LBGA Field Programmable Gate Arrays (FPGA) 1,674

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XA3S700A-4FTG256I	Xilinx	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS			700000	1.2		Grid Array, Low Profile			1.14 V	1 mm	100 °C (212 °F)	4.88 ns	1472 CLBS, 700000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	667 MHz				17 mm
XC40200XV-09BG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy	7056	Yes	2.7 V	7056	CMOS		448	130000	2.5	2.5,3.3 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	2.3 V	1.27 mm		1.3 ns	7056 CLBS, 130000 Gates		Tin Lead	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 400000 gates	e0	225 MHz	30 s	448	225 °C (437 °F)	42.5 mm
XCV1000-5FGG680I	Xilinx	FPGA		Ball	680	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	6144	CMOS			1124022	2.5		Grid Array, Low Profile			2.375 V	1 mm		0.7 ns	6144 CLBS, 1124022 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B680	3	1.7 mm	40 mm	No		e1	294 MHz	30 s		260 °C (500 °F)	40 mm
XC5215-4BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy	484	Yes	5.25 V	484	CMOS		244	15000	5	5 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	3.8 ns	484 CLBS, 15000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	MAX available 23000 Logic gates	e0	83 MHz	30 s	244	225 °C (437 °F)	35 mm
XC4052XLA-8BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	263 MHz				42.5 mm
XC4062XL-3BGG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS			40000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.6 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 62000 Logic gates	e1	166 MHz	30 s		260 °C (500 °F)	40 mm
XCV2000E-8BGG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS		404	518400	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.4 ns	9600 CLBS, 518400 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	416 MHz	30 s	404	260 °C (500 °F)	42.5 mm
XCV400-4BGG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	2400	CMOS			468252	2.5		Grid Array, Low Profile			2.375 V	1.27 mm	85 °C (185 °F)	0.8 ns	2400 CLBS, 468252 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1	250 MHz	30 s		260 °C (500 °F)	40 mm
XC6SLX25-3NFT256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Low Profile			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	806 MHz				17 mm
XC4044XLA-09BGG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS			27000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1.1 ns	1600 CLBS, 27000 Gates		Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 80000 gates	e1	227 MHz	30 s		260 °C (500 °F)	40 mm
XCV300-5BG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	6912	Yes	2.625 V	1536	CMOS		316	322970	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	2.375 V	1.27 mm		0.7 ns	1536 CLBS, 322970 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	294 MHz	30 s	316	225 °C (437 °F)	40 mm
5962R9957301NUA	Xilinx	FPGA	Military	Ball	432	LBGA	Square	Plastic/Epoxy	15552	Yes	2.625 V		CMOS	MIL-PRF-38535	316	661111	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	661111 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B432		1.7 mm	40 mm	Yes		e0			316		40 mm
XCV100E-6BGG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS		196	32400	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.47 ns	600 CLBS, 32400 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	357 MHz	30 s	196	260 °C (500 °F)	35 mm
XC40250XV-08BG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy	8464	Yes	2.7 V	8464	CMOS		448	180000	2.5	2.5,3.3 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	2.3 V	1.27 mm		1.1 ns	8464 CLBS, 180000 Gates		Tin Lead	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 500000 gates	e0	258 MHz	30 s	448	225 °C (437 °F)	42.5 mm
XC4062XLA-09BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy	5472	Yes	3.6 V	2304	CMOS		289	40000	3.3	3.3 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.1 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 130000 gates	e0	227 MHz	30 s	289	225 °C (437 °F)	35 mm
XC4036XLA-08BGG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS			22000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1 ns	1296 CLBS, 22000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 65000 gates	e1	263 MHz	30 s		260 °C (500 °F)	35 mm
XC4044XL-09CBG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	3800	Yes	3.6 V	1600	CMOS		320	27000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.2 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B432		1.7 mm	40 mm	No	Max usable 44000 Logic gates		217 MHz		320		40 mm
XC4036XLBG432C	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy		Yes	5.25 V	1296	CMOS			22000	5		Grid Array, Low Profile			4.75 V	1.27 mm			1296 CLBS, 22000 Gates		Tin Lead	Bottom	S-PBGA-B432	3	1.65 mm	40 mm	No	Typical gates = 22000-65000	e0					40 mm
XC4028XL-3BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy	1024	Yes	3.6 V	1024	CMOS		256	18000	3.3	3.3 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.6 ns	1024 CLBS, 18000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Max usable 28000 Logic gates	e0	166 MHz	30 s	256	225 °C (437 °F)	35 mm
XC4052XLA-08BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy	4598	Yes	3.6 V	1936	CMOS		289	33000	3.3	3.3 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 100000 gates	e0	263 MHz	30 s	289	225 °C (437 °F)	35 mm
XC4036XLA-09BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS			22000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 65000 gates	e1	227 MHz	30 s		260 °C (500 °F)	35 mm
XCV800-4BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	4704	CMOS			888439	2.5		Grid Array, Low Profile			2.375 V	1.27 mm	85 °C (185 °F)	0.8 ns	4704 CLBS, 888439 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	250 MHz	30 s		260 °C (500 °F)	42.5 mm
XC6SLX16-N3FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS		186		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	1139 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	806 MHz		186		17 mm
XC3S2000-4FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array, Low Profile			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1					17 mm
XC4052XLA-9BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	227 MHz				42.5 mm
XCV800-6BG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	21168	Yes	2.625 V	4704	CMOS		316	888439	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	2.375 V	1.27 mm		0.6 ns	4704 CLBS, 888439 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	333 MHz	30 s	316	225 °C (437 °F)	40 mm
XC4028XL-3BGG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1024	CMOS			18000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1.6 ns	1024 CLBS, 18000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Max usable 28000 Logic gates	e1	166 MHz	30 s		260 °C (500 °F)	35 mm
XCV100E-6BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS		196	32400	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.47 ns	600 CLBS, 32400 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	357 MHz	30 s	196	225 °C (437 °F)	35 mm
XC3S200AN-4FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	4032	Yes	1.26 V	448	CMOS		195	200000	1.2	1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	448 CLBS, 200000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	667 MHz	30 s	160	240 °C (464 °F)	17 mm
XCV300-6BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy	6912	Yes	2.625 V	1536	CMOS		260	322970	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	85 °C (185 °F)	0.6 ns	1536 CLBS, 322970 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	333 MHz	30 s	260	225 °C (437 °F)	35 mm
XC4062XLA-9BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS			40000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	227 MHz				42.5 mm
XCV1000E-7BGG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS		404	331776	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.42 ns	6144 CLBS, 331776 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	400 MHz	30 s	404	260 °C (500 °F)	42.5 mm
XCV600E-8BG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS		404	186624	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.4 ns	3456 CLBS, 186624 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	416 MHz	30 s	404	225 °C (437 °F)	42.5 mm
XCV800-5FG680C	Xilinx	FPGA	Other	Ball	680	LBGA	Square	Plastic/Epoxy	21168	Yes	2.625 V	4704	CMOS		512	888439	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA680,39X39,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	4704 CLBS, 888439 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B680	3	1.7 mm	40 mm	No		e0	294 MHz	30 s	512	225 °C (437 °F)	40 mm
XCV600E-6BGG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS		316	186624	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.47 ns	3456 CLBS, 186624 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1	357 MHz	30 s	316	260 °C (500 °F)	40 mm
XCV300E-8BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS		260	82944	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.4 ns	1536 CLBS, 82944 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	416 MHz	30 s	260	225 °C (437 °F)	35 mm
XCV600E-7BGG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS		404	186624	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.42 ns	3456 CLBS, 186624 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	400 MHz	30 s	404	260 °C (500 °F)	42.5 mm
XC6SLX25-L1FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	24051	Yes	1.05 V	1879	CMOS		186		1	1,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.46 ns	1879 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1		30 s	186	260 °C (500 °F)	17 mm
XC4085XL-2BGG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS			55000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.5 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 85000 Logic gates	e1	179 MHz	30 s		260 °C (500 °F)	40 mm
XC3S5000-4FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array, Low Profile			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1		30 s		260 °C (500 °F)	17 mm
5962R9957301NUX	Xilinx	FPGA	Military	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	2.625 V		CMOS			661111	2.5		Grid Array, Low Profile			2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	661111 Gates	-55 °C (-67 °F)		Bottom	S-PBGA-B432		1.7 mm	40 mm	Yes							40 mm
XC4052XL-2BGG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1.5 ns	1936 CLBS, 33000 Gates		Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Max usable 52000 Logic gates	e1	179 MHz	30 s		260 °C (500 °F)	42.5 mm
XCV400-6BGG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	2400	CMOS			468252	2.5		Grid Array, Low Profile			2.375 V	1.27 mm		0.6 ns	2400 CLBS, 468252 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	333 MHz	30 s		260 °C (500 °F)	42.5 mm
XC4052XLA-09BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 100000 gates	e1	227 MHz	30 s		260 °C (500 °F)	42.5 mm
XC4044EX-4BGG432C	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy		Yes	5.25 V	1600	CMOS			27000	5		Grid Array, Low Profile			4.75 V	1.27 mm	85 °C (185 °F)		1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.65 mm	40 mm	No	Typical gates = 27000-80000	e1	111 MHz				40 mm
XC3S1400A-5FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS		161	1400000	1.2	1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	770 MHz	30 s	148	225 °C (437 °F)	17 mm
XC4052XL-3BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	1936	Yes	3.6 V	1936	CMOS		352	33000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.6 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 52000 Logic gates	e0	166 MHz	30 s	352	225 °C (437 °F)	40 mm
XC4036EX-2BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy	1296	Yes	5.5 V	1296	CMOS		288	22000	5	5 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	4.5 V	1.27 mm			1296 CLBS, 22000 Gates		Tin Lead	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	166 MHz	30 s	288	225 °C (437 °F)	35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.