LBGA Field Programmable Gate Arrays (FPGA) 1,674

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCV200E-7BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS		260	63504	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.42 ns	1176 CLBS, 63504 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	400 MHz	30 s	260	225 °C (437 °F)	35 mm
XC3S5000-5FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array, Low Profile			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1		30 s		260 °C (500 °F)	17 mm
XCV400-6BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	10800	Yes	2.625 V	2400	CMOS		316	468252	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	85 °C (185 °F)	0.6 ns	2400 CLBS, 468252 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	333 MHz	30 s	316	225 °C (437 °F)	40 mm
XC40110XV-8BGG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy		Yes	2.7 V	4096	CMOS			75000	2.5		Grid Array, Low Profile			2.3 V	1.27 mm		1.1 ns	4096 CLBS, 75000 Gates		Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	217 MHz				42.5 mm
XCV800-6BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	21168	Yes	2.625 V	4704	CMOS		316	888439	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	85 °C (185 °F)	0.6 ns	4704 CLBS, 888439 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	333 MHz	30 s	316	225 °C (437 °F)	40 mm
XC4044XLA-09BGG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS			27000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 80000 gates	e1	227 MHz	30 s		260 °C (500 °F)	40 mm
XC3S200A-4FT256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	4032	Yes	1.26 V	448	CMOS		195	200000	1.2	1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	448 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	667 MHz	30 s	160	225 °C (437 °F)	17 mm
XC40110XV-8BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	2.7 V	4096	CMOS			75000	2.5		Grid Array, Low Profile			2.3 V	1.27 mm	85 °C (185 °F)	1.1 ns	4096 CLBS, 75000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	217 MHz				35 mm
XCV812E-7BG560I	Xilinx	FPGA	Industrial	Ball	560	LBGA	Square	Plastic/Epoxy	21168	Yes	1.89 V	4704	CMOS		404	254016	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.42 ns	4704 CLBS, 254016 Gates	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	400 MHz	30 s	404	225 °C (437 °F)	42.5 mm
XC4085XLA-08BG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy	3136	Yes	3.6 V	3136	CMOS		448	55000	3.3	3.3 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	3 V	1.27 mm		1 ns	3136 CLBS, 55000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 180000 gates	e0	263 MHz	30 s	448	225 °C (437 °F)	42.5 mm
XC4052XLA-8BGG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS			33000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1 ns	1936 CLBS, 33000 Gates		Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	263 MHz				42.5 mm
XC4036XL-09BGG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS			22000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.2 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Typical gates = 22000-65000	e1	217 MHz	30 s		260 °C (500 °F)	40 mm
XCV200E-6BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS		260	63504	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.47 ns	1176 CLBS, 63504 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	357 MHz	30 s	260	260 °C (500 °F)	35 mm
XC4085XLA-08BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy	7448	Yes	3.6 V	3136	CMOS		289	55000	3.3	3.3 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 180000 gates	e0	263 MHz	30 s	289	225 °C (437 °F)	35 mm
XC6SLX9-3NFTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Low Profile			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	806 MHz				17 mm
XCV600E-8BGG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS		316	186624	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.4 ns	3456 CLBS, 186624 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1	416 MHz	30 s	316	260 °C (500 °F)	40 mm
XQV300-4BGG352N	Xilinx	FPGA	Military	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS			322970	2.5		Grid Array, Low Profile			2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	1536 CLBS, 322970 Gates	-55 °C (-67 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1		30 s		260 °C (500 °F)	35 mm
XC4028XL-3BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1024	CMOS			18000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.6 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Max usable 28000 Logic gates	e1	166 MHz	30 s		260 °C (500 °F)	35 mm
XCV1000-6BGG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	6144	CMOS			1124022	2.5		Grid Array, Low Profile			2.375 V	1.27 mm		0.6 ns	6144 CLBS, 1124022 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	333 MHz	30 s		260 °C (500 °F)	42.5 mm
XA3S1200E-4FTG256Q	Xilinx	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS	AEC-Q100	190	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)	4.88 ns	2168 CLBS, 1200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	572 MHz	30 s	150	260 °C (500 °F)	17 mm
XC4085XLA-9BG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS			55000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1.1 ns	3136 CLBS, 55000 Gates		Tin Lead	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	227 MHz				42.5 mm
XCV300-5BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS			322970	2.5		Grid Array, Low Profile			2.375 V	1.27 mm	85 °C (185 °F)	0.5 ns	1536 CLBS, 322970 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1					42.5 mm
XC6SLX16-1LFT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Low Profile			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	500 MHz				17 mm
XC4044XL-1BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS			27000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.3 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Max usable 44000 Logic gates	e1	200 MHz	30 s		260 °C (500 °F)	35 mm
XC3S250E-4FT256CS1	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS		172	250000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	612 CLBS, 250000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	572 MHz	30 s	132	225 °C (437 °F)	17 mm
XC4044EX-4BGG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy		Yes	5.5 V	1600	CMOS			27000	5		Grid Array, Low Profile			4.5 V	1.27 mm	100 °C (212 °F)		1600 CLBS, 27000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.65 mm	40 mm	No	Typical gates = 27000-80000	e1	111 MHz				40 mm
XCV400-5BG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	10800	Yes	2.625 V	2400	CMOS		316	468252	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	2.375 V	1.27 mm		0.7 ns	2400 CLBS, 468252 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	294 MHz	30 s	316	225 °C (437 °F)	40 mm
XC4062XLA-08BG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	2304	Yes	3.6 V	2304	CMOS		384	40000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm		1 ns	2304 CLBS, 40000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 130000 gates	e0	263 MHz	30 s	384	225 °C (437 °F)	40 mm
XC4085XLA-09BG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy	3136	Yes	3.6 V	3136	CMOS		448	55000	3.3	3.3 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.1 ns	3136 CLBS, 55000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 180000 gates	e0	227 MHz	30 s	448	225 °C (437 °F)	42.5 mm
XCV400E-6BGG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	2400	CMOS		316	129600	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.47 ns	2400 CLBS, 129600 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1	357 MHz	30 s	316	260 °C (500 °F)	40 mm
XCV300-6BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy	6912	Yes	2.625 V	1536	CMOS		260	322970	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	2.375 V	1.27 mm		0.6 ns	1536 CLBS, 322970 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	333 MHz	30 s	260	225 °C (437 °F)	35 mm
XCV200E-6BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS		260	63504	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.47 ns	1176 CLBS, 63504 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	357 MHz	30 s	260	225 °C (437 °F)	35 mm
XC4085XLA-8BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS			55000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	263 MHz				42.5 mm
XCV812E-8BGG560C	Xilinx	FPGA	Commercial	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	1.89 V	4704	CMOS			254016	1.8		Grid Array, Low Profile			1.71 V	1.27 mm	70 °C (158 °F)	0.4 ns	4704 CLBS, 254016 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	416 MHz	30 s		260 °C (500 °F)	42.5 mm
XC4062XLA-9BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS			40000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	227 MHz				35 mm
XCV300E-8BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS		260	82944	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.4 ns	1536 CLBS, 82944 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	416 MHz	30 s	260	225 °C (437 °F)	35 mm
XCV300E-6BGG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS		316	82944	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.47 ns	1536 CLBS, 82944 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1	357 MHz	30 s	316	260 °C (500 °F)	40 mm
XCV200E-8BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS		260	63504	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.4 ns	1176 CLBS, 63504 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	416 MHz	30 s	260	225 °C (437 °F)	35 mm
XCV400-5BGG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	2400	CMOS			468252	2.5		Grid Array, Low Profile			2.375 V	1.27 mm	85 °C (185 °F)	0.7 ns	2400 CLBS, 468252 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1	294 MHz	30 s		260 °C (500 °F)	40 mm
XC4085XL-3BGG432I	Xilinx	FPGA		Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS			55000	3.3		Grid Array, Low Profile			3 V	1.27 mm		1.6 ns	3136 CLBS, 55000 Gates		Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 85000 Logic gates	e1	166 MHz	30 s		260 °C (500 °F)	40 mm
XCV300-4BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS			322970	2.5		Grid Array, Low Profile			2.375 V	1.27 mm	85 °C (185 °F)	0.8 ns	1536 CLBS, 322970 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	250 MHz	30 s		260 °C (500 °F)	35 mm
XC4062XL-09BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Rectangular	Plastic/Epoxy	2304	Yes	3.6 V	2304	CMOS		384	40000	3.3	3.3 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.2 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	R-PBGA-B560	3	1.7 mm	42.5 mm	No	Typical gates = 40000-130000	e0	217 MHz	30 s	384	225 °C (437 °F)	42.5 mm
XCV1600E-8BGG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS		404	419904	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm		0.4 ns	7776 CLBS, 419904 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	416 MHz	30 s	404	260 °C (500 °F)	42.5 mm
XCV2000E-7BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS		404	518400	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.42 ns	9600 CLBS, 518400 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	400 MHz	30 s	404	260 °C (500 °F)	42.5 mm
XC4085XL-1BGG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS			55000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.3 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 85000 Logic gates	e1	200 MHz	30 s		260 °C (500 °F)	40 mm
XCV400E-6BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	2400	CMOS		404	129600	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.47 ns	2400 CLBS, 129600 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	357 MHz	30 s	404	225 °C (437 °F)	42.5 mm
XA3S700A-4FTG256I	Xilinx	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS			700000	1.2		Grid Array, Low Profile			1.14 V	1 mm	100 °C (212 °F)	4.88 ns	1472 CLBS, 700000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	667 MHz				17 mm
XC40200XV-09BG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy	7056	Yes	2.7 V	7056	CMOS		448	130000	2.5	2.5,3.3 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	2.3 V	1.27 mm		1.3 ns	7056 CLBS, 130000 Gates		Tin Lead	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 400000 gates	e0	225 MHz	30 s	448	225 °C (437 °F)	42.5 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.