LBGA Field Programmable Gate Arrays (FPGA) 1,674

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

EP4CGX30BF19C6N

Altera

FPGA

Other

Ball

324

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

1.55 mm

19 mm

19 mm

EP4CE15F17C8L

Altera

FPGA

Other

Ball

256

LBGA

Square

Plastic/Epoxy

15408

Yes

1.03 V

963

165

1

1,1.2/3.3,2.5 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

963 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e0

362 MHz

165

17 mm

EP4CGX30BF19C6

Altera

FPGA

Other

Ball

324

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

1.55 mm

19 mm

19 mm

EP4CGX22DF14C6N

Altera

FPGA

Other

Ball

169

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B169

1.55 mm

14 mm

14 mm

EP4CGX22CF14I7

Altera

FPGA

Ball

169

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

Bottom

S-PBGA-B169

1.55 mm

14 mm

14 mm

5CEBA2F17C6

Altera

FPGA

Other

Ball

256

LBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Low Profile

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B256

1.55 mm

17 mm

17 mm

5CEBA2F17C6N

Altera

FPGA

Other

Ball

256

LBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Low Profile

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B256

1.55 mm

17 mm

17 mm

EP4CGX30BF19C8

Altera

FPGA

Other

Ball

324

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

1.55 mm

19 mm

19 mm

EP4CGX30BF19C8N

Altera

FPGA

Other

Ball

324

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

1.55 mm

19 mm

19 mm

EP4CGX22DF19C6

Altera

FPGA

Other

Ball

324

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

1.55 mm

19 mm

19 mm

EP4CGX22CF19C7N

Altera

FPGA

Other

Ball

324

LBGA

Square

Plastic/Epoxy

21280

Yes

1.24 V

1330

150

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Low Profile

BGA324,18X18,40

Field Programmable Gate Arrays

1.16 V

1 mm

85 °C (185 °F)

1330 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

1.55 mm

19 mm

No

e1

472.5 MHz

30 s

150

260 °C (500 °F)

19 mm

EP3C16F256I8

Altera

FPGA

Ball

256

LBGA

Square

Plastic/Epoxy

15408

Yes

1.25 V

CMOS

168

1.2

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

Tin Lead

Bottom

S-PBGA-B256

1

1.55 mm

17 mm

No

e0

168

17 mm

EP4CGX22DF19I7N

Altera

FPGA

Ball

324

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

Bottom

S-PBGA-B324

1.55 mm

19 mm

19 mm

EP4CE15F17C9L

Altera

FPGA

Other

Ball

256

LBGA

Square

Plastic/Epoxy

15408

Yes

1.03 V

963

165

1

1,1.2/3.3,2.5 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

963 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e0

265 MHz

165

17 mm

EP4CE10F17A7

Altera

FPGA

Automotive

Ball

256

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

1.55 mm

17 mm

e0

17 mm

EP4CGX22DF19C8

Altera

FPGA

Other

Ball

324

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

1.55 mm

19 mm

19 mm

EP4CGX22BF14

Altera

FPGA

Ball

169

LBGA

Square

Plastic/Epoxy

Yes

1.24 V

47

1.2

Grid Array, Low Profile

1.16 V

1 mm

47 CLBS

Bottom

S-PBGA-B169

1.55 mm

14 mm

14 mm

EP4CGX30DF19C7

Altera

FPGA

Other

Ball

324

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

1.55 mm

19 mm

19 mm

EP4CGX22CF19C6

Altera

FPGA

Other

Ball

324

LBGA

Square

Plastic/Epoxy

21280

Yes

1.24 V

1330

150

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Low Profile

BGA324,18X18,40

Field Programmable Gate Arrays

1.16 V

1 mm

85 °C (185 °F)

1330 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B324

3

1.55 mm

19 mm

No

e0

472.5 MHz

20 s

150

220 °C (428 °F)

19 mm

EP4CE30F19A7N

Altera

FPGA

Automotive

Ball

324

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

1.55 mm

19 mm

e1

19 mm

EP4CE15F17C6

Altera

FPGA

Other

Ball

256

LBGA

Square

Plastic/Epoxy

15408

Yes

1.25 V

963

165

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

963 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e0

472.5 MHz

165

17 mm

EP4CGX30DF14C7

Altera

FPGA

Other

Ball

169

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B169

1.55 mm

14 mm

14 mm

EP2C20F256I7N

Altera

FPGA

Ball

256

LBGA

Square

Plastic/Epoxy

18752

Yes

1.25 V

1196

CMOS

152

1.2

1.2,1.5/3.3,3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

1196 CLBS

Tin Silver Copper

Bottom

S-PBGA-B256

1.55 mm

17 mm

No

Also requires 3.3 V supply

e1

136

17 mm

EP2C15AF256C6NES

Altera

FPGA

Other

Ball

256

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

903

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

903 CLBS

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B256

1.55 mm

17 mm

No

e1

500 MHz

40 s

260 °C (500 °F)

17 mm

EP4CGX22DF14I7

Altera

FPGA

Ball

169

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

Bottom

S-PBGA-B169

1.55 mm

14 mm

14 mm

5CEFA4F17C7N

Altera

FPGA

Other

Ball

256

LBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Low Profile

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B256

1.55 mm

17 mm

17 mm

EP4CGX15DF14C6

Altera

FPGA

Other

Ball

169

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B169

1.55 mm

14 mm

14 mm

EP3C10F256I6

Altera

FPGA

Ball

256

LBGA

Square

Plastic/Epoxy

10320

Yes

1.25 V

CMOS

182

1.2

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

Tin Lead

Bottom

S-PBGA-B256

1

1.55 mm

17 mm

No

e0

182

17 mm

EP2C20F256I8

Altera

FPGA

Ball

256

LBGA

Square

Plastic/Epoxy

18752

Yes

1.25 V

1172

CMOS

152

1.2

1.2,1.5/3.3,3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

1172 CLBS

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

Also requires 3.3 V supply

e0

402.5 MHz

20 s

136

235 °C (455 °F)

17 mm

5CEBA2F17C7

Altera

FPGA

Other

Ball

256

LBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Low Profile

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B256

1.55 mm

17 mm

17 mm

EP4CGX30DF19C7N

Altera

FPGA

Other

Ball

324

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

1.55 mm

19 mm

19 mm

EP3C10F256C7

Altera

FPGA

Other

Ball

256

LBGA

Square

Plastic/Epoxy

10320

Yes

1.25 V

10320

CMOS

182

1.2

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

10320 CLBS

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e0

472.5 MHz

20 s

182

235 °C (455 °F)

17 mm

EP2C5F256C7

Altera

FPGA

Other

Ball

256

LBGA

Square

Plastic/Epoxy

4608

Yes

1.25 V

288

CMOS

158

1.2

1.2,1.5/3.3,3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

288 CLBS

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

Also requires 3.3 V supply

e0

450 MHz

20 s

150

235 °C (455 °F)

17 mm

EP3C5F256A7

Altera

FPGA

Ball

256

LBGA

Square

Plastic/Epoxy

5136

Yes

1.25 V

5136

CMOS

182

1.2

1.2/3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

5136 CLBS

Bottom

S-PBGA-B256

1.55 mm

17 mm

No

182

17 mm

EP2C5F256I7

Altera

FPGA

Ball

256

LBGA

Square

Plastic/Epoxy

4608

Yes

1.25 V

312

CMOS

158

1.2

1.2,1.5/3.3,3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

312 CLBS

Tin Lead

Bottom

S-PBGA-B256

1.55 mm

17 mm

No

Also requires 3.3 V supply

e0

150

17 mm

EP2C20F256I6

Altera

FPGA

Ball

256

LBGA

Square

Plastic/Epoxy

18752

Yes

1.25 V

1196

CMOS

152

1.2

1.2,1.5/3.3,3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

1196 CLBS

Tin Lead

Bottom

S-PBGA-B256

1.55 mm

17 mm

No

Also requires 3.3 V supply

e0

136

17 mm

EP3C25F256C8

Altera

FPGA

Other

Ball

256

LBGA

Square

Plastic/Epoxy

24624

Yes

1.25 V

24624

CMOS

156

1.2

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

24624 CLBS

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e0

472.5 MHz

20 s

156

235 °C (455 °F)

17 mm

5CEFA2F17A7N

Altera

FPGA

Automotive

Ball

256

LBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Low Profile

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B256

1.55 mm

17 mm

17 mm

EP4CGX15BF14

Altera

FPGA

Ball

169

LBGA

Square

Plastic/Epoxy

Yes

1.24 V

47

1.2

Grid Array, Low Profile

1.16 V

1 mm

47 CLBS

Bottom

S-PBGA-B169

1.55 mm

14 mm

14 mm

5CEBA2F17C8

Altera

FPGA

Other

Ball

256

LBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Low Profile

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B256

1.55 mm

17 mm

17 mm

EP3C25F256C7ES

Altera

FPGA

Other

Ball

256

LBGA

Rectangular

Plastic/Epoxy

Yes

1.25 V

24624

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

24624 CLBS

0 °C (32 °F)

Tin Lead

Bottom

R-PBGA-B256

1.55 mm

17 mm

No

e0

472.5 MHz

17 mm

EP4CGX22CF14C6N

Altera

FPGA

Other

Ball

169

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B169

1.55 mm

14 mm

14 mm

EP3C5F256I6

Altera

FPGA

Ball

256

LBGA

Square

Plastic/Epoxy

5136

Yes

1.25 V

CMOS

182

1.2

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

Tin Lead

Bottom

S-PBGA-B256

1

1.55 mm

17 mm

No

e0

182

17 mm

EP4CGX22DF19C8N

Altera

FPGA

Other

Ball

324

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

1.55 mm

19 mm

19 mm

EP4CGX30DF19C8N

Altera

FPGA

Other

Ball

324

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

1.55 mm

19 mm

19 mm

EP4CGX22BF14C6N

Altera

FPGA

Other

Ball

169

LBGA

Square

Plastic/Epoxy

21280

Yes

1.24 V

1330

72

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Low Profile

BGA169,13X13,40

Field Programmable Gate Arrays

1.16 V

1 mm

85 °C (185 °F)

1330 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

1.55 mm

14 mm

No

e1

472.5 MHz

30 s

72

260 °C (500 °F)

14 mm

5CEFA4F17I7N

Altera

FPGA

Ball

256

LBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Low Profile

1.07 V

1 mm

Bottom

S-PBGA-B256

1.55 mm

17 mm

17 mm

EP3C16F256C8

Altera

FPGA

Other

Ball

256

LBGA

Rectangular

Plastic/Epoxy

15408

Yes

1.25 V

15408

CMOS

168

1.2

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

15408 CLBS

0 °C (32 °F)

Tin Lead

Bottom

R-PBGA-B256

3

1.55 mm

17 mm

No

e0

472.5 MHz

20 s

168

220 °C (428 °F)

17 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.