900 Field Programmable Gate Arrays (FPGA) 511

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCZU9EG-3FFVC900I	Xilinx	FPGA SOC		Ball	900	BGA	Square	Plastic/Epoxy	599550	Yes		34260				0.9		Grid Array				1 mm	100 °C (212 °F)		34260 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm			e1					3.42 mm
XCV1000E-7FGG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS	660	331776	1.8	1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	6144 CLBS, 331776 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	400 MHz	30 s	660	250 °C (482 °F)	31 mm
XC3S400-4FGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V	896			400000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		896 CLBS, 40000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1		30 s		250 °C (482 °F)	31 mm
XC6SLX150-1LFGG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	500 MHz				31 mm
XC7K410T-2FB900C	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes			CMOS	500			1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	4			No		e0	1818 MHz	30 s	500	225 °C (437 °F)
XCV812E-7FG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	21168	Yes	1.89 V	4704	CMOS	556	254016	1.8	1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	4704 CLBS, 254016 Gates	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	400 MHz	30 s	556	225 °C (437 °F)	31 mm
XC7K355T-2FF901C	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	356160	Yes			CMOS	300			1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	4			No		e0	1818 MHz	30 s	300	225 °C (437 °F)
XC6SLX150-L1FG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	147443	Yes	1.05 V	11519	CMOS	576		1	1,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.46 ns	11519 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0		30 s	576	225 °C (437 °F)	31 mm
XC3S5000-5FG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	74880	Yes	1.26 V	8320	CMOS	633	5000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	8320 CLBS, 5000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	725 MHz	30 s	633	225 °C (437 °F)	31 mm
XCV600E-7FG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS	512	186624	1.8	1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	3456 CLBS, 186624 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	400 MHz	30 s	512	225 °C (437 °F)	31 mm
XC7Z045-L1FFG900I	Xilinx	FPGA SOC		Ball	900	BGA	Square	Plastic/Epoxy	350000	Yes	1.05 V	27325		492	5200000	1		Grid Array	BGA900,30X30,40		.95 V	1 mm	100 °C (212 °F)		27325 CLBS, 5200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm			e1			492		31 mm
XC3S5000-4FG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	74880	Yes	1.26 V	8320	CMOS	633	5000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	8320 CLBS, 5000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	630 MHz	30 s	633	225 °C (437 °F)	31 mm
XCV812E-6FG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	21168	Yes	1.89 V	4704	CMOS	556	254016	1.8	1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	4704 CLBS, 254016 Gates	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	357 MHz	30 s	556	225 °C (437 °F)	31 mm
XCKU5P-1FFVD900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120		304		0.85		Grid Array	BGA900,30X30,40		.825 V	1 mm	100 °C (212 °F)		27120 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm			e1		30 s	304	245 °C (473 °F)	31 mm
XCE7K325T-3FBG900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1		Grid Array			.97 V	1 mm		0.58 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900	4	2.54 mm	31 mm			e1		30 s		245 °C (473 °F)	31 mm
XC7K420T-3FF901E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	416960	Yes			CMOS	380			1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	4			No		e0	1818 MHz	30 s	380	225 °C (437 °F)
XC7K325T-L2FBV900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	.97 V	25475				.95		Grid Array			.93 V	1 mm		0.61 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900		2.54 mm	31 mm			e1					31 mm
XCE7K325T-1FBG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1		Grid Array			.97 V	1 mm		0.74 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900	4	2.54 mm	31 mm			e1		30 s		245 °C (473 °F)	31 mm
XCKU13P-L2FFVE900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	746550	Yes	.742 V	42660		304		0.72		Grid Array	BGA900,30X30,40		.698 V	1 mm	110 °C (230 °F)		42660 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm		Also Operates at 0.85 V nominal supply	e1		30 s	304	245 °C (473 °F)	31 mm
XC7K325T-L2FFV900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	.97 V	25475				.95		Grid Array			.93 V	1 mm		0.61 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900		3.35 mm	31 mm			e1					31 mm
XC7K420T-2FF901C	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	416960	Yes			CMOS	380			1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	4			No		e0	1818 MHz	30 s	380	225 °C (437 °F)
XC6SLX100T-3FG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS	498		1.2	1.2,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	7911 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	862 MHz	30 s	498	225 °C (437 °F)	31 mm
XC7K325T-L2FFV900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	.93 V	25475				.9		Grid Array			.87 V	1 mm		0.91 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900		3.35 mm	31 mm			e1					31 mm
XC6SLX150-2FG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	570		1.2	1.2,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	11519 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	667 MHz	30 s	570	225 °C (437 °F)	31 mm
XC7K410T-1FBV900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	31775				1		Grid Array			.97 V	1 mm		0.74 ns	31775 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900		2.54 mm	31 mm			e1					31 mm
XCKU3P-2FFVD900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	355950	Yes	.876 V	20340		304		0.85		Grid Array	BGA900,30X30,40		.825 V	1 mm	100 °C (212 °F)		20340 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm			e1		30 s	304	245 °C (473 °F)	31 mm
XCKU5P-2FFVD900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120		304		0.85		Grid Array	BGA900,30X30,40		.825 V	1 mm	100 °C (212 °F)		27120 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm			e1		30 s	304	245 °C (473 °F)	31 mm
XC6SLX150T-N3FGG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	540		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	806 MHz		540		31 mm
XC3S50-4FGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1					31 mm
XCKU5P-2FFVD900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120		304		0.85		Grid Array	BGA900,30X30,40		.825 V	1 mm	100 °C (212 °F)		27120 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm			e1		30 s	304	245 °C (473 °F)	31 mm
XCE7K410T-1FFG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	HKMG	500		1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	31775 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm			e1		30 s	500	245 °C (473 °F)	31 mm
XCKU040-3FBVA900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	530250	Yes	1.03 V	1920		520		1	1 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)		1920 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	2.8 mm	31 mm	No		e1		30 s	520	245 °C (473 °F)	31 mm
XC7Z100-L1FFG900I	Xilinx	FPGA SOC		Ball	900	BGA	Square	Plastic/Epoxy	444000	Yes	1.05 V	34675		492	6600000	1		Grid Array	BGA900,30X30,40		.95 V	1 mm	100 °C (212 °F)	1.27 ns	34675 CLBS, 6600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm		PL block operates in 0.97V to 1.03V supply	e1			492		31 mm
XCE7K325T-L2FFG900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	.93 V	25475				.9		Grid Array			.87 V	1 mm		0.91 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm			e1		30 s		245 °C (473 °F)	31 mm
XC7K325T-2FB900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	25475	CMOS	500		1	1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm		0.61 ns	25475 CLBS		Tin Lead	Bottom	S-PBGA-B900	4	2.54 mm	31 mm	No		e0	1818 MHz	30 s	500	225 °C (437 °F)	31 mm
XQ6SLX150-L1FG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	147443	Yes			CMOS	576			1,1.2/3.3,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	3			No		e0	500 MHz	30 s	576	225 °C (437 °F)
XC3S4000L-4FGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	62208	Yes		6912	CMOS	633	4000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		6912 CLBS, 4000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1		30 s	633	250 °C (482 °F)	31 mm
XCE7K410T-L2FFV900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes	.97 V	31775	HKMG	500		.95		Grid Array			.93 V	1 mm	100 °C (212 °F)	0.61 ns	31775 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm			e1			500		31 mm
XCE7K410T-3FFV900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	HKMG	500		1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.58 ns	31775 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm			e1			500		31 mm
XCE7K325T-1FFV900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	25475 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900	4	3.35 mm	31 mm			e1					31 mm
XCE7K325T-1FBV900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1		Grid Array			.97 V	1 mm		0.74 ns	25475 CLBS			Bottom	S-PBGA-B900		2.54 mm	31 mm								31 mm
XCKU035-3FBVA900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	444343	Yes	1.03 V	25391		520		1		Grid Array	BGA900,30X30,40		.97 V	1 mm	100 °C (212 °F)		25391 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	2.8 mm	31 mm			e1		30 s	520	245 °C (473 °F)	31 mm
XC6SLX150T-3NFG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	806 MHz				31 mm
XCV600E-8FG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS	512	186624	1.8	1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	3456 CLBS, 186624 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	416 MHz	30 s	512	225 °C (437 °F)	31 mm
XCE7K410T-3FBG900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	HKMG	500		1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.58 ns	31775 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	2.54 mm	31 mm			e1		30 s	500	245 °C (473 °F)	31 mm
XQZU9EG-L1FFRC900I	Xilinx	FPGA SOC		Ball	900	BGA	Square	Plastic/Epoxy	599550	Yes	.876 V	34260				0.85		Grid Array			.825 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B900	4	3.62 mm	31 mm			e0		40 s		245 °C (473 °F)	31 mm
XC6SLX150-L1FG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	147443	Yes	1.05 V	11519	CMOS	570		1	1,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.46 ns	11519 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0		30 s	570	225 °C (437 °F)	31 mm
XCKU5P-3FFVD900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	474600	Yes	.927 V	27120		304		0.9		Grid Array	BGA900,30X30,40		.873 V	1 mm	100 °C (212 °F)		27120 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm			e1		30 s	304	245 °C (473 °F)	31 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.