900 Field Programmable Gate Arrays (FPGA) 511

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC6SLX150T-3FG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	530		1.2	1.2,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	11519 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	862 MHz	30 s	530	225 °C (437 °F)	31 mm
XCV1000E-8FGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS	660	331776	1.8	1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	6144 CLBS, 331776 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	416 MHz	30 s	660	250 °C (482 °F)	31 mm
XCE7K325T-3FFG900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1		Grid Array			.97 V	1 mm		0.58 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm			e1		30 s		245 °C (473 °F)	31 mm
XCV812E-7FG900C	Xilinx	FPGA	Commercial	Ball	900	BGA	Square	Plastic/Epoxy	21168	Yes	1.89 V	4704	CMOS	556	254016	1.8	1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm	70 °C (158 °F)	0.42 ns	4704 CLBS, 254016 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	400 MHz	30 s	556	225 °C (437 °F)	31 mm
XC7K480T-1FF901I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	477760	Yes			CMOS	380			1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	4			No		e0	1818 MHz	30 s	380	225 °C (437 °F)
XC3S200-5FG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0					31 mm
XC7K355T-1FF901I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	356160	Yes			CMOS	300			1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	4			No		e0	1818 MHz	30 s	300	225 °C (437 °F)
XCE7K325T-2FBG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1		Grid Array			.97 V	1 mm		0.61 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900	4	2.54 mm	31 mm			e1		30 s		245 °C (473 °F)	31 mm
XCV1600E-7FG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	700	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	7776 CLBS, 419904 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	400 MHz	30 s	700	225 °C (437 °F)	31 mm
XC7K410T-2FF900C	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes			CMOS	500			1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	4			No		e0	1818 MHz	30 s	500	225 °C (437 °F)
XQ7K325T-L2RF900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic	326080	Yes	1.05 V	25475	HKMG	500		1	1 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.61 ns		-40 °C (-40 °F)		Bottom	S-PBGA-B900			31 mm	No			1286 MHz		500		31 mm
XCE7K410T-L2FFV900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes	.93 V	31775	HKMG	500		.9		Grid Array			.87 V	1 mm	100 °C (212 °F)	0.91 ns	31775 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm			e1			500		31 mm
XCKU3P-3FFVD900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	355950	Yes	.927 V	20340		304		0.9		Grid Array	BGA900,30X30,40		.873 V	1 mm	100 °C (212 °F)		20340 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm			e1		30 s	304	245 °C (473 °F)	31 mm
XC7K480T-3FFG901I	Xilinx	FPGA		Ball	900			Plastic/Epoxy		Yes								Grid Array									Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom		4			No		e1
XCE7K325T-1FBV900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	25475 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		2.54 mm	31 mm								31 mm
XC6SLX150-N3FGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	576		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	11519 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	806 MHz		576		31 mm
XCV600E-7FGG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS	512	186624	1.8	1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	3456 CLBS, 186624 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	400 MHz	30 s	512	250 °C (482 °F)	31 mm
XCV1600E-6FGG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	700	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	7776 CLBS, 419904 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	357 MHz	30 s	700	250 °C (482 °F)	31 mm
XCV1600E-8FGG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	700	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.4 ns	7776 CLBS, 419904 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	416 MHz	30 s	700	250 °C (482 °F)	31 mm
XCE7K325T-L2FFV900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	.93 V	25475				.9		Grid Array			.87 V	1 mm		0.91 ns	25475 CLBS			Bottom	S-PBGA-B900	4	3.35 mm	31 mm			e1					31 mm
XC7K325T-1FFV900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1		Grid Array			.97 V	1 mm		0.74 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900		3.35 mm	31 mm			e1					31 mm
XC3S400-4FG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0					31 mm
XC6SLX150-N3FGG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	576		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	806 MHz		576		31 mm
XCKU095-2FBVA900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702		0.95		Grid Array	BGA900,30X30,40		.922 V	1 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm						702		31 mm
XCKU085-L1FBVA900C	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	1088325	Yes	.92 V	62190		676		0.9		Grid Array	BGA900,30X30,40		.88 V	1 mm	85 °C (185 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm		Also Operates at 0.95 V nominal supply				676		31 mm
XCKU115-1FBVA900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920		832		0.95		Grid Array	BGA900,30X30,40		.922 V	1 mm	100 °C (212 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm						832		31 mm
XCKU060-3FBVA900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	725550	Yes	1.03 V	41460		624		1		Grid Array	BGA900,30X30,40		.97 V	1 mm	100 °C (212 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm						624		31 mm
XCKU025-1FBVA900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180		312		0.95		Grid Array	BGA900,30X30,40		.922 V	1 mm	100 °C (212 °F)		18180 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm						312		31 mm
XCKU085-L1FBVA900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	1088325	Yes	.92 V	62190		676		0.9		Grid Array	BGA900,30X30,40		.88 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm		Also Operates at 0.95 V nominal supply				676		31 mm
XCKU095-2FBVA900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702		0.95		Grid Array	BGA900,30X30,40		.922 V	1 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm						702		31 mm
XCKU115-3FBVA900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	1451100	Yes	1.03 V	82920		832		1		Grid Array	BGA900,30X30,40		.97 V	1 mm	100 °C (212 °F)		82920 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm						832		31 mm
XCKU095-1FBVA900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702		0.95		Grid Array	BGA900,30X30,40		.922 V	1 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm						702		31 mm
XCKU025-1FBVA900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180		312		0.95		Grid Array	BGA900,30X30,40		.922 V	1 mm	100 °C (212 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm						312		31 mm
XCKU060-L1FBVA900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	725550	Yes	.92 V	41460		624		0.9		Grid Array	BGA900,30X30,40		.88 V	1 mm	100 °C (212 °F)		41460 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm		Also Operates at 0.95 V nominal supply				624		31 mm
XCKU060-L1FBVA900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	725550	Yes	.92 V	41460		624		0.9		Grid Array	BGA900,30X30,40		.88 V	1 mm	100 °C (212 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm		Also Operates at 0.95 V nominal supply				624		31 mm
XCKU025-L1FBVA900C	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	318150	Yes	.92 V	18180		312		0.9		Grid Array	BGA900,30X30,40		.88 V	1 mm	85 °C (185 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm		Also Operates at 0.95 V nominal supply				312		31 mm
XCKU095-2FBVA900C	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702		0.95		Grid Array	BGA900,30X30,40		.922 V	1 mm	85 °C (185 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm						702		31 mm
XCKU115-1FBVA900C	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920		832		0.95		Grid Array	BGA900,30X30,40		.922 V	1 mm	85 °C (185 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm						832		31 mm
XCKU115-2FBVA900C	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920		832		0.95		Grid Array	BGA900,30X30,40		.922 V	1 mm	85 °C (185 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm						832		31 mm
XCKU060-3FBVA900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	725550	Yes	1.03 V	41460		624		1		Grid Array	BGA900,30X30,40		.97 V	1 mm	100 °C (212 °F)		41460 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm						624		31 mm
XCKU085-3FBVA900C	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	1088325	Yes	1.03 V	62190		676		1		Grid Array	BGA900,30X30,40		.97 V	1 mm	85 °C (185 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm						676		31 mm
XCKU085-2FBVA900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676		0.95		Grid Array	BGA900,30X30,40		.922 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm						676		31 mm
XCKU085-1FBVA900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676		0.95		Grid Array	BGA900,30X30,40		.922 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm						676		31 mm
XCKU025-2FBVA900C	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180		312		0.95		Grid Array	BGA900,30X30,40		.922 V	1 mm	85 °C (185 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm						312		31 mm
XCKU085-L1FBVA900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	1088325	Yes	.92 V	62190		676		0.9		Grid Array	BGA900,30X30,40		.88 V	1 mm	100 °C (212 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm		Also Operates at 0.95 V nominal supply				676		31 mm
XCKU115-L1FBVA900C	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	1451100	Yes	.92 V	82920		832		0.9		Grid Array	BGA900,30X30,40		.88 V	1 mm	85 °C (185 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm		Also Operates at 0.95 V nominal supply				832		31 mm
XCKU115-1FBVA900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920		832		0.95		Grid Array	BGA900,30X30,40		.922 V	1 mm	100 °C (212 °F)		82920 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm						832		31 mm
XCKU025-L1FBVA900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	318150	Yes	.92 V	18180		312		0.9		Grid Array	BGA900,30X30,40		.88 V	1 mm	100 °C (212 °F)		18180 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm		Also Operates at 0.95 V nominal supply				312		31 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.