900 Field Programmable Gate Arrays (FPGA) 511

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCE7K325T-1FBV900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	25475 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		2.54 mm	31 mm							31 mm
XC6SLX150-N3FGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	576		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	11519 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No	e1	806 MHz		576		31 mm
XCV600E-7FGG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS	512	186624	1.8	1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	3456 CLBS, 186624 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No	e1	400 MHz	30 s	512	250 °C (482 °F)	31 mm
XCV1600E-6FGG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	700	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	7776 CLBS, 419904 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No	e1	357 MHz	30 s	700	250 °C (482 °F)	31 mm
XCV1600E-8FGG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	700	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.4 ns	7776 CLBS, 419904 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No	e1	416 MHz	30 s	700	250 °C (482 °F)	31 mm
XCE7K325T-L2FFV900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	.93 V	25475				.9		Grid Array			.87 V	1 mm		0.91 ns	25475 CLBS			Bottom	S-PBGA-B900	4	3.35 mm	31 mm		e1					31 mm
XC7K325T-1FFV900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1		Grid Array			.97 V	1 mm		0.74 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900		3.35 mm	31 mm		e1					31 mm
XC3S400-4FG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No	e0					31 mm
XC6SLX150-N3FGG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	576		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No	e1	806 MHz		576		31 mm
XC6SLX150-3NFG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No	e0	806 MHz				31 mm
XC7K420T-1LFFG901I	Xilinx	FPGA		Ball	900			Plastic/Epoxy		Yes								Grid Array									Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom		4			No	e1
XCE7K410T-1FFG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	HKMG	500		1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.74 ns	31775 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm		e1		30 s	500	245 °C (473 °F)	31 mm
XC7K420T-1LFFG901C	Xilinx	FPGA		Ball	900			Plastic/Epoxy		Yes								Grid Array									Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom		4			No	e1
XC7K410T-1FBV900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	31775				1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	31775 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900		2.54 mm	31 mm		e1					31 mm
XC7Z035-L1FFG900I	Xilinx	FPGA SOC		Ball	900	BGA	Square	Plastic/Epoxy	275000	Yes	1.05 V	21487		492	4100000	1		Grid Array	BGA900,30X30,40		.95 V	1 mm	100 °C (212 °F)	1.27 ns	21487 CLBS, 4100000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm		e1			492		31 mm
XCE7K410T-2FFV900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	HKMG	500		1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	31775 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm		e1			500		31 mm
XCE7K410T-1FBV900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	HKMG	500		1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	31775 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		2.54 mm	31 mm					500		31 mm
XCE7K325T-2FFV900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	25475 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900	4	3.35 mm	31 mm		e1					31 mm
XC3S200-4FG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array			1.14 V	1 mm			192 CLBS, 50000 Gates		Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No	e0					31 mm
XC6SLX100T-2FG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS	498		1.2	1.2,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	7911 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No	e0	667 MHz	30 s	498	225 °C (437 °F)	31 mm
XC7K410T-1FBG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	CMOS	500		1	1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	31775 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	2.54 mm	31 mm	No	e1	1098 MHz	30 s	500	245 °C (473 °F)	31 mm
XCE7K325T-3FBV900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1		Grid Array			.97 V	1 mm		0.58 ns	25475 CLBS			Bottom	S-PBGA-B900		2.54 mm	31 mm							31 mm
XC7K480T-1FF901C	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	477760	Yes			CMOS	380			1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	4			No	e0	1818 MHz	30 s	380	225 °C (437 °F)
XCV1600E-7FGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	700	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	7776 CLBS, 419904 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No	e1	400 MHz	30 s	700	250 °C (482 °F)	31 mm
XC7K420T-3FFG901I	Xilinx	FPGA		Ball	900			Plastic/Epoxy		Yes								Grid Array									Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom		4			No	e1
XC7K325T-3FFV900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1		Grid Array			.97 V	1 mm		0.58 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900		3.35 mm	31 mm		e1					31 mm
XC7K325T-L2FF900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	326080	Yes			CMOS	500			0.9,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	4			No	e0	1286 MHz	30 s	500	225 °C (437 °F)
XC7K355T-1LFFG901I	Xilinx	FPGA		Ball	900			Plastic/Epoxy		Yes								Grid Array									Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom		4			No	e1
XC7K325T-1LFFG900C	Xilinx	FPGA		Ball	900			Plastic/Epoxy		Yes								Grid Array									Tin Silver Copper	Bottom		4			No	e1		30 s		245 °C (473 °F)
XC6SLX150-1LFGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No	e1	500 MHz				31 mm
XQ6SLX150T-2FG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	147443	Yes			CMOS	540			1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B900	3			No	e0	667 MHz	30 s	540	225 °C (437 °F)
XC3S4000-4FGG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	62208	Yes	1.26 V	6912	CMOS	633	4000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	6912 CLBS, 4000000 Gates		Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No	e1	630 MHz	30 s	633	250 °C (482 °F)	31 mm
XCE7K410T-L2FFG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes	.97 V	31775	HKMG	500		.95		Grid Array			.93 V	1 mm	100 °C (212 °F)	0.61 ns	31775 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm		e1		30 s	500	245 °C (473 °F)	31 mm
XC7K410T-2FBV900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	31775				1		Grid Array			.97 V	1 mm		0.61 ns	31775 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900		2.54 mm	31 mm		e1					31 mm
XCKU040-1FBVA900E	Xilinx	FPGA	Commercial Extended	Ball	900	BGA	Square	Plastic/Epoxy	530250	Yes	.979 V	30300		520		0.95		Grid Array	BGA900,30X30,40		.922 V	1 mm	100 °C (212 °F)		30300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	2.8 mm	31 mm		e1		30 s	520	245 °C (473 °F)	31 mm
XC7K410T-L2FB900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes			CMOS	500			0.9,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	4			No	e0	1286 MHz	30 s	500	225 °C (437 °F)
XQ6SLX150T-3FG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	147443	Yes			CMOS	540			1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B900	3			No	e0	862 MHz	30 s	540	225 °C (437 °F)
XC7K325T-3FBG900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	25475	CMOS	500		1	1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm		0.58 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900	4	2.54 mm	31 mm	No	e1	1412 MHz	30 s	500	245 °C (473 °F)	31 mm
XC7K325T-1FBG900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V					1		Grid Array	BGA900,30X30,40		.97 V	1 mm	100 °C (212 °F)	0.74 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	2.54 mm	31 mm	No	e1		30 s		245 °C (473 °F)	31 mm
XC7K480T-2FF901I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	477760	Yes			CMOS	380			1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	4			No	e0	1818 MHz	30 s	380	225 °C (437 °F)
XCV1600E-6FG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	700	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	7776 CLBS, 419904 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No	e0	357 MHz	30 s	700	225 °C (437 °F)	31 mm
XC3S400-5FG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No	e0					31 mm
XCE7K325T-L2FBV900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	.97 V	25475				.95		Grid Array			.93 V	1 mm		0.61 ns	25475 CLBS			Bottom	S-PBGA-B900		2.54 mm	31 mm							31 mm
XC7K355T-1FF901C	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	356160	Yes			CMOS	300			1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	4			No	e0	1818 MHz	30 s	300	225 °C (437 °F)
XC3S50-4FGG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array			1.14 V	1 mm			192 CLBS, 50000 Gates		Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No	e1					31 mm
XC6SLX150T-N3FGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	540		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	11519 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No	e1	806 MHz		540		31 mm
XC7K325T-2LFBG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	.93 V					0.9		Grid Array	BGA900,30X30,40		.87 V	1 mm	85 °C (185 °F)	0.61 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B900	4	2.54 mm	31 mm		e1		30 s		245 °C (473 °F)	31 mm
XC6SLX100T-3FGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS	490		1.2	1.2,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	7911 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No	e1	862 MHz	30 s	490	250 °C (482 °F)	31 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.