LBGA Field Programmable Gate Arrays (FPGA) 1,674

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XQV600-4BG432N	Xilinx	FPGA	Military	Ball	432	LBGA	Square	Plastic/Epoxy	15552	Yes	2.625 V	3456	CMOS	MIL-PRF-38535	316	661111	2.5		1.2/3.6,2.5 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	3456 CLBS, 661111 Gates	-55 °C (-67 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0		30 s	316	225 °C (437 °F)	40 mm
AGL125V2-FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	3072	Yes	1.575 V		CMOS		97	125000	1.2			Grid Array, Low Profile	BGA144,12X12,40		1.14 V	1 mm	100 °C (212 °F)		125000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1		30 s	97	260 °C (500 °F)	13 mm
AX250-FGG256M	Microchip Technology	FPGA	Military	Ball	256	LBGA	Square	Plastic/Epoxy	4224	Yes	1.575 V	2816	CMOS	MIL-STD-883 Class B	248	250000	1.5	Tray	1.5,1.5/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)	0.99 ns	2816 CLBS, 250000 Gates	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No	250000 system gates avaiable	e1	649 MHz	30 s	248	250 °C (482 °F)	17 mm
EP4CGX30CF19C6N	Intel	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy	29440	Yes	1.24 V	1840			150		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA324,18X18,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		1840 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.55 mm	19 mm	No		e1	472.5 MHz		150		19 mm
LCMXO2-4000HC-5FTG256I	Lattice Semiconductor	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	4320	Yes	3.465 V				206		2.5	Tray	2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	17 mm
M1AGL1000V2-FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	24576	Yes	1.575 V		CMOS		97	1000000	1.2			Grid Array, Low Profile	BGA144,12X12,40		1.14 V	1 mm	100 °C (212 °F)		1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1		30 s	97	260 °C (500 °F)	13 mm
XC3S50A-4FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	1584	Yes	1.26 V	176	CMOS		144	50000	1.2		1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	176 CLBS, 50000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	667 MHz	30 s	112	260 °C (500 °F)	17 mm
5CEBA4F17A7N	Intel	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy	49000	Yes	1.13 V		CMOS		128		1.1		1.1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm	No					128		17 mm
A3P1000L-1FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS		97	1000000	1.2	Tray	1.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s	97	260 °C (500 °F)	13 mm
A3P600-FGG256IY	Microchip Technology	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	13824	CMOS		177	600000	1.5			Grid Array, Low Profile	BGA256,16X16,40		1.425 V	1 mm	100 °C (212 °F)		13824 CLBS, 600000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.7 mm	17 mm					30 s	177	250 °C (482 °F)	1.7 mm
AGL125V2-FGG144	Microchip Technology	FPGA	Other	Ball	144	LBGA	Square	Plastic/Epoxy	3072	Yes	1.575 V		CMOS		97	125000	1.2			Grid Array, Low Profile	BGA144,12X12,40		1.14 V	1 mm	85 °C (185 °F)		125000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1		30 s	97	260 °C (500 °F)	13 mm
AX250-FGG256	Microchip Technology	FPGA	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	4224	Yes	1.575 V	2816	CMOS		248	250000	1.5	Tray	1.5,1.5/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	70 °C (158 °F)	0.99 ns	2816 CLBS, 250000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No	250000 system gates avaiable	e1	649 MHz	30 s	248	250 °C (482 °F)	17 mm
EP3C16F256C7N	Intel	FPGA	Other	Ball	256	LBGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS		168		1.2			Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		15408 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz		168		17 mm
EP4CE10F17C7	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	10320	Yes	1.25 V	645			179		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		645 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz		179		17 mm
EP4CE15F17C6N	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	15408	Yes	1.25 V	963			165		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		963 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz		165		17 mm
M1A3P400-FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	9216	CMOS			400000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		9216 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0					13 mm
M1A3P400-FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	9216	CMOS			400000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		9216 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1		30 s		260 °C (500 °F)	13 mm
M1A3P600-FGG144	Microchip Technology	FPGA	Commercial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	13824	CMOS			600000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	85 °C (185 °F)		13824 CLBS, 600000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
M1AGL1000V2-FGG144	Microchip Technology	FPGA	Other	Ball	144	LBGA	Square	Plastic/Epoxy	24576	Yes	1.575 V		CMOS		97	1000000	1.2			Grid Array, Low Profile	BGA144,12X12,40		1.14 V	1 mm	85 °C (185 °F)		1000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1		30 s	97	260 °C (500 °F)	13 mm
XC3S200A-4FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	4032	Yes	1.26 V	448	CMOS		195	200000	1.2		1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	448 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	667 MHz	30 s	160	260 °C (500 °F)	17 mm
XC6SLX9-3FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	9152	Yes	1.26 V	715	CMOS		186		1.2		1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	715 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	862 MHz	30 s	186	260 °C (500 °F)	17 mm
XC6SLX9-L1FT256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	9152	Yes	1.05 V	715	CMOS		186		1		1,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.46 ns	715 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0		30 s	186	225 °C (437 °F)	17 mm
XC6SLX9-N3FT256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	9152	Yes	1.26 V	715	CMOS		186		1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	715 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	806 MHz	30 s	186	225 °C (437 °F)	17 mm
A2F500M3G-FGG256I	Microchip Technology	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	11520	CMOS		66	500000	1.5		1.5,1.8,2.5,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)		11520 CLBS, 500000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No		e1	80 MHz	30 s	66	250 °C (482 °F)	17 mm
A3P125-FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	3072	CMOS			125000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		3072 CLBS, 125000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
AGL125V5-FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	3072	Yes	1.575 V		CMOS		97	125000	1.5			Grid Array, Low Profile	BGA144,12X12,40		1.425 V	1 mm	100 °C (212 °F)		125000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1		30 s	97	260 °C (500 °F)	13 mm
AGL250V5-FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	6144	Yes	1.575 V		CMOS		97	250000	1.5			Grid Array, Low Profile	BGA144,12X12,40		1.425 V	1 mm	100 °C (212 °F)		250000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0		20 s	97	235 °C (455 °F)	13 mm
EP3C10F256C6N	Intel	FPGA	Other	Ball	256	LBGA	Rectangular	Plastic/Epoxy	10320	Yes	1.25 V	10320	CMOS		182		1.2			Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		10320 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz		182		17 mm
EP4CE6F17C8	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	6272	Yes	1.25 V	392			179		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		392 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz		179		17 mm
EP4CGX15BF14C6N	Intel	FPGA	Other	Ball	169	LBGA	Square	Plastic/Epoxy	14400	Yes	1.24 V	900			72		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA169,13X13,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B169	3	1.55 mm	14 mm	No		e1	472.5 MHz		72		14 mm
EP4CGX30CF19C8N	Intel	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy	29440	Yes	1.24 V	1840			150		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA324,18X18,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		1840 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.55 mm	19 mm	No		e1	472.5 MHz		150		19 mm
LCMXO1200E-3FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	1200	Yes	1.26 V	150			211		1.2		1.2 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		150 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No		e1		40 s	211	260 °C (500 °F)	17 mm
LCMXO2-4000HC-4FTG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	4320	Yes	3.465 V				206		2.5	Tray	2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	17 mm
LFE3-35EA-6FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	33000	Yes	1.26 V				133		1.2		1.2 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.379 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	375 MHz	30 s	133	260 °C (500 °F)	17 mm
M1A3P1000-1FGG144M	Microchip Technology	FPGA	Military	Ball	144	LBGA	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS		97	1000000	1.5	Tray	1.5,1.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)		24576 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s	97	260 °C (500 °F)	13 mm
M1A3P250-FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS			250000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0					13 mm
M1AGL1000V5-FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	24576	Yes	1.575 V		CMOS		97	1000000	1.5			Grid Array, Low Profile	BGA144,12X12,40		1.425 V	1 mm	100 °C (212 °F)		1000000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0			97		13 mm
M1AGL250V5-FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	6144	Yes	1.575 V		CMOS		97	250000	1.5			Grid Array, Low Profile	BGA144,12X12,40		1.425 V	1 mm	100 °C (212 °F)		250000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0			97		13 mm
XC3S1200E-4FTG256CS1	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS		190	1200000	1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	2168 CLBS, 1200000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	572 MHz	30 s	150	260 °C (500 °F)	17 mm
XC3S250E-4FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS		172	250000	1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	612 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	572 MHz	30 s	132	260 °C (500 °F)	17 mm
XC3S50AN-4FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	1584	Yes	1.26 V	176	CMOS		144	50000	1.2		1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	176 CLBS, 50000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No			667 MHz		112		17 mm
XC3S50AN-4FT256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	1584	Yes	1.26 V	176	CMOS		144	50000	1.2		1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	176 CLBS, 50000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No			667 MHz		112		17 mm
XC3S50AN-4FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	1584	Yes	1.26 V	176	CMOS		144	50000	1.2		1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	176 CLBS, 50000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm	No			667 MHz		112		17 mm
XC3S50AN-5FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	1584	Yes	1.26 V	176	CMOS		144	50000	1.2		1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	176 CLBS, 50000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm	No			770 MHz		112		17 mm
10M16DAF256I7P	Intel	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000			320		1.2			Grid Array, Low Profile	BGA256,16X16,40		1.15 V	1 mm	100 °C (212 °F)		1000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm						320		17 mm
A3P1000-FGG144T	Microchip Technology	FPGA	Automotive	Ball	144	LBGA	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS	AEC-Q100	97	1000000	1.5	Tray	1.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s	97	260 °C (500 °F)	13 mm
A3P250-FG144	Microchip Technology	FPGA	Commercial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS			250000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	85 °C (185 °F)		6144 CLBS, 250000 Gates	0 °C (32 °F)	Tin Lead Silver	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0	350 MHz				13 mm
APA150-FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	6144	Yes	2.7 V		CMOS		100	150000	2.5	Tray	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	2.3 V	1 mm	85 °C (185 °F)		150000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0	180 MHz	20 s	100	235 °C (455 °F)	13 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.