QFF Field Programmable Gate Arrays (FPGA) 197

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XC3020-100CQ100CSPC0107

Xilinx

FPGA

Commercial

Flat

100

QFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.25 V

64

CMOS

2000

5

Flatpack

4.75 V

.635 mm

70 °C (158 °F)

7 ns

64 CLBS, 2000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-CQFP-F100

3.683 mm

17.272 mm

No

MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C

e0

100 MHz

17.272 mm

XC3020-70CQ100B

Xilinx

FPGA

Military

Flat

100

QFF

Square

Ceramic, Metal-Sealed Cofired

64

Yes

5.5 V

64

CMOS

38535Q/M;38534H;883B

64

2000

5

5 V

Flatpack

QFL100,.7SQ,25

Field Programmable Gate Arrays

4.5 V

.635 mm

125 °C (257 °F)

9 ns

64 CLBS, 2000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F100

1

3.683 mm

17.272 mm

No

MAX 64 I/OS; 256 flip-flops

e0

70 MHz

64

17.272 mm

XC3020-50CQ100CSPC0107

Xilinx

FPGA

Commercial

Flat

100

QFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.25 V

64

CMOS

2000

5

Flatpack

4.75 V

.635 mm

70 °C (158 °F)

64 CLBS, 2000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-CQFP-F100

3.683 mm

17.272 mm

No

MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C

e0

50 MHz

17.272 mm

XC3020-50CQ100C

Xilinx

FPGA

Commercial

Flat

100

QFF

Square

Ceramic, Metal-Sealed Cofired

64

Yes

5.25 V

64

CMOS

64

2000

5

5 V

Flatpack

QFL100,.7SQ,25

Field Programmable Gate Arrays

4.75 V

.635 mm

70 °C (158 °F)

64 CLBS, 2000 Gates

0 °C (32 °F)

Quad

S-CQFP-F100

1

3.683 mm

17.272 mm

No

MAX 64 I/OS; 256 flip-flops

50 MHz

64

17.272 mm

XC3020-50CQ100M

Xilinx

FPGA

Military

Flat

100

QFF

Square

Ceramic, Metal-Sealed Cofired

64

Yes

5.5 V

64

CMOS

64

2000

5

5 V

Flatpack

QFL100,.7SQ,25

Field Programmable Gate Arrays

4.5 V

.635 mm

125 °C (257 °F)

64 CLBS, 2000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F100

1

3.683 mm

17.272 mm

No

MAX 64 I/OS; 256 flip-flops

50 MHz

64

17.272 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.