LBGA Field Programmable Gate Arrays (FPGA) 1,674

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP3C10F256I6	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	10320	Yes	1.25 V		CMOS	182	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm				Tin Lead	Bottom	S-PBGA-B256	1	1.55 mm	17 mm	No		e0			182		17 mm
EP2C20F256I8	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	18752	Yes	1.25 V	1172	CMOS	152	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm		1172 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also requires 3.3 V supply	e0	402.5 MHz	20 s	136	235 °C (455 °F)	17 mm
5CEBA2F17C7	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm								17 mm
EP4CGX30DF19C7N	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	19 mm								19 mm
EP2C15AF256C7N	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	14448	Yes	1.25 V	903	CMOS	152	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	903 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also requires 3.3 V supply	e1	450 MHz	30 s	144	260 °C (500 °F)	17 mm
5CEFA2F17C8	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm								17 mm
EP2C8F256C7	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	8256	Yes	1.25 V	516	CMOS	182	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	516 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also requires 3.3 V supply	e0	450 MHz	20 s	174	235 °C (455 °F)	17 mm
5CEFA2F17C8N	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm								17 mm
EP4CE6F17A7	Altera	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm								17 mm
EP4CGX22BF19C8	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	19 mm								19 mm
EP3C10F256C7	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	10320	Yes	1.25 V	10320	CMOS	182	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	10320 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz	20 s	182	235 °C (455 °F)	17 mm
EP2C5F256C7	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	4608	Yes	1.25 V	288	CMOS	158	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	288 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also requires 3.3 V supply	e0	450 MHz	20 s	150	235 °C (455 °F)	17 mm
EP3C5F256A7	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	5136	Yes	1.25 V	5136	CMOS	182	1.2	1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm		5136 CLBS			Bottom	S-PBGA-B256		1.55 mm	17 mm	No					182		17 mm
EP2C5F256I7	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	4608	Yes	1.25 V	312	CMOS	158	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm		312 CLBS		Tin Lead	Bottom	S-PBGA-B256		1.55 mm	17 mm	No	Also requires 3.3 V supply	e0			150		17 mm
EP2C20F256I6	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	18752	Yes	1.25 V	1196	CMOS	152	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm		1196 CLBS		Tin Lead	Bottom	S-PBGA-B256		1.55 mm	17 mm	No	Also requires 3.3 V supply	e0			136		17 mm
EP3C25F256C8	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	156	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	24624 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz	20 s	156	235 °C (455 °F)	17 mm
5CEFA2F17A7N	Altera	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile			1.07 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm								17 mm
EP4CGX15BF14	Altera	FPGA		Ball	169	LBGA	Square	Plastic/Epoxy		Yes	1.24 V	47			1.2		Grid Array, Low Profile			1.16 V	1 mm		47 CLBS			Bottom	S-PBGA-B169		1.55 mm	14 mm								14 mm
EP4CE6F17C7	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	6272	Yes	1.25 V	392		179	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	392 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz		179		17 mm
EP4CGX22DF14C7N	Altera	FPGA	Other	Ball	169	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B169		1.55 mm	14 mm								14 mm
EP4CGX30BF19C7N	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	19 mm								19 mm
EP4CGX22CF19C7	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy	21280	Yes	1.24 V	1330		150	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA324,18X18,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)	1330 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	1.55 mm	19 mm	No		e0	472.5 MHz	20 s	150	220 °C (428 °F)	19 mm
5CEFA4F17A7	Altera	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile			1.07 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm								17 mm
EP2C20AF256I8	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	18752	Yes	1.25 V			152	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm				Tin Lead	Bottom	S-PBGA-B256		1.55 mm	17 mm	No	Also requires 3.3 V supply	e0			136		17 mm
EP4CE6F17C9L	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	6272	Yes	1.03 V	392		179	1	1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	392 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	265 MHz		179		17 mm
EP4CE15F17I7	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	15408	Yes	1.25 V	963		165	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm		963 CLBS		Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz		165		17 mm
EP4CE10F17C8L	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	10320	Yes	1.03 V	645		179	1	1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	645 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	362 MHz		179		17 mm
EP4CE6F17I7	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	6272	Yes	1.25 V	392		179	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm		392 CLBS		Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz		179		17 mm
5CEBA2F17I7	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile			1.07 V	1 mm					Bottom	S-PBGA-B256		1.55 mm	17 mm								17 mm
EP3C25F256A7	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	156	1.2	1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm		24624 CLBS			Bottom	S-PBGA-B256		1.55 mm	17 mm	No					156		17 mm
EP2C20F256C8	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	18752	Yes	1.25 V	1172	CMOS	152	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	1172 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also requires 3.3 V supply	e0	402.5 MHz		136		17 mm
5CEFA4F17I7	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile			1.07 V	1 mm					Bottom	S-PBGA-B256		1.55 mm	17 mm								17 mm
EP4CGX30CF19	Altera	FPGA		Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.24 V	47			1.2		Grid Array, Low Profile			1.16 V	1 mm		47 CLBS			Bottom	S-PBGA-B324		1.55 mm	19 mm								19 mm
EP4CE15F17C7	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	15408	Yes	1.25 V	963		165	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	963 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz		165		17 mm
EP2C15AF256A7N	Altera	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.25 V	903			1.2		Grid Array, Low Profile			1.15 V	1 mm	125 °C (257 °F)	903 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	450 MHz	40 s		260 °C (500 °F)	17 mm
EP3C25F256I6	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	24624	Yes	1.25 V		CMOS	156	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm				Tin Lead	Bottom	S-PBGA-B256	1	1.55 mm	17 mm	No		e0			156		17 mm
EP4CE15F17C9LN	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	15408	Yes	1.03 V	963		165	1	1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	963 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	265 MHz		165		17 mm
EP4CE6F17C6	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	6272	Yes	1.25 V	392		179	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	392 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz		179		17 mm
EP4CE40F19A7N	Altera	FPGA	Automotive	Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B324		1.55 mm	19 mm								19 mm
EP4CGX22CF14C7	Altera	FPGA	Other	Ball	169	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B169		1.55 mm	14 mm								14 mm
EP2C20AF256C8N	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.25 V		CMOS		1.2		Grid Array, Low Profile			1.15 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No	Also requires 3.3 V supply	e1					17 mm
EP4CGX22BF19I7N	Altera	FPGA		Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm					Bottom	S-PBGA-B324		1.55 mm	19 mm								19 mm
EP4CE10F17C6	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	10320	Yes	1.25 V	645		179	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	645 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz		179		17 mm
EP4CGX22BF19C7N	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	19 mm								19 mm
EP4CGX15CF14C8N	Altera	FPGA	Other	Ball	169	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B169		1.55 mm	14 mm								14 mm
EP4CE6F17I8L	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	6272	Yes	1.03 V	392		179	1	1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	.97 V	1 mm		392 CLBS		Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	362 MHz		179		17 mm
5CEBA4F17C7	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm								17 mm
EP2C8AF256A7N	Altera	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.25 V	516			1.2		Grid Array, Low Profile			1.15 V	1 mm	125 °C (257 °F)	516 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	450 MHz	40 s		260 °C (500 °F)	17 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.