LBGA Field Programmable Gate Arrays (FPGA) 1,674

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC4044XLA-07BGG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS		27000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	0.9 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 80000 gates	e1	294 MHz	30 s		260 °C (500 °F)	40 mm
XC4052XLA-8BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS		33000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	263 MHz				35 mm
XC6SLX16-1LFT256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array, Low Profile			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	500 MHz				17 mm
XC40110XV-7BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	2.7 V	4096	CMOS		75000	2.5		Grid Array, Low Profile			2.3 V	1.27 mm	85 °C (185 °F)	0.9 ns	4096 CLBS, 75000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	250 MHz				42.5 mm
XCV400E-7BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	2400	CMOS	404	129600	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.42 ns	2400 CLBS, 129600 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	400 MHz	30 s	404	260 °C (500 °F)	42.5 mm
XCV400E-8BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	2400	CMOS	404	129600	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.4 ns	2400 CLBS, 129600 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	416 MHz	30 s	404	225 °C (437 °F)	42.5 mm
XC4085XLA-9BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS		55000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	227 MHz				42.5 mm
XC3S200-5FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	4320	Yes	1.26 V	480	CMOS	173	200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	480 CLBS, 200000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	725 MHz	30 s	173	260 °C (500 °F)	17 mm
XCV800-5FG680I	Xilinx	FPGA		Ball	680	LBGA	Square	Plastic/Epoxy	21168	Yes	2.625 V	4704	CMOS	512	888439	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA680,39X39,40	Field Programmable Gate Arrays	2.375 V	1 mm		0.7 ns	4704 CLBS, 888439 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B680	3	1.7 mm	40 mm	No		e0	294 MHz	30 s	512	225 °C (437 °F)	40 mm
XCV300E-6BGG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS	260	82944	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.47 ns	1536 CLBS, 82944 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	357 MHz	30 s	260	260 °C (500 °F)	35 mm
XC4044XL-1BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy	1600	Yes	3.6 V	1600	CMOS	320	27000	3.3	3.3 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.3 ns	1600 CLBS, 27000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Max usable 44000 Logic gates	e0	200 MHz	30 s	320	225 °C (437 °F)	35 mm
XC4085XLA-7BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS		55000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	0.9 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	294 MHz				42.5 mm
XC4062XL-1BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	2304	Yes	3.6 V	2304	CMOS	384	40000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.3 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 62000 Logic gates	e0	200 MHz	30 s	384	225 °C (437 °F)	40 mm
XC4085XLA-09BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS		55000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 180000 gates	e1	227 MHz	30 s		260 °C (500 °F)	35 mm
XC4052XL-2BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS		33000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.5 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Max usable 52000 Logic gates	e1	179 MHz	30 s		260 °C (500 °F)	42.5 mm
XC4052XLA-09BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy	1936	Yes	3.6 V	1936	CMOS	352	33000	3.3	3.3 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 100000 gates	e0	227 MHz	30 s	352	225 °C (437 °F)	42.5 mm
XC4085XLA-09BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy	7448	Yes	3.6 V	3136	CMOS	289	55000	3.3	3.3 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.1 ns	3136 CLBS, 55000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 180000 gates	e0	227 MHz	30 s	289	225 °C (437 °F)	35 mm
XCV600E-7BG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS	404	186624	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.42 ns	3456 CLBS, 186624 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	400 MHz	30 s	404	225 °C (437 °F)	42.5 mm
XCV400-6BG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	10800	Yes	2.625 V	2400	CMOS	316	468252	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	2.375 V	1.27 mm		0.6 ns	2400 CLBS, 468252 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	333 MHz	30 s	316	225 °C (437 °F)	40 mm
XC4062XLA-9BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS		40000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	227 MHz				35 mm
XCV300-4BGG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	6912	Yes	2.625 V	1536	CMOS	316	322970	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	2.375 V	1.27 mm		0.8 ns	1536 CLBS, 322970 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1	250 MHz	30 s	316	260 °C (500 °F)	40 mm
XC4044XLA-09BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS		27000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 80000 gates	e1	227 MHz	30 s		260 °C (500 °F)	35 mm
XC4028EX-1BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	5.5 V	1024	CMOS		18000	5		Grid Array, Low Profile			4.5 V	1.27 mm			1024 CLBS, 18000 Gates			Bottom	S-PBGA-B352		1.7 mm	35 mm	No							35 mm
XC4044XL-2BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy	1600	Yes	3.6 V	1600	CMOS	320	27000	3.3	3.3 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.5 ns	1600 CLBS, 27000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Max usable 44000 Logic gates	e0	179 MHz	30 s	320	225 °C (437 °F)	35 mm
XC4062XLA-9BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS		40000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	227 MHz				42.5 mm
EP3C25F256I6	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	24624	Yes	1.25 V		CMOS	156		1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm					Tin Lead	Bottom	S-PBGA-B256	1	1.55 mm	17 mm	No		e0			156		17 mm
EP4CE15F17C9LN	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	15408	Yes	1.03 V	963		165		1	1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)		963 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	265 MHz		165		17 mm
EP4CGX15BF14I7	Altera	FPGA		Ball	169	LBGA	Square	Plastic/Epoxy	14400	Yes	1.24 V	900		72		1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA169,13X13,40	Field Programmable Gate Arrays	1.16 V	1 mm			900 CLBS		Tin Lead	Bottom	S-PBGA-B169	3	1.55 mm	14 mm	No		e0	472.5 MHz	20 s	72	235 °C (455 °F)	14 mm
EP2C15AF256C7	Altera	FPGA	Commercial Extended	Ball	256	LBGA	Square	Plastic/Epoxy	14448	Yes	1.25 V			152		1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256		1.55 mm	17 mm	No	Also requires 3.3 V supply	e0			144		17 mm
EP4CE6F17	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.24 V	47				1.2		Grid Array, Low Profile			1.16 V	1 mm			47 CLBS			Bottom	S-PBGA-B256		1.55 mm	17 mm								17 mm
EP4CGX15CF14C8	Altera	FPGA	Other	Ball	169	LBGA	Square	Plastic/Epoxy		Yes	1.25 V					1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B169		1.55 mm	14 mm								14 mm
EP4CGX30BF19C7	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.25 V					1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	19 mm								19 mm
EP2C15AF256I8	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	14448	Yes	1.25 V			152		1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm					Tin Lead	Bottom	S-PBGA-B256		1.55 mm	17 mm	No	Also requires 3.3 V supply	e0			144		17 mm
EP2C5F256I6	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	4608	Yes	1.25 V	312	CMOS	158		1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm			312 CLBS		Tin Lead	Bottom	S-PBGA-B256		1.55 mm	17 mm	No	Also requires 3.3 V supply	e0			150		17 mm
EP4CE10F17C8L	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	10320	Yes	1.03 V	645		179		1	1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)		645 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	362 MHz		179		17 mm
EP4CE6F17I7	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	6272	Yes	1.25 V	392		179		1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm			392 CLBS		Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz		179		17 mm
5CEBA2F17I7	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array, Low Profile			1.07 V	1 mm						Bottom	S-PBGA-B256		1.55 mm	17 mm								17 mm
EP3C25F256A7	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	156		1.2	1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm			24624 CLBS			Bottom	S-PBGA-B256		1.55 mm	17 mm	No					156		17 mm
EP2C20F256C8	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	18752	Yes	1.25 V	1172	CMOS	152		1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		1172 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also requires 3.3 V supply	e0	402.5 MHz		136		17 mm
5CEFA4F17I7	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array, Low Profile			1.07 V	1 mm						Bottom	S-PBGA-B256		1.55 mm	17 mm								17 mm
EP4CGX30CF19	Altera	FPGA		Ball	324	LBGA	Square	Plastic/Epoxy		Yes	1.24 V	47				1.2		Grid Array, Low Profile			1.16 V	1 mm			47 CLBS			Bottom	S-PBGA-B324		1.55 mm	19 mm								19 mm
EP4CE15F17C7	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	15408	Yes	1.25 V	963		165		1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		963 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz		165		17 mm
EP2C15AF256A7N	Altera	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.25 V	903				1.2		Grid Array, Low Profile			1.15 V	1 mm	125 °C (257 °F)		903 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	450 MHz	40 s		260 °C (500 °F)	17 mm
EP2C8AF256I8NES	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.25 V	516				1.2		Grid Array, Low Profile			1.15 V	1 mm			516 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e1	402.5 MHz	40 s		260 °C (500 °F)	17 mm
EP3C25F256I8	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	156		1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm			24624 CLBS			Bottom	S-PBGA-B256		1.55 mm	17 mm	No					156		17 mm
EP2C5AF256A7N	Altera	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.25 V	288				1.2		Grid Array, Low Profile			1.15 V	1 mm	125 °C (257 °F)		288 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	450 MHz	40 s		260 °C (500 °F)	17 mm
EP4CGX30CF19C6	Altera	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy	29440	Yes	1.24 V	1840		150		1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA324,18X18,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		1840 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	1.55 mm	19 mm	No		e0	472.5 MHz	20 s	150	220 °C (428 °F)	19 mm
EP4CGX30DF14I7N	Altera	FPGA		Ball	169	LBGA	Square	Plastic/Epoxy		Yes	1.25 V					1.2		Grid Array, Low Profile			1.15 V	1 mm						Bottom	S-PBGA-B169		1.55 mm	14 mm								14 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.