LBGA Field Programmable Gate Arrays (FPGA) 1,674

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3S1400AN-4FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V	2816	CMOS			1400000	1.2		Grid Array, Low Profile			1.14 V	1 mm	85 °C (185 °F)	4.88 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	667 MHz				17 mm
XH4428EX-3BGG352C	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes			CMOS				3.3		Grid Array, Low Profile				1.27 mm					Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1					35 mm
XC4062XLA-08BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy	5472	Yes	3.6 V	2304	CMOS		289	40000	3.3	3.3 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 130000 gates	e0	263 MHz	30 s	289	225 °C (437 °F)	35 mm
XC4052XLA-08BG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy	1936	Yes	3.6 V	1936	CMOS		352	33000	3.3	3.3 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	3 V	1.27 mm		1 ns	1936 CLBS, 33000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 100000 gates	e0	263 MHz	30 s	352	225 °C (437 °F)	42.5 mm
XC3S400AN-4FT256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS		195	400000	1.2	1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	896 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	667 MHz	30 s	160	240 °C (464 °F)	17 mm
XC4062XLA-8BGG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS			40000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1 ns	2304 CLBS, 40000 Gates		Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	263 MHz				35 mm
XC4085XLA-9BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS			55000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	227 MHz				35 mm
XC4062XL-3BG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy	2304	Yes	3.6 V	2304	CMOS		384	40000	3.3	3.3 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.6 ns	2304 CLBS, 40000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Max usable 62000 Logic gates	e0	166 MHz	30 s	384	225 °C (437 °F)	42.5 mm
XC3S700AN-4FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V	1472	CMOS			700000	1.2		Grid Array, Low Profile			1.14 V	1 mm	85 °C (185 °F)	4.88 ns	1472 CLBS, 700000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	667 MHz				17 mm
XCV300E-7BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS		316	82944	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.42 ns	1536 CLBS, 82944 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	400 MHz	30 s	316	225 °C (437 °F)	40 mm
XC4062XLA-07BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	2304	Yes	3.6 V	2304	CMOS		384	40000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	0.9 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 130000 gates	e0	294 MHz	30 s	384	225 °C (437 °F)	40 mm
XCV300E-8BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS		316	82944	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.4 ns	1536 CLBS, 82944 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	416 MHz	30 s	316	225 °C (437 °F)	40 mm
XC4036XL-3BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	1296	Yes	3.6 V	1296	CMOS		288	22000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.6 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 36000 Logic gates	e0	166 MHz	30 s	288	225 °C (437 °F)	40 mm
XCV300E-6BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS		316	82944	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.47 ns	1536 CLBS, 82944 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	357 MHz	30 s	316	225 °C (437 °F)	40 mm
XC3S50A-5FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	1584	Yes	1.26 V	176	CMOS		144	50000	1.2	1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	176 CLBS, 50000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	770 MHz	30 s	112	225 °C (437 °F)	17 mm
XC3S50-5FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array, Low Profile			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1		30 s		260 °C (500 °F)	17 mm
XC4036XL-09BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	1296	Yes	3.6 V	1296	CMOS		288	22000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.2 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Typical gates = 22000-65000	e0	217 MHz	30 s	288	225 °C (437 °F)	40 mm
XC6SLX25-1LFT256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Low Profile			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	500 MHz				17 mm
XC4062XL-08CBG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy	5472	Yes	3.6 V	2304	CMOS		384	40000	3.3	3.3 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.1 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B560		1.7 mm	42.5 mm	No	Max usable 62000 Logic gates		238 MHz		384		42.5 mm
XCV812E-6BGG560C	Xilinx	FPGA	Commercial	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	1.89 V	4704	CMOS			254016	1.8		Grid Array, Low Profile			1.71 V	1.27 mm	70 °C (158 °F)	0.47 ns	4704 CLBS, 254016 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	357 MHz	30 s		260 °C (500 °F)	42.5 mm
XQV1000-4BGG560N	Xilinx	FPGA	Military	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	6144	CMOS			1124022	2.5		Grid Array, Low Profile			2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	6144 CLBS, 1124022 Gates	-55 °C (-67 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1		30 s		260 °C (500 °F)	42.5 mm
XC4052XL-2BG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy	1936	Yes	3.6 V	1936	CMOS		352	33000	3.3	3.3 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.5 ns	1936 CLBS, 33000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Max usable 52000 Logic gates	e0	179 MHz	30 s	352	225 °C (437 °F)	42.5 mm
5962-9851101NUB	Xilinx	FPGA	Military	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS	MIL-PRF-38535 Class N		40000	3.3		Grid Array, Low Profile			3 V	1.27 mm	125 °C (257 °F)	1.6 ns	2304 CLBS, 40000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B432		1.7 mm	40 mm	No	Maximum usable gates 130000	e0	166 MHz				40 mm
XC4085XL-3BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy	3136	Yes	3.6 V	3136	CMOS		448	55000	3.3	3.3 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.6 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Max usable 85000 Logic gates	e0	166 MHz	30 s	448	225 °C (437 °F)	42.5 mm
XCV812E-6BGG560I	Xilinx	FPGA	Industrial	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	1.89 V	4704	CMOS			254016	1.8		Grid Array, Low Profile			1.71 V	1.27 mm	85 °C (185 °F)	0.47 ns	4704 CLBS, 254016 Gates	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	357 MHz	30 s		260 °C (500 °F)	42.5 mm
XC4028EX-1BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	5.25 V	1024	CMOS			18000	5		Grid Array, Low Profile			4.75 V	1.27 mm	85 °C (185 °F)		1024 CLBS, 18000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B352		1.7 mm	35 mm	No							35 mm
XC4062XLA-8BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS			40000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	263 MHz				42.5 mm
XCV1000E-6BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS		404	331776	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.47 ns	6144 CLBS, 331776 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	357 MHz	30 s	404	260 °C (500 °F)	42.5 mm
XC3S1500-4FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array, Low Profile			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1		30 s		260 °C (500 °F)	17 mm
XC4052XLA-07BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	1936	Yes	3.6 V	1936	CMOS		352	33000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	0.9 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 100000 gates	e0	294 MHz	30 s	352	225 °C (437 °F)	40 mm
XC4036XLA-08BGG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS			22000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1 ns	1296 CLBS, 22000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 65000 gates	e1	263 MHz	30 s		260 °C (500 °F)	40 mm
XC4028EX-2BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	5.5 V	1024	CMOS			18000	5		Grid Array, Low Profile			4.5 V	1.27 mm			1024 CLBS, 18000 Gates			Bottom	S-PBGA-B352		1.7 mm	35 mm	No			166 MHz				35 mm
XH4436EX-3BGG352C	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes			CMOS				3.3		Grid Array, Low Profile				1.27 mm					Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1					35 mm
XC4062XL-3BGG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS			40000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1.6 ns	2304 CLBS, 40000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 62000 Logic gates	e1	166 MHz	30 s		260 °C (500 °F)	40 mm
XCV600E-6BG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS		316	186624	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.47 ns	3456 CLBS, 186624 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	357 MHz	30 s	316	225 °C (437 °F)	40 mm
XC4052XL-09BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Rectangular	Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.2 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B560	3	1.7 mm	42.5 mm	No	Typical gates = 33000-100000	e1	217 MHz	30 s		260 °C (500 °F)	42.5 mm
XC40150XV-9BG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy		Yes	2.7 V	5184	CMOS			100000	2.5		Grid Array, Low Profile			2.3 V	1.27 mm		1.2 ns	5184 CLBS, 100000 Gates			Bottom	S-PBGA-B560		1.7 mm	42.5 mm	No			188 MHz				42.5 mm
XCV2000E-7BGG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS		404	518400	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.42 ns	9600 CLBS, 518400 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	400 MHz	30 s	404	260 °C (500 °F)	42.5 mm
XC5215L-3BG352C	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	484	CMOS			15000	3.3		Grid Array, Low Profile			3 V	1.27 mm			484 CLBS, 15000 Gates			Bottom	S-PBGA-B352		1.65 mm	35 mm	No	Typical gates = 15000-23000						35 mm
XC4052XLA-08BG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	1936	Yes	3.6 V	1936	CMOS		352	33000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm		1 ns	1936 CLBS, 33000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 100000 gates	e0	263 MHz	30 s	352	225 °C (437 °F)	40 mm
XC4036XLA-7BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS			22000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	0.9 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	294 MHz				35 mm
XC4044XLA-07BGG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS			27000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	0.9 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 80000 gates	e1	294 MHz	30 s		260 °C (500 °F)	40 mm
XC4052XLA-8BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	263 MHz				35 mm
XC6SLX16-1LFT256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Low Profile			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	500 MHz				17 mm
XC40110XV-7BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	2.7 V	4096	CMOS			75000	2.5		Grid Array, Low Profile			2.3 V	1.27 mm	85 °C (185 °F)	0.9 ns	4096 CLBS, 75000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	250 MHz				42.5 mm
XCV400E-7BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	2400	CMOS		404	129600	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.42 ns	2400 CLBS, 129600 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	400 MHz	30 s	404	260 °C (500 °F)	42.5 mm
XCV400E-8BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	2400	CMOS		404	129600	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.4 ns	2400 CLBS, 129600 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	416 MHz	30 s	404	225 °C (437 °F)	42.5 mm
XC4085XLA-9BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS			55000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	227 MHz				42.5 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.