900 Field Programmable Gate Arrays (FPGA) 511

Reset All

Part	Manufacturer	Programmable IC Type	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	No. of Inputs	Nominal Supply Voltage (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Additional Features	No. of Outputs	Length
XCKU085-3FBVA900C	Xilinx	FPGA	Ball	900	BGA	Square	Plastic/Epoxy	1088325	Yes	1.03 V	62190	676	1	Grid Array	BGA900,30X30,40	.97 V	1 mm	85 °C (185 °F)	62190 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B900	2.8 mm	31 mm		676	31 mm
XCKU085-2FBVA900I	Xilinx	FPGA	Ball	900	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190	676	0.95	Grid Array	BGA900,30X30,40	.922 V	1 mm	100 °C (212 °F)	62190 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B900	2.8 mm	31 mm		676	31 mm
XCKU085-1FBVA900I	Xilinx	FPGA	Ball	900	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190	676	0.95	Grid Array	BGA900,30X30,40	.922 V	1 mm	100 °C (212 °F)	62190 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B900	2.8 mm	31 mm		676	31 mm
XCKU025-2FBVA900C	Xilinx	FPGA	Ball	900	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180	312	0.95	Grid Array	BGA900,30X30,40	.922 V	1 mm	85 °C (185 °F)	18180 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B900	2.8 mm	31 mm		312	31 mm
XCKU085-L1FBVA900E	Xilinx	FPGA	Ball	900	BGA	Square	Plastic/Epoxy	1088325	Yes	.92 V	62190	676	0.9	Grid Array	BGA900,30X30,40	.88 V	1 mm	100 °C (212 °F)	62190 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B900	2.8 mm	31 mm	Also Operates at 0.95 V nominal supply	676	31 mm
XCKU115-L1FBVA900C	Xilinx	FPGA	Ball	900	BGA	Square	Plastic/Epoxy	1451100	Yes	.92 V	82920	832	0.9	Grid Array	BGA900,30X30,40	.88 V	1 mm	85 °C (185 °F)	82920 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B900	2.8 mm	31 mm	Also Operates at 0.95 V nominal supply	832	31 mm
XCKU115-1FBVA900I	Xilinx	FPGA	Ball	900	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920	832	0.95	Grid Array	BGA900,30X30,40	.922 V	1 mm	100 °C (212 °F)	82920 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B900	2.8 mm	31 mm		832	31 mm
XCKU025-L1FBVA900I	Xilinx	FPGA	Ball	900	BGA	Square	Plastic/Epoxy	318150	Yes	.92 V	18180	312	0.9	Grid Array	BGA900,30X30,40	.88 V	1 mm	100 °C (212 °F)	18180 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B900	2.8 mm	31 mm	Also Operates at 0.95 V nominal supply	312	31 mm
XCKU085-2FBVA900E	Xilinx	FPGA	Ball	900	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190	676	0.95	Grid Array	BGA900,30X30,40	.922 V	1 mm	100 °C (212 °F)	62190 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B900	2.8 mm	31 mm		676	31 mm
XCKU025-3FBVA900C	Xilinx	FPGA	Ball	900	BGA	Square	Plastic/Epoxy	318150	Yes	1.03 V	18180	312	1	Grid Array	BGA900,30X30,40	.97 V	1 mm	85 °C (185 °F)	18180 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B900	2.8 mm	31 mm		312	31 mm
XCKU060-1FBVA900E	Xilinx	FPGA	Ball	900	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460	624	0.95	Grid Array	BGA900,30X30,40	.922 V	1 mm	100 °C (212 °F)	41460 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B900	2.8 mm	31 mm		624	31 mm
XCKU040-L1FBVA900C	Xilinx	FPGA	Ball	900	BGA	Square	Plastic/Epoxy	530250	Yes	.92 V	30300	520	0.9	Grid Array	BGA900,30X30,40	.88 V	1 mm	85 °C (185 °F)	30300 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B900	2.8 mm	31 mm	Also Operates at 0.95 V nominal supply	520	31 mm
XCKU060-1FBVA900C	Xilinx	FPGA	Ball	900	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460	624	0.95	Grid Array	BGA900,30X30,40	.922 V	1 mm	85 °C (185 °F)	41460 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B900	2.8 mm	31 mm		624	31 mm
XCKU040-2FBVA900C	Xilinx	FPGA	Ball	900	BGA	Square	Plastic/Epoxy	530250	Yes	.979 V	30300	520	0.95	Grid Array	BGA900,30X30,40	.922 V	1 mm	85 °C (185 °F)	30300 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B900	2.8 mm	31 mm		520	31 mm
XCKU085-2FBVA900C	Xilinx	FPGA	Ball	900	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190	676	0.95	Grid Array	BGA900,30X30,40	.922 V	1 mm	85 °C (185 °F)	62190 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B900	2.8 mm	31 mm		676	31 mm
XCKU095-L1FBVA900E	Xilinx	FPGA	Ball	900	BGA	Square	Plastic/Epoxy	1176000	Yes	.92 V	67200	702	0.9	Grid Array	BGA900,30X30,40	.88 V	1 mm	100 °C (212 °F)	67200 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B900	2.8 mm	31 mm	Also Operates at 0.95 V nominal supply	702	31 mm
XCKU035-2FBVA900C	Xilinx	FPGA	Ball	900	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	25391	520	0.95	Grid Array	BGA900,30X30,40	.922 V	1 mm	85 °C (185 °F)	25391 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B900	2.8 mm	31 mm		520	31 mm
XCKU025-2FBVA900I	Xilinx	FPGA	Ball	900	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180	312	0.95	Grid Array	BGA900,30X30,40	.922 V	1 mm	100 °C (212 °F)	18180 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B900	2.8 mm	31 mm		312	31 mm
XCKU040-3FBVA900C	Xilinx	FPGA	Ball	900	BGA	Square	Plastic/Epoxy	530250	Yes	1.03 V	30300	520	1	Grid Array	BGA900,30X30,40	.97 V	1 mm	85 °C (185 °F)	30300 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B900	2.8 mm	31 mm		520	31 mm
XCKU115-3FBVA900C	Xilinx	FPGA	Ball	900	BGA	Square	Plastic/Epoxy	1451100	Yes	1.03 V	82920	832	1	Grid Array	BGA900,30X30,40	.97 V	1 mm	85 °C (185 °F)	82920 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B900	2.8 mm	31 mm		832	31 mm
XCKU095-1FBVA900C	Xilinx	FPGA	Ball	900	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200	702	0.95	Grid Array	BGA900,30X30,40	.922 V	1 mm	85 °C (185 °F)	67200 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B900	2.8 mm	31 mm		702	31 mm
XCKU115-L1FBVA900I	Xilinx	FPGA	Ball	900	BGA	Square	Plastic/Epoxy	1451100	Yes	.92 V	82920	832	0.9	Grid Array	BGA900,30X30,40	.88 V	1 mm	100 °C (212 °F)	82920 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B900	2.8 mm	31 mm	Also Operates at 0.95 V nominal supply	832	31 mm
XCKU115-L1FBVA900E	Xilinx	FPGA	Ball	900	BGA	Square	Plastic/Epoxy	1451100	Yes	.92 V	82920	832	0.9	Grid Array	BGA900,30X30,40	.88 V	1 mm	100 °C (212 °F)	82920 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B900	2.8 mm	31 mm	Also Operates at 0.95 V nominal supply	832	31 mm
XCKU115-2FBVA900I	Xilinx	FPGA	Ball	900	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920	832	0.95	Grid Array	BGA900,30X30,40	.922 V	1 mm	100 °C (212 °F)	82920 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B900	2.8 mm	31 mm		832	31 mm
XCKU095-3FBVA900C	Xilinx	FPGA	Ball	900	BGA	Square	Plastic/Epoxy	1176000	Yes	1.03 V	67200	702	1	Grid Array	BGA900,30X30,40	.97 V	1 mm	85 °C (185 °F)	67200 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B900	2.8 mm	31 mm		702	31 mm
XCKU085-3FBVA900I	Xilinx	FPGA	Ball	900	BGA	Square	Plastic/Epoxy	1088325	Yes	1.03 V	62190	676	1	Grid Array	BGA900,30X30,40	.97 V	1 mm	100 °C (212 °F)	62190 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B900	2.8 mm	31 mm		676	31 mm
XCKU035-L1FBVA900E	Xilinx	FPGA	Ball	900	BGA	Square	Plastic/Epoxy	444343	Yes	.92 V	25391	520	0.9	Grid Array	BGA900,30X30,40	.88 V	1 mm	100 °C (212 °F)	25391 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B900	2.8 mm	31 mm	Also Operates at 0.95 V nominal supply	520	31 mm
XCKU060-2FBVA900E	Xilinx	FPGA	Ball	900	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460	624	0.95	Grid Array	BGA900,30X30,40	.922 V	1 mm	100 °C (212 °F)	41460 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B900	2.8 mm	31 mm		624	31 mm
XCKU115-2FBVA900E	Xilinx	FPGA	Ball	900	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920	832	0.95	Grid Array	BGA900,30X30,40	.922 V	1 mm	100 °C (212 °F)	82920 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B900	2.8 mm	31 mm		832	31 mm
XCKU060-3FBVA900C	Xilinx	FPGA	Ball	900	BGA	Square	Plastic/Epoxy	725550	Yes	1.03 V	41460	624	1	Grid Array	BGA900,30X30,40	.97 V	1 mm	85 °C (185 °F)	41460 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B900	2.8 mm	31 mm		624	31 mm
XCKU025-3FBVA900E	Xilinx	FPGA	Ball	900	BGA	Square	Plastic/Epoxy	318150	Yes	1.03 V	18180	312	1	Grid Array	BGA900,30X30,40	.97 V	1 mm	100 °C (212 °F)	18180 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B900	2.8 mm	31 mm		312	31 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.