957 Field Programmable Gate Arrays (FPGA) 109

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC2V3000-5BF957C	Xilinx	FPGA	Other	Ball	957	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS	684	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.39 ns	3584 CLBS, 3000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0	750 MHz	30 s	684	225 °C (437 °F)	40 mm
XC2V6000-6BFG957C	Xilinx	FPGA	Other	Ball	957	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS	684	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.35 ns	8448 CLBS, 6000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e1	820 MHz	30 s	684	245 °C (473 °F)	40 mm
XC2V6000-5BF957C	Xilinx	FPGA	Other	Ball	957	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS	684	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.39 ns	8448 CLBS, 6000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0	750 MHz	30 s	684	225 °C (437 °F)	40 mm
XC2V10000-6BF957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)		15360 CLBS, 10000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0		30 s		225 °C (437 °F)	40 mm
XC2V6000-4BFG957C	Xilinx	FPGA	Other	Ball	957	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS	684	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.44 ns	8448 CLBS, 6000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e1	650 MHz	30 s	684	245 °C (473 °F)	40 mm
XC2V4000-6BF957C	Xilinx	FPGA	Other	Ball	957	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS	684	4000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.35 ns	5760 CLBS, 4000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0	820 MHz	30 s	684	225 °C (437 °F)	40 mm
XC2V4000-6BF957I	Xilinx	FPGA		Ball	957	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS	684	4000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.35 ns	5760 CLBS, 4000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0	820 MHz	30 s	684	225 °C (437 °F)	40 mm
XC2VP50-8BFG957I	Xilinx	FPGA		Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	5648	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm			5648 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e1		30 s		245 °C (473 °F)	40 mm
XC2V8000-4BF957I	Xilinx	FPGA		Ball	957	HBGA	Square	Plastic/Epoxy	11648	Yes	1.575 V	11648	CMOS	1108	8000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array, Heat Sink/Slug	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.44 ns	11648 CLBS, 8000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0	650 MHz	30 s	1108	225 °C (437 °F)	40 mm
XC2V8000-5BF957I	Xilinx	FPGA		Ball	957	HBGA	Square	Plastic/Epoxy	11648	Yes	1.575 V	11648	CMOS	1108	8000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array, Heat Sink/Slug	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.39 ns	11648 CLBS, 8000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0	750 MHz	30 s	1108	225 °C (437 °F)	40 mm
XC2V3000-4BF957I	Xilinx	FPGA		Ball	957	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS	684	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.44 ns	3584 CLBS, 3000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0	650 MHz	30 s	684	225 °C (437 °F)	40 mm
XC2VP20-8BFG957I	Xilinx	FPGA		Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2320	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm			2320 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e1		30 s		245 °C (473 °F)	40 mm
XC2V8000-4BFG957I	Xilinx	FPGA		Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	11648	CMOS		8000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm		0.44 ns	11648 CLBS, 8000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e1	650 MHz	30 s		245 °C (473 °F)	40 mm
XC2VP20-6BFG957I	Xilinx	FPGA		Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2320	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm			2320 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e1		30 s		245 °C (473 °F)	40 mm
XC2V2000-6BG957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2688	CMOS		2000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)	0.35 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B957		3.5 mm	40 mm	No	e0	820 MHz				40 mm
XC2VP50-8BF957I	Xilinx	FPGA		Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	5648	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm			5648 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0		30 s		225 °C (437 °F)	40 mm
XC2V2000-6BF957I	Xilinx	FPGA		Ball	957	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS	624	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.35 ns	2688 CLBS, 2000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0	820 MHz	30 s	624	225 °C (437 °F)	40 mm
XC2V2000-5BF957I	Xilinx	FPGA		Ball	957	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS	624	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.39 ns	2688 CLBS, 2000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0	750 MHz	30 s	624	225 °C (437 °F)	40 mm
XC2V10000-5BFG957I	Xilinx	FPGA		Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm		0.39 ns	15360 CLBS, 10000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e1	880 MHz	30 s		245 °C (473 °F)	40 mm
XQ2V6000-5EF957I	Xilinx	FPGA		Ball	957	BGA	Square		76032	Yes	1.575 V	8448	CMOS	684	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.44 ns	8448 CLBS, 6000000 Gates		Tin Lead	Bottom	S-XBGA-B957	1	3.5 mm	40 mm	No	e0	650 MHz		684		40 mm
XC2V3000-4BF957C	Xilinx	FPGA	Other	Ball	957	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS	684	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.44 ns	3584 CLBS, 3000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0	650 MHz	30 s	684	225 °C (437 °F)	40 mm
XC2V4000-4BFG957I	Xilinx	FPGA		Ball	957	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS	684	4000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.44 ns	5760 CLBS, 4000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e1	650 MHz	30 s	684	245 °C (473 °F)	40 mm
XC2VP50-8BF957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	5648	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)		5648 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0		30 s		225 °C (437 °F)	40 mm
XC2VP20-8BFG957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2320	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)		2320 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e1		30 s		245 °C (473 °F)	40 mm
XC2V10000-6BF957I	Xilinx	FPGA		Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm			15360 CLBS, 10000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0		30 s		225 °C (437 °F)	40 mm
XC2V2000-4BGG957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2688	CMOS		2000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)	0.44 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B957		3.5 mm	40 mm	No	e1	650 MHz				40 mm
XC2VP50-7BF957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	5648	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)		5648 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0		30 s		225 °C (437 °F)	40 mm
XC2VP50-7BFG957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	5648	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)		5648 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e1		30 s		245 °C (473 °F)	40 mm
XC2V2000-5BF957C	Xilinx	FPGA	Other	Ball	957	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS	624	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.39 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0	750 MHz	30 s	624	225 °C (437 °F)	40 mm
XC2V10000-4BFG957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)	0.45 ns	15360 CLBS, 10000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e1	765 MHz	30 s		245 °C (473 °F)	40 mm
XC2V4000-5BF957C	Xilinx	FPGA	Other	Ball	957	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS	684	4000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.39 ns	5760 CLBS, 4000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0	750 MHz	30 s	684	225 °C (437 °F)	40 mm
XC2V10000-4BF957I	Xilinx	FPGA		Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm		0.45 ns	15360 CLBS, 10000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0	765 MHz	30 s		225 °C (437 °F)	40 mm
XC2V10000-4BFG957I	Xilinx	FPGA		Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm		0.45 ns	15360 CLBS, 10000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e1	765 MHz	30 s		245 °C (473 °F)	40 mm
XC2V2000-5BGG957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2688	CMOS		2000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)	0.39 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B957		3.5 mm	40 mm	No	e1	750 MHz				40 mm
XC2V2000-5BFG957C	Xilinx	FPGA	Other	Ball	957	BGA	Square	Plastic/Epoxy		Yes	1.575 V	2688	CMOS		2000000	1.5		Grid Array			1.425 V	1.27 mm	85 °C (185 °F)	0.39 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e1	750 MHz	30 s		245 °C (473 °F)	40 mm
XC2V2000-5BGG957I	Xilinx	FPGA		Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2688	CMOS		2000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm		0.39 ns	2688 CLBS, 2000000 Gates		Tin Silver Copper	Bottom	S-PBGA-B957		3.5 mm	40 mm	No	e1	750 MHz				40 mm
XC2VP20-7BF957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2320	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)		2320 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0		30 s		225 °C (437 °F)	40 mm
XC2V10000-5BFG957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)	0.39 ns	15360 CLBS, 10000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e1	880 MHz	30 s		245 °C (473 °F)	40 mm
XC2VP50-6BFG957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	5648	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)		5648 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e1		30 s		245 °C (473 °F)	40 mm
XC2V2000-6BG957I	Xilinx	FPGA		Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2688	CMOS		2000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm		0.35 ns	2688 CLBS, 2000000 Gates		Tin Lead	Bottom	S-PBGA-B957		3.5 mm	40 mm	No	e0	820 MHz				40 mm
XC2VP20-8BF957I	Xilinx	FPGA		Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2320	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm			2320 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0		30 s		225 °C (437 °F)	40 mm
XC2V2000-4BFG957I	Xilinx	FPGA		Ball	957	BGA	Square	Plastic/Epoxy		Yes	1.575 V	2688	CMOS		2000000	1.5		Grid Array			1.425 V	1.27 mm		0.44 ns	2688 CLBS, 2000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e1	650 MHz	30 s		245 °C (473 °F)	40 mm
XC2V3000-4BFG957C	Xilinx	FPGA	Other	Ball	957	BGA	Square	Plastic/Epoxy		Yes	1.575 V	3584	CMOS		3000000	1.5		Grid Array			1.425 V	1.27 mm	85 °C (185 °F)	0.44 ns	3584 CLBS, 3000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e1	650 MHz	30 s		245 °C (473 °F)	40 mm
XC2V2000-6BF957C	Xilinx	FPGA	Other	Ball	957	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS	624	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.35 ns	2688 CLBS, 2000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0	820 MHz	30 s	624	225 °C (437 °F)	40 mm
XC2V4000-4BFG957C	Xilinx	FPGA	Other	Ball	957	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS	684	4000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.44 ns	5760 CLBS, 4000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e1	650 MHz	30 s	684	245 °C (473 °F)	40 mm
XC2V6000-6BFG957I	Xilinx	FPGA		Ball	957	BGA	Square	Plastic/Epoxy		Yes	1.575 V	8448	CMOS		6000000	1.5		Grid Array			1.425 V	1.27 mm		0.35 ns	8448 CLBS, 6000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e1	820 MHz	30 s		245 °C (473 °F)	40 mm
XC2V8000-5BF957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy	11648	Yes	1.575 V	11648	CMOS	1108	8000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array, Heat Sink/Slug	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.39 ns	11648 CLBS, 8000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0	750 MHz	30 s	1108	225 °C (437 °F)	40 mm
XC2V3000-6BF957C	Xilinx	FPGA	Other	Ball	957	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS	684	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.35 ns	3584 CLBS, 3000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0	820 MHz	30 s	684	225 °C (437 °F)	40 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.