900 Field Programmable Gate Arrays (FPGA) 511

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCV600E-8FGG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS	512	186624	1.8	1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.4 ns	3456 CLBS, 186624 Gates		Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	416 MHz	30 s	512	250 °C (482 °F)	31 mm
XCV1000E-6FGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS	660	331776	1.8	1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	6144 CLBS, 331776 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	357 MHz	30 s	660	250 °C (482 °F)	31 mm
XC7K410T-L2FBV900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	.97 V	31775				.95		Grid Array			.93 V	1 mm		0.61 ns	31775 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900		2.54 mm	31 mm			e1					31 mm
XC3S4000L-4FG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	62208	Yes		6912	CMOS	633	4000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		6912 CLBS, 4000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0		30 s	633	225 °C (437 °F)	31 mm
XCE7K410T-2FBV900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	HKMG	500		1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	31775 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B900		2.54 mm	31 mm						500		31 mm
XC3S2000-5FG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	46080	Yes			CMOS	565			1.2,1.2/3.3,2.5 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	3			No		e0		30 s	565	225 °C (437 °F)
XC6SLX150-3NFGG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	806 MHz				31 mm
XC7K325T-1FFG900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V					1		Grid Array	BGA900,30X30,40		.97 V	1 mm	100 °C (212 °F)	0.74 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm	No		e1		30 s		245 °C (473 °F)	31 mm
XC7K410T-1LFBG900C	Xilinx	FPGA		Ball	900			Plastic/Epoxy		Yes								Grid Array									Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom		4			No		e1		30 s		245 °C (473 °F)
XC6SLX150-2FGG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	570		1.2	1.2,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	667 MHz	30 s	570	250 °C (482 °F)	31 mm
XC7K355T-1LFFG901C	Xilinx	FPGA		Ball	900			Plastic/Epoxy		Yes								Grid Array									Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom		4			No		e1
XC3S5000-4FG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	74880	Yes	1.26 V	8320	CMOS	633	5000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	8320 CLBS, 5000000 Gates		Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	630 MHz	30 s	633	225 °C (437 °F)	31 mm
XC7K410T-3FF900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes			CMOS	500			1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	4			No		e0	1818 MHz	30 s	500	225 °C (437 °F)
XC6SLX150T-2FG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	530		1.2	1.2,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	11519 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	667 MHz	30 s	530	225 °C (437 °F)	31 mm
XC7K325T-1LFFG900E	Xilinx	FPGA		Ball	900			Plastic/Epoxy		Yes								Grid Array									Tin Silver Copper	Bottom		4			No		e1
XCZU9EG-1LFFVC900I	Xilinx	FPGA SOC		Ball	900	BGA	Square	Plastic/Epoxy	599550	Yes		34260				0.85		Grid Array				1 mm	100 °C (212 °F)		34260 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm			e1		30 s		245 °C (473 °F)	3.42 mm
XC3S1500-4FGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1					31 mm
XC6SLX150T-4FG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	147443	Yes			CMOS	540			1.2,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0		30 s	540	225 °C (437 °F)	31 mm
XC3S50-5FGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1					31 mm
XC3S1000-5FGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1					31 mm
XC7K410T-1FFG900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V					1		Grid Array	BGA900,30X30,40		.97 V	1 mm	100 °C (212 °F)	0.74 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	2.54 mm	31 mm	No		e1					31 mm
XC3S4000-4FG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	62208	Yes	1.26 V	6912	CMOS	633	4000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	6912 CLBS, 4000000 Gates		Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	630 MHz	30 s	633	225 °C (437 °F)	31 mm
XC7K410T-3FBG900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	CMOS	500		1	1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm		0.58 ns	31775 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900	4	2.54 mm	31 mm	No		e1	1412 MHz	30 s	500	245 °C (473 °F)	31 mm
XC7K325T-3FF900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	326080	Yes			CMOS	500			1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	4			No		e0	1818 MHz	30 s	500	225 °C (437 °F)
XCE7K325T-1FFV900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1		Grid Array			.97 V	1 mm		0.74 ns	25475 CLBS			Bottom	S-PBGA-B900	4	3.35 mm	31 mm			e1					31 mm
XC6SLX100T-3NFGG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	806 MHz				31 mm
XCE7K410T-L2FBG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes	.97 V	31775	HKMG	500		.95		Grid Array			.93 V	1 mm	100 °C (212 °F)	0.61 ns	31775 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B900	4	2.54 mm	31 mm			e1		30 s	500	245 °C (473 °F)	31 mm
XC6SLX150T-4FGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	147443	Yes			CMOS	540			1.2,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1		30 s	540	250 °C (482 °F)	31 mm
XC7K410T-L2FFV900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	.97 V	31775				.95		Grid Array			.93 V	1 mm		0.61 ns	31775 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900		3.35 mm	31 mm			e1					31 mm
XCV1000E-7FG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS	660	331776	1.8	1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	6144 CLBS, 331776 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	400 MHz	30 s	660	225 °C (437 °F)	31 mm
XC3S400-4FG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array			1.14 V	1 mm			192 CLBS, 50000 Gates		Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0					31 mm
XCKU9P-3FFVE900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	599550	Yes	.927 V	34260		304		0.9		Grid Array	BGA900,30X30,40		.873 V	1 mm	100 °C (212 °F)		34260 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm			e1		30 s	304	245 °C (473 °F)	31 mm
XC6SLX150-3NFG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	806 MHz				31 mm
XC7K410T-1LFFG900I	Xilinx	FPGA		Ball	900			Plastic/Epoxy		Yes								Grid Array									Tin Silver Copper	Bottom		4			No		e1
XC7K325T-2LFFG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	326080	Yes	.93 V	25475		350		0.9		Grid Array	BGA900,30X30,40		.87 V	1 mm	100 °C (212 °F)	0.91 ns	25475 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm			e1		30 s	350	245 °C (473 °F)	31 mm
XC6SLX100T-3NFG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	806 MHz				31 mm
XCKU11P-2FFVD900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	653100	Yes	.876 V	37320		512		0.85		Grid Array	BGA900,30X30,40		.825 V	1 mm	100 °C (212 °F)		37320 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm			e1		30 s	512	245 °C (473 °F)	31 mm
XCV600E-7FGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS	512	186624	1.8	1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	3456 CLBS, 186624 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	400 MHz	30 s	512	250 °C (482 °F)	31 mm
XC7K325T-1FF900C	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	326080	Yes			CMOS	500			1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	4			No		e0	1818 MHz	30 s	500	225 °C (437 °F)
XC7K480T-L2FF901E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	477760	Yes			CMOS	380			0.9,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	4			No		e0	1286 MHz	30 s	380	225 °C (437 °F)
XCKU5P-L2FFVD900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	474600	Yes	.742 V	27120		304		0.72		Grid Array	BGA900,30X30,40		.698 V	1 mm	110 °C (230 °F)		27120 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm		Also Operates at 0.85 V nominal supply	e1			304		31 mm
XC7K325T-2FB900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	25475	CMOS	500		1	1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	25475 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B900	4	2.54 mm	31 mm	No		e0	1818 MHz	30 s	500	225 °C (437 °F)	31 mm
XC3S4000-5FG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	62208	Yes			CMOS	633			1.2,1.2/3.3,2.5 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	3			No		e0		30 s	633	225 °C (437 °F)
XC7K325T-2FFV900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	25475 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900		3.35 mm	31 mm			e1					31 mm
XC3S1500-5FGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1					31 mm
XCV1600E-7FG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	700	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	7776 CLBS, 419904 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	400 MHz	30 s	700	225 °C (437 °F)	31 mm
XC6SLX100T-3NFGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	806 MHz				31 mm
XCE7K325T-2FFV900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	25475 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900	4	3.35 mm	31 mm			e1					31 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.