860C	Xilinx	FPGA	Other	Ball	860	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS	660	331776	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	6144 CLBS, 331776 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e0	416 MHz	30 s	660	225 °C (437 °F)	42.5 mm
XCV1600E-8FG860I	Xilinx	FPGA		Ball	860	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	660	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.4 ns	7776 CLBS, 419904 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e0	416 MHz	30 s	660	225 °C (437 °F)	42.5 mm
XCV1600E-6FGG860C	Xilinx	FPGA	Other	Ball	860	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	660	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	7776 CLBS, 419904 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e1	357 MHz	30 s	660	245 °C (473 °F)	42.5 mm
XCV1000E-6FG860I	Xilinx	FPGA		Ball	860	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS	660	331776	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	6144 CLBS, 331776 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e0	357 MHz	30 s	660	225 °C (437 °F)	42.5 mm
XCV2000E-7FG860I	Xilinx	FPGA		Ball	860	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	660	518400	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	9600 CLBS, 518400 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e0	400 MHz	30 s	660	225 °C (437 °F)	42.5 mm
XCV2000E-6FGG860C	Xilinx	FPGA	Other	Ball	860	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	660	518400	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	9600 CLBS, 518400 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e1	357 MHz	30 s	660	245 °C (473 °F)	42.5 mm
XCV1000E-7FGG860C	Xilinx	FPGA	Other	Ball	860	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS	660	331776	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	6144 CLBS, 331776 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e1	400 MHz	30 s	660	245 °C (473 °F)	42.5 mm
XCV2000E-6FGG860I	Xilinx	FPGA		Ball	860	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	660	518400	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	9600 CLBS, 518400 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e1	357 MHz	30 s	660	245 °C (473 °F)	42.5 mm
XCV1000E-6FGG860C	Xilinx	FPGA	Other	Ball	860	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS	660	331776	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	6144 CLBS, 331776 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e1	357 MHz	30 s	660	245 °C (473 °F)	42.5 mm
XCV2000E-8FG860C	Xilinx	FPGA	Other	Ball	860	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	660	518400	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	9600 CLBS, 518400 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e0	416 MHz	30 s	660	225 °C (437 °F)	42.5 mm
XCV1000E-7FG860C	Xilinx	FPGA	Other	Ball	860	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS	660	331776	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	6144 CLBS, 331776 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e0	400 MHz	30 s	660	225 °C (437 °F)	42.5 mm
XCV1000E-7FG860I	Xilinx	FPGA		Ball	860	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS	660	331776	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	6144 CLBS, 331776 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e0	400 MHz	30 s	660	225 °C (437 °F)	42.5 mm
XCV1600E-8FGG860I	Xilinx	FPGA		Ball	860	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	660	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.4 ns	7776 CLBS, 419904 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e1	416 MHz	30 s	660	245 °C (473 °F)	42.5 mm
XCV1600E-6FG860C	Xilinx	FPGA	Other	Ball	860	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	660	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	7776 CLBS, 419904 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e0	357 MHz	30 s	660	225 °C (437 °F)	42.5 mm
XCV1000E-6FGG860I	Xilinx	FPGA		Ball	860	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS	660	331776	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	6144 CLBS, 331776 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e1	357 MHz	30 s	660	245 °C (473 °F)	42.5 mm
XCV1600E-7FGG860C	Xilinx	FPGA	Other	Ball	860	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	660	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	7776 CLBS, 419904 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e1	400 MHz	30 s	660	245 °C (473 °F)	42.5 mm
XCV2000E-6FG860I	Xilinx	FPGA		Ball	860	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	660	518400	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	9600 CLBS, 518400 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e0	357 MHz	30 s	660	225 °C (437 °F)	42.5 mm
XCV2000E-7FGG860C	Xilinx	FPGA	Other	Ball	860	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	660	518400	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	9600 CLBS, 518400 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e1	400 MHz	30 s	660	245 °C (473 °F)	42.5 mm
XCV2000E-8FGG860I	Xilinx	FPGA		Ball	860	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	660	518400	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.4 ns	9600 CLBS, 518400 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e1	416 MHz	30 s	660	245 °C (473 °F)	42.5 mm
XCV1000E-8FG860I	Xilinx	FPGA		Ball	860	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS	660	331776	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.4 ns	6144 CLBS, 331776 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e0	416 MHz	30 s	660	225 °C (437 °F)	42.5 mm
XCV2000E-7FGG860I	Xilinx	FPGA		Ball	860	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	660	518400	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	9600 CLBS, 518400 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e1	400 MHz	30 s	660	245 °C (473 °F)	42.5 mm
XCV2000E-8FGG860C	Xilinx	FPGA	Other	Ball	860	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	660	518400	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	9600 CLBS, 518400 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e1	416 MHz	30 s	660	245 °C (473 °F)	42.5 mm
XCV1600E-6FG860I	Xilinx	FPGA		Ball	860	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	660	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	7776 CLBS, 419904 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e0	357 MHz	30 s	660	225 °C (437 °F)	42.5 mm
XCV1000E-7FGG860I	Xilinx	FPGA		Ball	860	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS	660	331776	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	6144 CLBS, 331776 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e1	400 MHz	30 s	660	245 °C (473 °F)	42.5 mm
XCV1000E-8FGG860C	Xilinx	FPGA	Other	Ball	860	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS	660	331776	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	6144 CLBS, 331776 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e1	416 MHz	30 s	660	245 °C (473 °F)	42.5 mm
XCV1000E-8FGG860I	Xilinx	FPGA		Ball	860	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS	660	331776	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.4 ns	6144 CLBS, 331776 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e1	416 MHz	30 s	660	245 °C (473 °F)	42.5 mm
XCV1600E-8FGG860C	Xilinx	FPGA	Other	Ball	860	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	660	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	7776 CLBS, 419904 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e1	416 MHz	30 s	660	245 °C (473 °F)	42.5 mm
XCV1600E-7FGG860I	Xilinx	FPGA		Ball	860	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	660	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	7776 CLBS, 419904 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e1	400 MHz	30 s	660	245 °C (473 °F)	42.5 mm
XCV2000E-6FG860C	Xilinx	FPGA	Other	Ball	860	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	660	518400	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	9600 CLBS, 518400 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e0	357 MHz	30 s	660	225 °C (437 °F)	42.5 mm
XCV1600E-8FG860C	Xilinx	FPGA	Other	Ball	860	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	660	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	7776 CLBS, 419904 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No	e0	416 MHz	30 s	660	225 °C (437 °F)	42.5 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.