QFF Field Programmable Gate Arrays (FPGA) 197

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
M1AFS250-1PQG208I	Microsemi	FPGA	Industrial	Flat	208	QFF	Rectangular	Plastic/Epoxy		Yes	1.575 V	6144	CMOS			250000	1.5		Flatpack			1.425 V	.5 mm	85 °C (185 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-F208	3	4.1 mm	28 mm	No		e3					30.6 mm
A54SX32-CQ208	Microchip Technology	FPGA	Commercial	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	2880	Yes	3.63 V	2880	CMOS		246	32000	3.3	3.3,5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	70 °C (158 °F)	1 ns	2880 CLBS, 32000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F208		3.06 mm	29.21 mm	No	48000 system gates avaiable	e0	205 MHz		246		29.21 mm
A54SX32-CQ208B	Microchip Technology	FPGA	Military	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	2880	Yes	3.63 V	2880	CMOS	MIL-STD-883 Class B	246	32000	3.3	3.3,5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	125 °C (257 °F)	1 ns	2880 CLBS, 32000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.06 mm	29.21 mm	No	48000 system gates avaiable	e0	205 MHz		246		29.21 mm
A54SX32ACQ208	Microsemi	FPGA	Commercial	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS		174	48000	2.5	2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	70 °C (158 °F)	1.2 ns	2880 CLBS, 48000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	32000 typical gates available	e0	238 MHz		174		29.21 mm
A54SX32A-CQ208	Microchip Technology	FPGA	Commercial	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS		174	48000	2.5	2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	70 °C (158 °F)	1.2 ns	2880 CLBS, 48000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	32000 typical gates available	e0	238 MHz		174		29.21 mm
A54SX32CQ208	Actel	FPGA	Commercial	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	2880	Yes	3.63 V	2880	CMOS		246	32000	3.3	3.3,5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	70 °C (158 °F)	1 ns	2880 CLBS, 32000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F208		3.06 mm	29.21 mm	No	48000 system gates avaiable	e0	205 MHz		246	225 °C (437 °F)	29.21 mm
A54SX32CQ208B	Actel	FPGA	Military	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	2880	Yes	3.63 V	2880	CMOS	MIL-STD-883 Class B	246	32000	3.3	3.3,5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	125 °C (257 °F)	1 ns	2880 CLBS, 32000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.06 mm	29.21 mm	No	48000 system gates avaiable	e0	205 MHz		246	225 °C (437 °F)	29.21 mm
A54SX72A-CQ208M	Microchip Technology	FPGA	Military	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	6036	Yes	2.75 V	6036	CMOS		171	108000	2.5	2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.5 ns	6036 CLBS, 108000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	72000 typical gates available	e0	217 MHz		171		29.21 mm
A54SX72ACQ208M	Microsemi	FPGA	Military	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	6036	Yes	2.75 V	6036	CMOS		171	108000	2.5	2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.5 ns	6036 CLBS, 108000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	72000 typical gates available	e0	217 MHz		171		29.21 mm
A54SX32-1CQ208B	Microchip Technology	FPGA	Military	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	2880	Yes	3.63 V	2880	CMOS	MIL-STD-883 Class B	246	32000	3.3	3.3,5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	125 °C (257 °F)	0.9 ns	2880 CLBS, 32000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.06 mm	29.21 mm	No	48000 system gates avaiable	e0	240 MHz		246		29.21 mm
A54SX32A-CQ208B	Microchip Technology	FPGA	Military	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS	MIL-STD-883 Class B	174	48000	2.5	2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.2 ns	2880 CLBS, 48000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	32000 typical gates available	e0	238 MHz		174		29.21 mm
A54SX32A-CQ208M	Microchip Technology	FPGA	Military	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS		174	48000	2.5	2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.2 ns	2880 CLBS, 48000 Gates	-55 °C (-67 °F)	Tin/Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	32000 typical gates available	e0	238 MHz	20 s	174	225 °C (437 °F)	29.21 mm
A54SX32ACQ208B	Microsemi	FPGA	Military	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS	MIL-STD-883 Class B	174	48000	2.5	2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.2 ns	2880 CLBS, 48000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	32000 typical gates available	e0	238 MHz		174		29.21 mm
A54SX32ACQ208M	Microsemi	FPGA	Military	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS		174	48000	2.5	2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.2 ns	2880 CLBS, 48000 Gates	-55 °C (-67 °F)	Tin/Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	32000 typical gates available	e0	238 MHz	20 s	174	225 °C (437 °F)	29.21 mm
A54SX72A-CQ208B	Microchip Technology	FPGA	Military	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	6036	Yes	2.75 V	6036	CMOS	MIL-STD-883 Class B	171	108000	2.5	2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.5 ns	6036 CLBS, 108000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	72000 typical gates available	e0	217 MHz		171		29.21 mm
A54SX72ACQ208B	Microsemi	FPGA	Military	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	6036	Yes	2.75 V	6036	CMOS	MIL-STD-883 Class B	171	108000	2.5	2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.5 ns	6036 CLBS, 108000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	72000 typical gates available	e0	217 MHz		171		29.21 mm
RTAX2000SL-1CQ352E	Microchip Technology	FPGA	Military	Flat	352	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	1.575 V	21504	CMOS		684	2000000	1.5	1.5/3.3 V	Flatpack	TPAK352,2.9SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	125 °C (257 °F)	0.95 ns	21504 CLBS, 2000000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F352		2.89 mm	48 mm	No	250000 ASIC gates also available	e0			684		48 mm
A54SX32A-1CQ208M	Microchip Technology	FPGA	Military	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	2880	Yes	2.75 V	2880	CMOS		174	48000	2.5	2.5,3.3/5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.1 ns	2880 CLBS, 48000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.3 mm	29.21 mm	No	32000 typical gates available	e0	278 MHz		174		29.21 mm
RTAX2000SLCQ352B	Microchip Technology	FPGA	Military	Flat	352	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	1.575 V	21504	CMOS	MIL-STD-883 Class B	684	2000000	1.5	1.5/3.3 V	Flatpack	TPAK352,2.9SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	125 °C (257 °F)	1.11 ns	21504 CLBS, 2000000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F352		2.89 mm	48 mm	No	250000 ASIC gates also available	e0			684		48 mm
RTAX2000SL-CQ352B	Microsemi	FPGA	Military	Flat	352	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	1.575 V	21504	CMOS	MIL-STD-883 Class B	684	2000000	1.5	1.5/3.3 V	Flatpack	TPAK352,2.9SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	125 °C (257 °F)	1.11 ns	21504 CLBS, 2000000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F352		2.89 mm	48 mm	No	250000 ASIC gates also available	e0			684		48 mm
A54SX16-1CQ208B	Microsemi	FPGA	Military	Flat	208	QFF	Square	Ceramic, Metal-Sealed Cofired	1452	Yes	3.63 V	1452	CMOS	MIL-STD-883 Class B	172	16000	3.3	3.3,5 V	Flatpack	TPAK208,2.9SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	125 °C (257 °F)	0.9 ns	1452 CLBS, 16000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F208		3.06 mm	29.21 mm	No	24000 system gates avaiable	e0	240 MHz		172		29.21 mm
A54SX32-1CQ256M	Microsemi	FPGA	Military	Flat	256	QFF	Square	Ceramic, Metal-Sealed Cofired	2880	Yes	3.63 V	2880	CMOS		246	32000	3.3	3.3,5 V	Flatpack	TPAK256,3SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	125 °C (257 °F)	0.9 ns	2880 CLBS, 32000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F256		3.06 mm	36 mm	No	48000 system gates avaiable	e0	240 MHz		246		36 mm
A54SX32-CQ256B	Microsemi	FPGA	Military	Flat	256	QFF	Square	Ceramic, Metal-Sealed Cofired	2880	Yes	3.63 V	2880	CMOS	MIL-STD-883 Class B	246	32000	3.3	3.3,5 V	Flatpack	TPAK256,3SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	125 °C (257 °F)	1 ns	2880 CLBS, 32000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F256		3.06 mm	36 mm	No	48000 system gates avaiable	e0	205 MHz		246		36 mm
A54SX32-CQ256M	Microsemi	FPGA	Military	Flat	256	QFF	Square	Ceramic, Metal-Sealed Cofired	2880	Yes	3.63 V	2880	CMOS		246	32000	3.3	3.3,5 V	Flatpack	TPAK256,3SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	125 °C (257 °F)	1 ns	2880 CLBS, 32000 Gates	-55 °C (-67 °F)	Tin/Lead	Quad	S-CQFP-F256		3.06 mm	36 mm	No	48000 system gates avaiable	e0	205 MHz	20 s	246	225 °C (437 °F)	36 mm
A54SX32CQ256B	Actel	FPGA	Military	Flat	256	QFF	Square	Ceramic, Metal-Sealed Cofired	2880	Yes	3.63 V	2880	CMOS	MIL-STD-883 Class B	246	32000	3.3	3.3,5 V	Flatpack	TPAK256,3SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	125 °C (257 °F)	1 ns	2880 CLBS, 32000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F256		3.06 mm	36 mm	No	48000 system gates avaiable	e0	205 MHz		246	225 °C (437 °F)	36 mm
A54SX32CQ256M	Actel	FPGA	Military	Flat	256	QFF	Square	Ceramic, Metal-Sealed Cofired	2880	Yes	3.63 V	2880	CMOS		246	32000	3.3	3.3,5 V	Flatpack	TPAK256,3SQ,20	Field Programmable Gate Arrays	2.97 V	.5 mm	125 °C (257 °F)	1 ns	2880 CLBS, 32000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F256		3.06 mm	36 mm	No	48000 system gates avaiable	e0	205 MHz		246	225 °C (437 °F)	36 mm
A54SX72ACQ256M	Microsemi	FPGA	Military	Flat	256	QFF	Square	Ceramic, Metal-Sealed Cofired	6036	Yes	2.75 V	6036	CMOS		213	108000	2.5	2.5,3.3/5 V	Flatpack	TPAK256,3SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.5 ns	6036 CLBS, 108000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F256		3.3 mm	36 mm	No	72000 typical gates available	e0	217 MHz		213		36 mm
A54SX72A-CQ256M	Microchip Technology	FPGA	Military	Flat	256	QFF	Square	Ceramic, Metal-Sealed Cofired	6036	Yes	2.75 V	6036	CMOS		213	108000	2.5	2.5,3.3/5 V	Flatpack	TPAK256,3SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	125 °C (257 °F)	1.5 ns	6036 CLBS, 108000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F256		3.3 mm	36 mm	No	72000 typical gates available	e0	217 MHz		213		36 mm
5962-9096401MYX	Texas Instruments	FPGA	Military	Flat	84	QFF	Square	Ceramic	295	Yes			CMOS	38535Q/M;38534H;883B	57		5	5 V	Flatpack	QFL84,.65SQ,25	Field Programmable Gate Arrays		.635 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQFP-F84				No					57
TPC1280MHFG172	Texas Instruments	FPGA	Military	Flat	172	QFF	Square	Ceramic, Metal-Sealed Cofired	1232	Yes	5.5 V	1232	CMOS	MIL-STD-883	140	8000	5	5 V	Flatpack	TPAK172(UNSPEC)	Field Programmable Gate Arrays	4.5 V		125 °C (257 °F)		1232 CLBS, 8000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F172				No			39 MHz		140
TPC1280MHFG172B-1	Texas Instruments	FPGA	Military	Flat	172	QFF	Square	Ceramic, Metal-Sealed Cofired	1232	Yes	5.5 V	1232	CMOS	MIL-STD-883 Class B	140	8000	5	5 V	Flatpack	TPAK172(UNSPEC)	Field Programmable Gate Arrays	4.5 V		125 °C (257 °F)		1232 CLBS, 8000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F172				No			50 MHz		140
TPC1010AMHT84	Texas Instruments	FPGA	Military	Flat	84	QFF	Square	Ceramic	295	Yes			CMOS		57		5	5 V	Flatpack	QFL84,.65SQ,25	Field Programmable Gate Arrays		.635 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQFP-F84				No					57
TPC1280MHFG172B	Texas Instruments	FPGA	Military	Flat	172	QFF	Square	Ceramic, Metal-Sealed Cofired	1232	Yes	5.5 V	1232	CMOS	MIL-STD-883 Class B	140	8000	5	5 V	Flatpack	TPAK172(UNSPEC)	Field Programmable Gate Arrays	4.5 V	.64 mm	125 °C (257 °F)	18.72 ns	1232 CLBS, 8000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F172		3.3 mm	26.665 mm	No	MAX 140 I/OS; 998 flip-flops		39 MHz		140		26.665 mm
TPC1020AMHT84B	Texas Instruments	FPGA	Military	Flat	84	QFF	Square	Ceramic, Metal-Sealed Cofired	547	Yes	5.5 V	547	CMOS	38535Q/M;38534H;883B	69	2000	5	5 V	Flatpack	QFL84,.65SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	19.332 ns	547 CLBS, 2000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F84		3.3 mm	16.51 mm	No	MAX 69 I/OS; 273 flip-flops		100 MHz		69		16.51 mm
TPC1280MHFG172-1	Texas Instruments	FPGA	Military	Flat	172	QFF	Square	Ceramic, Metal-Sealed Cofired	1232	Yes	5.5 V	1232	CMOS	MIL-STD-883	140	8000	5	5 V	Flatpack	TPAK172(UNSPEC)	Field Programmable Gate Arrays	4.5 V		125 °C (257 °F)		1232 CLBS, 8000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F172				No			50 MHz		140
TPC1020AMHT84B-1	Texas Instruments	FPGA	Military	Flat	84	QFF	Square	Ceramic, Metal-Sealed Cofired	547	Yes	5.5 V	547	CMOS	38535Q/M;38534H;883B	69	2000	5	5 V	Flatpack	QFL84,.65SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	16.092 ns	547 CLBS, 2000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F84		3.3 mm	16.51 mm	No	MAX 69 I/OS; 273 flip-flops				69		16.51 mm
TPC1010AMHT84B	Texas Instruments	FPGA	Military	Flat	84	QFF	Square	Ceramic, Metal-Sealed Cofired	295	Yes	5.5 V	295	CMOS	38535Q/M;38534H;883B	57	1200	5	5 V	Flatpack	QFL84,.65SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	19.332 ns	295 CLBS, 1200 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F84		3.3 mm	16.51 mm	No	MAX 57 I/OS; 130 flip-flops		100 MHz		57		16.51 mm
5962-01-399-1589	Texas Instruments	FPGA	Military	Flat	84	QFF	Square	Ceramic	547	Yes			CMOS	38535Q/M;38534H;883B	69		5	5 V	Flatpack	QFL84,.65SQ,25	Field Programmable Gate Arrays		.635 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQFP-F84				No					69
TPC1020AMHT84-1	Texas Instruments	FPGA	Military	Flat	84	QFF	Square	Ceramic	547	Yes			CMOS		69		5	5 V	Flatpack	QFL84,.65SQ,25	Field Programmable Gate Arrays		.635 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQFP-F84				No					69
TPC1020AMHT84	Texas Instruments	FPGA	Military	Flat	84	QFF	Square	Ceramic, Metal-Sealed Cofired	547	Yes	5.5 V	547	CMOS		69	2000	5	5 V	Flatpack	QFL84,.65SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	19.332 ns	547 CLBS, 2000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F84		3.3 mm	16.51 mm	No	MAX 69 I/OS; 273 flip-flops		100 MHz		69		16.51 mm
TPC1010AMHT84-1	Texas Instruments	FPGA	Military	Flat	84	QFF	Square	Ceramic	295	Yes			CMOS		57		5	5 V	Flatpack	QFL84,.65SQ,25	Field Programmable Gate Arrays		.635 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQFP-F84				No					57
M38510/60811BZX	Texas Instruments	FPGA	Military	Flat	196	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V		CMOS			11000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)		11000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F196		3.302 mm	34.29 mm	No							34.29 mm
TPC1010AMHT84B-1	Texas Instruments	FPGA	Military	Flat	84	QFF	Square	Ceramic	295	Yes			CMOS	38535Q/M;38534H;883B	57		5	5 V	Flatpack	QFL84,.65SQ,25	Field Programmable Gate Arrays		.635 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQFP-F84				No					57
XC3090-70CQ164I	Xilinx	FPGA	Industrial	Flat	164	QFF	Square	Ceramic, Metal-Sealed Cofired	320	Yes	5.5 V	320	CMOS		142	9000	5	5 V	Flatpack	QFL164,1.2SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	85 °C (185 °F)	9 ns	320 CLBS, 9000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-CQFP-F164	1	3.683 mm	27.432 mm	No	MAX 142 I/OS; 928 flip-flops	e0	70 MHz		142		27.432 mm
5962-8971303QTA	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	144	CMOS	MIL-PRF-38535 Class Q		4200	5		Flatpack			4.5 V		125 °C (257 °F)	7 ns	144 CLBS, 4200 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100							100 MHz
5962-8971302MNX	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
XC3090-100CQ164CSPC0107	Xilinx	FPGA	Commercial	Flat	164	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.25 V	320	CMOS			9000	5		Flatpack			4.75 V	.635 mm	70 °C (158 °F)	7 ns	320 CLBS, 9000 Gates	0 °C (32 °F)		Quad	S-CQFP-F164		3.683 mm	27.432 mm	No	MAX 142 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		100 MHz				27.432 mm
5962-8971301MNC	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.