900 Field Programmable Gate Arrays (FPGA) 511

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XQZU9EG-2FFRC900I	Xilinx	FPGA SOC		Ball	900	BGA	Square	Plastic/Epoxy	599550	Yes	.876 V	34260				0.85		Grid Array			.825 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B900	4	3.62 mm	31 mm			e0		40 s		245 °C (473 °F)	31 mm
XCKU060-1FBVA900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460		624		0.95		Grid Array	BGA900,30X30,40		.922 V	1 mm	100 °C (212 °F)		41460 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm						624		31 mm
XCKU095-1FBVA900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702		0.95		Grid Array	BGA900,30X30,40		.922 V	1 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm						702		31 mm
XCKU095-3FBVA900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	1176000	Yes	1.03 V	67200		702		1		Grid Array	BGA900,30X30,40		.97 V	1 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm						702		31 mm
XCKU035-3FBVA900C	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	444343	Yes	1.03 V	25391		520		1		Grid Array	BGA900,30X30,40		.97 V	1 mm	85 °C (185 °F)		25391 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm						520		31 mm
XCKU025-L1FBVA900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	318150	Yes	.92 V	18180		312		0.9		Grid Array	BGA900,30X30,40		.88 V	1 mm	100 °C (212 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm		Also Operates at 0.95 V nominal supply				312		31 mm
XCKU085-1FBVA900C	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676		0.95		Grid Array	BGA900,30X30,40		.922 V	1 mm	85 °C (185 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm						676		31 mm
XCKU095-3FBVA900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	1176000	Yes	1.03 V	67200		702		1		Grid Array	BGA900,30X30,40		.97 V	1 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm						702		31 mm
XCKU025-3FBVA900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	318150	Yes	1.03 V	18180		312		1		Grid Array	BGA900,30X30,40		.97 V	1 mm	100 °C (212 °F)		18180 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm						312		31 mm
XCKU085-3FBVA900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	1088325	Yes	1.03 V	62190		676		1		Grid Array	BGA900,30X30,40		.97 V	1 mm	100 °C (212 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm						676		31 mm
XCKU060-2FBVA900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460		624		0.95		Grid Array	BGA900,30X30,40		.922 V	1 mm	100 °C (212 °F)		41460 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm						624		31 mm
XCKU085-1FBVA900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676		0.95		Grid Array	BGA900,30X30,40		.922 V	1 mm	100 °C (212 °F)		62190 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm						676		31 mm
XCKU115-3FBVA900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	1451100	Yes	1.03 V	82920		832		1		Grid Array	BGA900,30X30,40		.97 V	1 mm	100 °C (212 °F)		82920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm						832		31 mm
XCKU025-1FBVA900C	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180		312		0.95		Grid Array	BGA900,30X30,40		.922 V	1 mm	85 °C (185 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm						312		31 mm
XCKU095-L1FBVA900C	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	1176000	Yes	.92 V	67200		702		0.9		Grid Array	BGA900,30X30,40		.88 V	1 mm	85 °C (185 °F)		67200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm		Also Operates at 0.95 V nominal supply				702		31 mm
XCKU040-L1FBVA900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	530250	Yes	.92 V	30300		520		0.9		Grid Array	BGA900,30X30,40		.88 V	1 mm	100 °C (212 °F)		30300 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm		Also Operates at 0.95 V nominal supply				520		31 mm
XCKU095-L1FBVA900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	1176000	Yes	.92 V	67200		702		0.9		Grid Array	BGA900,30X30,40		.88 V	1 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm		Also Operates at 0.95 V nominal supply				702		31 mm
XCKU060-L1FBVA900C	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	725550	Yes	.92 V	41460		624		0.9		Grid Array	BGA900,30X30,40		.88 V	1 mm	85 °C (185 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm		Also Operates at 0.95 V nominal supply				624		31 mm
XCKU025-2FBVA900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180		312		0.95		Grid Array	BGA900,30X30,40		.922 V	1 mm	100 °C (212 °F)		18180 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm						312		31 mm
XCKU060-2FBVA900C	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460		624		0.95		Grid Array	BGA900,30X30,40		.922 V	1 mm	85 °C (185 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm						624		31 mm
XCKU035-L1FBVA900C	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	444343	Yes	.92 V	25391		520		0.9		Grid Array	BGA900,30X30,40		.88 V	1 mm	85 °C (185 °F)		25391 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		2.8 mm	31 mm		Also Operates at 0.95 V nominal supply				520		31 mm
XC7K410T-1LFFG900C	Xilinx	FPGA		Ball	900			Plastic/Epoxy		Yes								Grid Array									Tin Silver Copper	Bottom		4			No		e1
XCKU13P-2FFVE900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	746550	Yes	.876 V	42660		304		0.85		Grid Array	BGA900,30X30,40		.825 V	1 mm	100 °C (212 °F)		42660 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm			e1		30 s	304	245 °C (473 °F)	31 mm
XCKU040-1FBVA900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	530250	Yes	.979 V	1920		520		.95	0.95 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.922 V	1 mm	85 °C (185 °F)		1920 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	2.8 mm	31 mm	No		e1		30 s	520	245 °C (473 °F)	31 mm
XCKU11P-L2FFVD900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	653100	Yes	.742 V	37320		512		0.72		Grid Array	BGA900,30X30,40		.698 V	1 mm	110 °C (230 °F)		37320 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm		Also Operates at 0.85 V nominal supply	e1		30 s	512	245 °C (473 °F)	31 mm
XCZU9EG-3FFVC900I	Xilinx	FPGA SOC		Ball	900	BGA	Square	Plastic/Epoxy	599550	Yes		34260				0.9		Grid Array				1 mm	100 °C (212 °F)		34260 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm			e1					3.42 mm
XCV1000E-7FGG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS	660	331776	1.8	1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	6144 CLBS, 331776 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	400 MHz	30 s	660	250 °C (482 °F)	31 mm
XC3S400-4FGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V	896			400000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		896 CLBS, 40000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1		30 s		250 °C (482 °F)	31 mm
XC6SLX150-1LFGG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	500 MHz				31 mm
XC7K410T-2FB900C	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes			CMOS	500			1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	4			No		e0	1818 MHz	30 s	500	225 °C (437 °F)
XCV812E-7FG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	21168	Yes	1.89 V	4704	CMOS	556	254016	1.8	1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	4704 CLBS, 254016 Gates	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	400 MHz	30 s	556	225 °C (437 °F)	31 mm
XC7K355T-2FF901C	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	356160	Yes			CMOS	300			1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	4			No		e0	1818 MHz	30 s	300	225 °C (437 °F)
XC6SLX150-L1FG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	147443	Yes	1.05 V	11519	CMOS	576		1	1,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.46 ns	11519 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0		30 s	576	225 °C (437 °F)	31 mm
XC3S5000-5FG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	74880	Yes	1.26 V	8320	CMOS	633	5000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	8320 CLBS, 5000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	725 MHz	30 s	633	225 °C (437 °F)	31 mm
XCV600E-7FG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS	512	186624	1.8	1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	3456 CLBS, 186624 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	400 MHz	30 s	512	225 °C (437 °F)	31 mm
XC7Z045-L1FFG900I	Xilinx	FPGA SOC		Ball	900	BGA	Square	Plastic/Epoxy	350000	Yes	1.05 V	27325		492	5200000	1		Grid Array	BGA900,30X30,40		.95 V	1 mm	100 °C (212 °F)		27325 CLBS, 5200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm			e1			492		31 mm
XC3S5000-4FG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	74880	Yes	1.26 V	8320	CMOS	633	5000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	8320 CLBS, 5000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	630 MHz	30 s	633	225 °C (437 °F)	31 mm
XCV812E-6FG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	21168	Yes	1.89 V	4704	CMOS	556	254016	1.8	1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	4704 CLBS, 254016 Gates	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	357 MHz	30 s	556	225 °C (437 °F)	31 mm
XCKU5P-1FFVD900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120		304		0.85		Grid Array	BGA900,30X30,40		.825 V	1 mm	100 °C (212 °F)		27120 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm			e1		30 s	304	245 °C (473 °F)	31 mm
XCE7K325T-3FBG900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1		Grid Array			.97 V	1 mm		0.58 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900	4	2.54 mm	31 mm			e1		30 s		245 °C (473 °F)	31 mm
XC7K420T-3FF901E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	416960	Yes			CMOS	380			1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	4			No		e0	1818 MHz	30 s	380	225 °C (437 °F)
XC7K325T-L2FBV900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	.97 V	25475				.95		Grid Array			.93 V	1 mm		0.61 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900		2.54 mm	31 mm			e1					31 mm
XCE7K325T-1FBG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1		Grid Array			.97 V	1 mm		0.74 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900	4	2.54 mm	31 mm			e1		30 s		245 °C (473 °F)	31 mm
XCKU13P-L2FFVE900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	746550	Yes	.742 V	42660		304		0.72		Grid Array	BGA900,30X30,40		.698 V	1 mm	110 °C (230 °F)		42660 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm		Also Operates at 0.85 V nominal supply	e1		30 s	304	245 °C (473 °F)	31 mm
XC7K325T-L2FFV900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	.97 V	25475				.95		Grid Array			.93 V	1 mm		0.61 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900		3.35 mm	31 mm			e1					31 mm
XC7K420T-2FF901C	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	416960	Yes			CMOS	380			1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	4			No		e0	1818 MHz	30 s	380	225 °C (437 °F)
XC6SLX100T-3FG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS	498		1.2	1.2,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	7911 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	862 MHz	30 s	498	225 °C (437 °F)	31 mm
XC7K325T-L2FFV900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	.93 V	25475				.9		Grid Array			.87 V	1 mm		0.91 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900		3.35 mm	31 mm			e1					31 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.