LBGA Field Programmable Gate Arrays (FPGA) 1,674

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC40200XV-9BG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy		Yes	2.7 V	7056	CMOS			130000	2.5		Grid Array, Low Profile			2.3 V	1.27 mm		1.2 ns	7056 CLBS, 130000 Gates		Tin Lead	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	188 MHz				42.5 mm
XC4062XL-1BG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy	2304	Yes	3.6 V	2304	CMOS		384	40000	3.3	3.3 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.3 ns	2304 CLBS, 40000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Max usable 62000 Logic gates	e0	200 MHz	30 s	384	225 °C (437 °F)	42.5 mm
XC4036XL-1BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS			22000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.3 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Max usable 36000 Logic gates	e1	200 MHz	30 s		260 °C (500 °F)	35 mm
XCV600-6BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy	15552	Yes	2.625 V	3456	CMOS		404	661111	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	85 °C (185 °F)	0.6 ns	3456 CLBS, 661111 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	333 MHz	30 s	404	225 °C (437 °F)	42.5 mm
XCV812E-8BGG560I	Xilinx	FPGA	Industrial	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	1.89 V	4704	CMOS			254016	1.8		Grid Array, Low Profile			1.71 V	1.27 mm	85 °C (185 °F)	0.4 ns	4704 CLBS, 254016 Gates	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	416 MHz	30 s		260 °C (500 °F)	42.5 mm
XC4044XL-3BG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	1600	Yes	3.6 V	1600	CMOS		320	27000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.6 ns	1600 CLBS, 27000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 44000 Logic gates	e0	166 MHz	30 s	320	225 °C (437 °F)	40 mm
XC4085XLA-08BGG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS			55000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 180000 gates	e1	263 MHz	30 s		260 °C (500 °F)	40 mm
5962-9957401NUA	Xilinx	FPGA	Military	Ball	560	LBGA	Square	Plastic/Epoxy	27648	Yes	2.625 V	6144	CMOS	MIL-PRF-38535	404	1124022	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA560,31X31,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	1124022 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B560		1.7 mm	42.5 mm	Yes		e0			404		42.5 mm
XCV150-5BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy	3888	Yes	2.625 V	864	CMOS		260	164674	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	2.375 V	1.27 mm		0.7 ns	864 CLBS, 164674 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	294 MHz	30 s	260	225 °C (437 °F)	35 mm
XC4044XL-1BG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	1600	Yes	3.6 V	1600	CMOS		320	27000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.3 ns	1600 CLBS, 27000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 44000 Logic gates	e0	200 MHz	30 s	320	225 °C (437 °F)	40 mm
XCV150-5BGG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	864	CMOS			164674	2.5		Grid Array, Low Profile			2.375 V	1.27 mm		0.7 ns	864 CLBS, 164674 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	294 MHz	30 s		260 °C (500 °F)	35 mm
XC40150XV-8BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	2.7 V	5184	CMOS			100000	2.5		Grid Array, Low Profile			2.3 V	1.27 mm	85 °C (185 °F)	1.1 ns	5184 CLBS, 100000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B560		1.7 mm	42.5 mm	No			217 MHz				42.5 mm
XCV405E-7BGG560I	Xilinx	FPGA	Industrial	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	1.89 V	2400	CMOS			129600	1.8		Grid Array, Low Profile			1.71 V	1.27 mm	85 °C (185 °F)	0.42 ns	2400 CLBS, 129600 Gates	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	400 MHz	30 s		260 °C (500 °F)	42.5 mm
XA3S200-4FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	4320	Yes	1.26 V	480		AEC-Q100	173	200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)		480 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	125 MHz	30 s	173	260 °C (500 °F)	17 mm
XC6SLX9-3NFTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Low Profile			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	806 MHz				17 mm
XC4085XLA-09BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS			55000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 180000 gates	e1	227 MHz	30 s		260 °C (500 °F)	42.5 mm
XC6SLX16-N3FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS		186		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	1139 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	806 MHz	30 s	186	225 °C (437 °F)	17 mm
XC6SLX9-3NFT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Low Profile			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	806 MHz				17 mm
XC4028EX-4BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy	1024	Yes		1024	CMOS		256	18000	5	5 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays		1.27 mm			1024 CLBS, 18000 Gates		Tin Lead	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Max usable 28000 Logic gates	e0	143 MHz	30 s	256	225 °C (437 °F)	35 mm
XCV600-6BGG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	3456	CMOS			661111	2.5		Grid Array, Low Profile			2.375 V	1.27 mm		0.6 ns	3456 CLBS, 661111 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1	333 MHz	30 s		260 °C (500 °F)	40 mm
XC4052XL-1BG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	1936	Yes	3.6 V	1936	CMOS		352	33000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.3 ns	1936 CLBS, 33000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 52000 Logic gates	e0	200 MHz	30 s	352	225 °C (437 °F)	40 mm
XCV200-4BGG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	1176	CMOS			236666	2.5		Grid Array, Low Profile			2.375 V	1.27 mm		0.8 ns	1176 CLBS, 236666 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	250 MHz	30 s		260 °C (500 °F)	35 mm
XC4085XL-3BG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	7448	Yes	3.6 V	3136	CMOS		352	55000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.6 ns	3136 CLBS, 55000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 85000 Logic gates	e0	166 MHz	30 s	352	225 °C (437 °F)	40 mm
XC4085XL-2BG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	7448	Yes	3.6 V	3136	CMOS		352	55000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.5 ns	3136 CLBS, 55000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 85000 Logic gates	e0	179 MHz	30 s	352	225 °C (437 °F)	40 mm
XC4062XLTBG432	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	5472	Yes	3.6 V	2304	CMOS			40000	3.3		Grid Array, Low Profile			3 V	1.27 mm			2304 CLBS, 40000 Gates		Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0					40 mm
XC4044XL-1BGG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS			27000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.3 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 44000 Logic gates	e1	200 MHz	30 s		260 °C (500 °F)	40 mm
XC4028XLA-09BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy	1024	Yes	3.6 V	1024	CMOS		256	18000	3.3	3.3 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 50000 gates	e0	227 MHz	30 s	256	225 °C (437 °F)	35 mm
XCV300-4BGG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS			322970	2.5		Grid Array, Low Profile			2.375 V	1.27 mm	85 °C (185 °F)	0.8 ns	1536 CLBS, 322970 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1	250 MHz	30 s		260 °C (500 °F)	40 mm
XA3S1000-4FTG256Q	Xilinx	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy	17280	Yes	1.26 V	1920		AEC-Q100	391	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		1920 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	125 MHz	30 s	391	260 °C (500 °F)	17 mm
XC3S400AN-5FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS		195	400000	1.2	1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	896 CLBS, 400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	770 MHz	30 s	160	240 °C (464 °F)	17 mm
XC4036XL-1BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy	1296	Yes	3.6 V	1296	CMOS		288	22000	3.3	3.3 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.3 ns	1296 CLBS, 22000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Max usable 36000 Logic gates	e0	200 MHz	30 s	288	225 °C (437 °F)	35 mm
XC40200XV-08BG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy	7056	Yes	2.7 V	7056	CMOS		448	130000	2.5	2.5,3.3 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	2.3 V	1.27 mm		1.1 ns	7056 CLBS, 130000 Gates		Tin Lead	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 400000 gates	e0	258 MHz	30 s	448	225 °C (437 °F)	42.5 mm
XC3S250E-5FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS		172	250000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.66 ns	612 CLBS, 250000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	657 MHz		132		17 mm
XH4028XLBGG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes			CMOS				3.3		Grid Array, Low Profile				1.27 mm					Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1					35 mm
XC4052XLA-08BGG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1 ns	1936 CLBS, 33000 Gates		Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 100000 gates	e1	263 MHz	30 s		260 °C (500 °F)	35 mm
XCV400-4BG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy	10800	Yes	2.625 V	2400	CMOS		404	468252	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	2.375 V	1.27 mm		0.8 ns	2400 CLBS, 468252 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	250 MHz	30 s	404	225 °C (437 °F)	42.5 mm
XC4062XLA-09BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS			40000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 130000 gates	e1	227 MHz	30 s		260 °C (500 °F)	42.5 mm
XCV1000-5FG680I	Xilinx	FPGA		Ball	680	LBGA	Square	Plastic/Epoxy	27648	Yes	2.625 V	6144	CMOS		512	1124022	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA680,39X39,40	Field Programmable Gate Arrays	2.375 V	1 mm		0.7 ns	6144 CLBS, 1124022 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B680	3	1.7 mm	40 mm	No		e0	294 MHz	30 s	512	225 °C (437 °F)	40 mm
XCV300-5BG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS			322970	2.5		Grid Array, Low Profile			2.375 V	1.27 mm		0.5 ns	1536 CLBS, 322970 Gates		Tin Lead	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0					42.5 mm
XCV200-5BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176	CMOS		260	236666	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	85 °C (185 °F)	0.7 ns	1176 CLBS, 236666 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	294 MHz	30 s	260	225 °C (437 °F)	35 mm
XCV300E-7BGG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS		316	82944	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.42 ns	1536 CLBS, 82944 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1	400 MHz	30 s	316	260 °C (500 °F)	40 mm
XCV812E-8BG560I	Xilinx	FPGA	Industrial	Ball	560	LBGA	Square	Plastic/Epoxy	21168	Yes	1.89 V	4704	CMOS		404	254016	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.4 ns	4704 CLBS, 254016 Gates	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	416 MHz	30 s	404	225 °C (437 °F)	42.5 mm
XC40150XV-09BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy	5184	Yes	2.7 V	5184	CMOS		448	100000	2.5	2.5,3.3 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	2.3 V	1.27 mm	85 °C (185 °F)	1.3 ns	5184 CLBS, 100000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 300000 gates	e0	225 MHz	30 s	448	225 °C (437 °F)	42.5 mm
XC4036XLA-07BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	1296	Yes	3.6 V	1296	CMOS		288	22000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	0.9 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 65000 gates	e0	294 MHz	30 s	288	225 °C (437 °F)	40 mm
XC40110XV-8BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	2.7 V	4096	CMOS			75000	2.5		Grid Array, Low Profile			2.3 V	1.27 mm	85 °C (185 °F)	1.1 ns	4096 CLBS, 75000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	217 MHz				42.5 mm
XC6SLX16-3NFT256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Low Profile			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	806 MHz	30 s		225 °C (437 °F)	17 mm
XC3S400AN-4FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS		195	400000	1.2	1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	896 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	667 MHz		160		17 mm
XC4052XLA-08BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy	4598	Yes	3.6 V	1936	CMOS		289	33000	3.3	3.3 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	3 V	1.27 mm		1 ns	1936 CLBS, 33000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 100000 gates	e0	263 MHz	30 s	289	225 °C (437 °F)	35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.