LBGA Field Programmable Gate Arrays (FPGA) 1,674

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP3C10F256I8N	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	10320	Yes	1.25 V		CMOS	182	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e1			182		17 mm
EP2C15AF256I8N	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	14448	Yes	1.25 V	903	CMOS	152	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm		903 CLBS		Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also requires 3.3 V supply	e1	402.5 MHz	30 s	144	260 °C (500 °F)	17 mm
EP4CGX15DF14C8	Altera	FPGA	Other	Ball	169	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B169		1.55 mm	14 mm								14 mm
EP3C16F256I6N	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	15408	Yes	1.25 V		CMOS	168	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e1			168		17 mm
5CEFA2F17C6	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm								17 mm
5CEBA2F17A7	Altera	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile			1.07 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm								17 mm
EP2C8F256C6	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	8256	Yes	1.25 V	516	CMOS	182	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	516 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also requires 3.3 V supply	e0	500 MHz	20 s	174	235 °C (455 °F)	17 mm
EP4CGX30DF14C6N	Altera	FPGA	Other	Ball	169	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B169		1.55 mm	14 mm								14 mm
EP4CGX30CF19C7N	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy	29440	Yes	1.24 V	1840		150	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA324,18X18,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)	1840 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.55 mm	19 mm	No		e1	472.5 MHz	30 s	150	260 °C (500 °F)	19 mm
EP3C10F256C6	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	10320	Yes	1.25 V	10320	CMOS	182	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	10320 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz	20 s	182	235 °C (455 °F)	17 mm
EP4CGX15CF14C7N	Altera	FPGA	Other	Ball	169	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B169		1.55 mm	14 mm								14 mm
EP4CGX22BF19I7	Altera	FPGA		Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm					Bottom	S-PBGA-B324		1.55 mm	19 mm								19 mm
EP2C5AF256I8N	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.25 V	288			1.2		Grid Array, Low Profile			1.15 V	1 mm		288 CLBS		Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	402.5 MHz				17 mm
EP4CGX30DF19C8	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	19 mm								19 mm
EP3C10F256C8	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	10320	Yes	1.25 V	10320	CMOS	182	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	10320 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz	20 s	182	235 °C (455 °F)	17 mm
EP4CGX30DF19C6	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	19 mm								19 mm
EP4CGX30CF19C8	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy	29440	Yes	1.24 V	1840		150	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA324,18X18,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)	1840 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	1.55 mm	19 mm	No		e0	472.5 MHz	20 s	150	220 °C (428 °F)	19 mm
EP3C10F256I6N	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	10320	Yes	1.25 V		CMOS	182	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e1			182		17 mm
EP4CGX22CF14I7N	Altera	FPGA		Ball	169	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm					Bottom	S-PBGA-B169		1.55 mm	14 mm								14 mm
EP4CGX30CF14C8N	Altera	FPGA	Other	Ball	169	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B169		1.55 mm	14 mm								14 mm
EP4CGX30CF14I7N	Altera	FPGA		Ball	169	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm					Bottom	S-PBGA-B169		1.55 mm	14 mm								14 mm
EP4CGX22BF19C7	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	19 mm								19 mm
EP3C25F256C7	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	156	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	24624 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz	20 s	156	235 °C (455 °F)	17 mm
EP2C20AF256A7N	Altera	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.25 V	1172			1.2		Grid Array, Low Profile			1.15 V	1 mm	125 °C (257 °F)	1172 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	450 MHz	40 s		260 °C (500 °F)	17 mm
EP4CGX22CF14C8	Altera	FPGA	Other	Ball	169	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B169		1.55 mm	14 mm								14 mm
EP4CGX30BF19I7	Altera	FPGA		Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm					Bottom	S-PBGA-B324		1.55 mm	19 mm								19 mm
EP4CE22F17C8	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	22320	Yes	1.25 V	1395		153	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	1395 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz		153		17 mm
EP3C10F256I8	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	10320	Yes	1.25 V		CMOS	182	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm				Tin Lead	Bottom	S-PBGA-B256	1	1.55 mm	17 mm	No		e0			182		17 mm
5CEBA4F17C8	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm								17 mm
EP4CGX30DF14I7	Altera	FPGA		Ball	169	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm					Bottom	S-PBGA-B169		1.55 mm	14 mm								14 mm
EP4CE6F17C6	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	6272	Yes	1.25 V	392		179	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	392 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz		179		17 mm
EP4CE40F19A7N	Altera	FPGA	Automotive	Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B324		1.55 mm	19 mm								19 mm
EP4CGX22CF14C7	Altera	FPGA	Other	Ball	169	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B169		1.55 mm	14 mm								14 mm
EP2C20AF256C8N	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.25 V		CMOS		1.2		Grid Array, Low Profile			1.15 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No	Also requires 3.3 V supply	e1					17 mm
EP4CGX22BF19I7N	Altera	FPGA		Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm					Bottom	S-PBGA-B324		1.55 mm	19 mm								19 mm
EP4CE10F17C6	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	10320	Yes	1.25 V	645		179	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	645 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz		179		17 mm
EP4CGX22BF19C7N	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	19 mm								19 mm
EP4CGX15CF14C8N	Altera	FPGA	Other	Ball	169	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B169		1.55 mm	14 mm								14 mm
EP4CE6F17I8L	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	6272	Yes	1.03 V	392		179	1	1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	.97 V	1 mm		392 CLBS		Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	362 MHz		179		17 mm
5CEBA4F17C7	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm								17 mm
EP2C8AF256A7N	Altera	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.25 V	516			1.2		Grid Array, Low Profile			1.15 V	1 mm	125 °C (257 °F)	516 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	450 MHz	40 s		260 °C (500 °F)	17 mm
EP2C15AF256C6N	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	14448	Yes	1.25 V	903	CMOS	152	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	903 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also requires 3.3 V supply	e1	500 MHz	30 s	144	260 °C (500 °F)	17 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.