900 Field Programmable Gate Arrays (FPGA) 511

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCE7K325T-L2FFG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	.97 V	25475				.95			Grid Array			.93 V	1 mm		0.61 ns	25475 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm			e1		30 s		245 °C (473 °F)	31 mm
XCKU040-3FBVA900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	530250	Yes	1.03 V	30300		520		1			Grid Array	BGA900,30X30,40		.97 V	1 mm	100 °C (212 °F)		30300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	2.8 mm	31 mm			e1		30 s	520	245 °C (473 °F)	31 mm
XC7K410T-L2FBG900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes	.93 V	31775	CMOS	500		.9		0.9,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.87 V	1 mm		0.91 ns	31775 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900	4	2.54 mm	31 mm	No	Also Operates at 1 V supply	e1		30 s	500	245 °C (473 °F)	31 mm
XC6SLX150-1LFG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2			Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	500 MHz				31 mm
XC7K410T-3FB900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes			CMOS	500				1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	4			No		e0	1818 MHz	30 s	500	225 °C (437 °F)
XCE7K410T-1FFV900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	HKMG	500		1			Grid Array			.97 V	1 mm	100 °C (212 °F)	0.74 ns	31775 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm			e1			500		31 mm
XCV600E-8FGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS	512	186624	1.8		1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	3456 CLBS, 186624 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	416 MHz	30 s	512	250 °C (482 °F)	31 mm
XCV1600E-7FGG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	700	419904	1.8		1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	7776 CLBS, 419904 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	400 MHz	30 s	700	250 °C (482 °F)	31 mm
XCKU11P-2FFVD900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	653100	Yes	.876 V	37320		512		0.85			Grid Array	BGA900,30X30,40		.825 V	1 mm	100 °C (212 °F)		37320 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm			e1		30 s	512	245 °C (473 °F)	31 mm
XC3S200-4FG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2			Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0					31 mm
XC6SLX150T-3NFGG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2			Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	806 MHz				31 mm
XCV812E-7FGG900C	Xilinx	FPGA	Commercial	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.89 V	4704	CMOS		254016	1.8			Grid Array			1.71 V	1 mm	70 °C (158 °F)	0.42 ns	4704 CLBS, 254016 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	400 MHz	30 s		250 °C (482 °F)	31 mm
XC6SLX150T-4FG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	147443	Yes			CMOS	540				1.2,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0		30 s	540	225 °C (437 °F)	31 mm
XCE7K410T-L2FBG900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes	.93 V	31775	HKMG	500		.9			Grid Array			.87 V	1 mm	100 °C (212 °F)	0.91 ns	31775 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	2.54 mm	31 mm			e1		30 s	500	245 °C (473 °F)	31 mm
XC6SLX100T-N3FGG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS	498		1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	7911 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	806 MHz		498		31 mm
XCKU3P-L2FFVD900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	355950	Yes	.742 V	20340		304		0.72			Grid Array	BGA900,30X30,40		.698 V	1 mm	110 °C (230 °F)		20340 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm		Also Operates at 0.85 V nominal supply	e1			304		31 mm
XC7K420T-L2FF901E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	416960	Yes			CMOS	380				0.9,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	4			No		e0	1286 MHz	30 s	380	225 °C (437 °F)
XC7K410T-1FFV900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	31775				1			Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	31775 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900		3.35 mm	31 mm			e1					31 mm
XC3S2000-4FG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	46080	Yes	1.26 V	5120	CMOS	565	2000000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	5120 CLBS, 2000000 Gates		Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	630 MHz	30 s	565	225 °C (437 °F)	31 mm
XC7K480T-1LFFG901C	Xilinx	FPGA		Ball	900			Plastic/Epoxy		Yes									Grid Array									Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom		4			No		e1
XCE7K410T-2FFG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	HKMG	500		1			Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	31775 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm			e1		30 s	500	245 °C (473 °F)	31 mm
XC7K325T-2FF900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	25475	CMOS	500		1		1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	25475 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B900		3.35 mm	31 mm	No		e0	1818 MHz		500		31 mm
XC7K325T-1FB900C	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	326080	Yes			CMOS	500				1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	4			No		e0	1818 MHz	30 s	500	225 °C (437 °F)
XCV1600E-8FG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	700	419904	1.8		1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	7776 CLBS, 419904 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	416 MHz	30 s	700	225 °C (437 °F)	31 mm
XC7K410T-2LFFG900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes	.93 V	31775		350		0.9			Grid Array	BGA900,30X30,40		.87 V	1 mm	100 °C (212 °F)	0.91 ns	31775 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm			e1			350		31 mm
XC3S1500-4FG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2			Grid Array			1.14 V	1 mm			192 CLBS, 50000 Gates		Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0					31 mm
XCV1000E-8FG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS	660	331776	1.8		1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.4 ns	6144 CLBS, 331776 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	416 MHz	30 s	660	225 °C (437 °F)	31 mm
XC3S200-5FGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2			Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1					31 mm
XC3S4000-4FGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	62208	Yes	1.26 V	6912	CMOS	633	4000000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	6912 CLBS, 4000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	630 MHz	30 s	633	250 °C (482 °F)	31 mm
XCE7K325T-2FFV900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1			Grid Array			.97 V	1 mm		0.61 ns	25475 CLBS			Bottom	S-PBGA-B900	4	3.35 mm	31 mm			e1					31 mm
XC3S1500-4FGG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2			Grid Array			1.14 V	1 mm			192 CLBS, 50000 Gates		Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1					31 mm
XCKU035-1LFBVA900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	1700	CMOS	468		0.95	Tray		Grid Array	BGA900,30X30,40		.922 V	1 mm	100 °C (212 °F)		1700 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	2.8 mm	31 mm			e1		30 s	468	245 °C (473 °F)	31 mm
XC3S1000-4FG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2			Grid Array			1.14 V	1 mm			192 CLBS, 50000 Gates		Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0					31 mm
XC6SLX100T-4FGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	101261	Yes			CMOS	498				1.2,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1		30 s	498	250 °C (482 °F)	31 mm
XCKU11P-3FFVD900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	653100	Yes	.927 V	37320		512		0.9			Grid Array	BGA900,30X30,40		.873 V	1 mm	100 °C (212 °F)		37320 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm			e1		30 s	512	245 °C (473 °F)	31 mm
XC6SLX100T-4FG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	101261	Yes			CMOS	498				1.2,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0		30 s	498	225 °C (437 °F)	31 mm
XCE7K325T-2FBG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1			Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	25475 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	2.54 mm	31 mm			e1		30 s		245 °C (473 °F)	31 mm
XCV812E-8FGG900C	Xilinx	FPGA	Commercial	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.89 V	4704	CMOS		254016	1.8			Grid Array			1.71 V	1 mm	70 °C (158 °F)	0.4 ns	4704 CLBS, 254016 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	416 MHz	30 s		250 °C (482 °F)	31 mm
XC7K325T-1FFV900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1			Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	25475 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900		3.35 mm	31 mm			e1					31 mm
XCE7K410T-1FBG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	HKMG	500		1			Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	31775 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	2.54 mm	31 mm			e1		30 s	500	245 °C (473 °F)	31 mm
XC7K325T-L2FB900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	326080	Yes			CMOS	500				0.9,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	4			No		e0	1286 MHz	30 s	500	225 °C (437 °F)
XC7K410T-1LFBG900E	Xilinx	FPGA		Ball	900			Plastic/Epoxy		Yes									Grid Array									Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom		4			No		e1		30 s		245 °C (473 °F)
XCE7K410T-2FBG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	HKMG	500		1			Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	31775 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	2.54 mm	31 mm			e1		30 s	500	245 °C (473 °F)	31 mm
XC6SLX150-3FG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	570		1.2		1.2,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	11519 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	862 MHz	30 s	570	225 °C (437 °F)	31 mm
XC7K410T-1LFFG900C	Xilinx	FPGA		Ball	900			Plastic/Epoxy		Yes									Grid Array									Tin Silver Copper	Bottom		4			No		e1
XCKU13P-2FFVE900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	746550	Yes	.876 V	42660		304		0.85			Grid Array	BGA900,30X30,40		.825 V	1 mm	100 °C (212 °F)		42660 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm			e1		30 s	304	245 °C (473 °F)	31 mm
XCKU040-1FBVA900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	530250	Yes	.979 V	1920		520		.95		0.95 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.922 V	1 mm	85 °C (185 °F)		1920 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	2.8 mm	31 mm	No		e1		30 s	520	245 °C (473 °F)	31 mm
XCKU11P-L2FFVD900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	653100	Yes	.742 V	37320		512		0.72			Grid Array	BGA900,30X30,40		.698 V	1 mm	110 °C (230 °F)		37320 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm		Also Operates at 0.85 V nominal supply	e1		30 s	512	245 °C (473 °F)	31 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.