TFBGA Field Programmable Gate Arrays (FPGA) 1,339

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
10CL010YM164C8G	Intel	FPGA	Other	Ball	164	TFBGA	Square	Plastic/Epoxy		Yes	1.25 V	645				1.2		Grid Array, Thin Profile, Fine Pitch			1.15 V	.5 mm	85 °C (185 °F)		645 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B164		1.2 mm	8 mm								8 mm
5CEFA2M13C8N	Intel	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy	25000	Yes	1.13 V		CMOS	223		1.1	1.1,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA383,25X25,20	Field Programmable Gate Arrays	1.07 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B383		1.1 mm	13 mm	No					223		13 mm
XC2S15-5CS144I	Xilinx	FPGA		Ball	144	TFBGA	Square	Plastic/Epoxy	432	Yes	2.625 V	96	CMOS	96	15000	2.5	1.5/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	2.375 V	.8 mm		0.7 ns	96 CLBS, 15000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e0	263 MHz	30 s	92	240 °C (464 °F)	12 mm
XC6SLX9-3CPG196C	Xilinx	FPGA	Other	Ball	196	TFBGA	Square	Plastic/Epoxy	9152	Yes	1.26 V	715	CMOS	100		1.2	1.2,2.5/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.21 ns	715 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e8	862 MHz	30 s	100	260 °C (500 °F)	8 mm
XC7S15-1CPGA196Q	Xilinx	FPGA	Automotive	Ball	196	TFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000		100		1		Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		.95 V	.5 mm	125 °C (257 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Matte Tin	Bottom	S-PBGA-B196		1.1 mm	8 mm			e3	1098 MHz		100		8 mm
XCS20XL-4CS144C	Xilinx	FPGA	Other	Ball	144	TFBGA	Square	Plastic/Epoxy	400	Yes	3.6 V	400	CMOS	160	7000	3.3	3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	3 V	.8 mm	85 °C (185 °F)	1.1 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No	Maximum usable gates 20000	e0	217 MHz	30 s	160	240 °C (464 °F)	12 mm
AGL400V5-CSG196	Microchip Technology	FPGA	Other	Ball	196	TFBGA	Square	Plastic/Epoxy	9216	Yes	1.575 V		CMOS	143	400000	1.5		Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		1.425 V	.5 mm	85 °C (185 °F)		400000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B196	3	1.2 mm	8 mm	No				30 s	143	260 °C (500 °F)	8 mm
5CGTFD5C5M13I7N	Intel	FPGA	Industrial	Ball	383	TFBGA	Square	Plastic/Epoxy	77000	Yes	1.13 V	2908	CMOS	175		1.1	1.1,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA383,25X25,20	Field Programmable Gate Arrays	1.07 V	.5 mm	100 °C (212 °F)		2908 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B383		1.1 mm	13 mm	No					175		13 mm
XC6SLX4-2CPG196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	3840	Yes	1.26 V	300	CMOS	100		1.2	1.2,2.5/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.26 ns	300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e8	667 MHz	30 s	100	260 °C (500 °F)	8 mm
5CGXFC4C6M13I7N	Intel	FPGA		Ball	383	TFBGA	Square	Plastic/Epoxy	50000	Yes	1.13 V		CMOS	175		1.1	1.1,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA383,25X25,20	Field Programmable Gate Arrays	1.07 V	.5 mm						Bottom	S-PBGA-B383		1.1 mm	13 mm	No					175		13 mm
5CGXFC5C6M13I7N	Intel	FPGA		Ball	383	TFBGA	Square	Plastic/Epoxy	77000	Yes	1.13 V		CMOS	175		1.1	1.1,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA383,25X25,20	Field Programmable Gate Arrays	1.07 V	.5 mm						Bottom	S-PBGA-B383		1.1 mm	13 mm	No					175		13 mm
XC3S50-4CP132I	Xilinx	FPGA		Ball	132	TFBGA	Square	Plastic/Epoxy	1728	Yes	1.26 V	192	CMOS	89	50000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm		0.61 ns	192 CLBS, 50000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e0	630 MHz	30 s	89	225 °C (437 °F)	8 mm
XC3S500E-4CPG132C	Xilinx	FPGA	Other	Ball	132	TFBGA	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS	92	500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.76 ns	1164 CLBS, 500000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	572 MHz	30 s	85	260 °C (500 °F)	8 mm
XC6SLX9-L1CPG196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	9152	Yes	1.05 V	715	CMOS	100		1	1,2.5/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20	Field Programmable Gate Arrays	.95 V	.5 mm	100 °C (212 °F)	0.46 ns	715 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e8		30 s	100	260 °C (500 °F)	8 mm
5CEFA5M13I7N	Intel	FPGA		Ball	383	TFBGA	Square	Plastic/Epoxy	77000	Yes	1.13 V		CMOS	175		1.1	1.1,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA383,25X25,20	Field Programmable Gate Arrays	1.07 V	.5 mm						Bottom	S-PBGA-B383		1.1 mm	13 mm	No					175		13 mm
5CGXFC4C7M13C8N	Intel	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy	50000	Yes	1.13 V		CMOS	175		1.1	1.1,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA383,25X25,20	Field Programmable Gate Arrays	1.07 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B383		1.1 mm	13 mm	No					175		13 mm
5CGXFC5F6M11C6N	Intel	FPGA	Other	Ball	301	TFBGA	Square	Plastic/Epoxy	77000	Yes	1.13 V		CMOS	129		1.1	1.1,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA301,21X21,20	Field Programmable Gate Arrays	1.07 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B301		1.1 mm	11 mm	No					129		11 mm
XC6SLX16-2CPG196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS	100		1.2	1.2,2.5/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.26 ns	1139 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e8	667 MHz	30 s	100	260 °C (500 °F)	8 mm
XC6SLX9-3CPG196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	9152	Yes	1.26 V	715	CMOS	106		1.2	1.2,2.5/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.21 ns	715 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e8	862 MHz	30 s	106	260 °C (500 °F)	8 mm
10CL016YM164C8G	Intel	FPGA	Other	Ball	164	TFBGA	Square	Plastic/Epoxy		Yes	1.25 V	963				1.2		Grid Array, Thin Profile, Fine Pitch			1.15 V	.5 mm	85 °C (185 °F)		963 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B164		1.2 mm	8 mm								8 mm
5CEFA5M13C8N	Intel	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy	77000	Yes	1.13 V		CMOS	175		1.1	1.1,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA383,25X25,20	Field Programmable Gate Arrays	1.07 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B383		1.1 mm	13 mm	No					175		13 mm
5CGXFC5C6M13C6N	Intel	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy	77000	Yes	1.13 V		CMOS	175		1.1	1.1,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA383,25X25,20	Field Programmable Gate Arrays	1.07 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B383		1.1 mm	13 mm	No					175		13 mm
XC3S100E-4CPG132C	Xilinx	FPGA	Other	Ball	132	TFBGA	Square	Plastic/Epoxy	2160	Yes	1.26 V	240	CMOS	83	100000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.76 ns	240 CLBS, 100000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	572 MHz	30 s	72	260 °C (500 °F)	8 mm
XC3S500E-4CPG132I	Xilinx	FPGA	Industrial	Ball	132	TFBGA	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS	92	500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	1164 CLBS, 500000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	572 MHz	30 s	85	260 °C (500 °F)	8 mm
XC6SLX16-3CPG196C	Xilinx	FPGA	Other	Ball	196	TFBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS	100		1.2	1.2,2.5/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.21 ns	1139 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e8	862 MHz	30 s	100	260 °C (500 °F)	8 mm
XC6SLX16-L1CPG196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	14579	Yes	1.05 V	1139	CMOS	100		1	1,2.5/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20	Field Programmable Gate Arrays	.95 V	.5 mm	100 °C (212 °F)	0.46 ns	1139 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e8		30 s	100	260 °C (500 °F)	8 mm
XC6SLX4-3CPG196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	3840	Yes	1.26 V	300	CMOS	106		1.2	1.2,2.5/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.21 ns	300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e8	862 MHz	30 s	106	260 °C (500 °F)	8 mm
XCV100-4CS144C	Xilinx	FPGA	Other	Ball	144	TFBGA	Square	Plastic/Epoxy	2700	Yes	2.625 V	600	CMOS	94	108904	2.5	1.5/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	2.375 V	.8 mm	85 °C (185 °F)	0.8 ns	600 CLBS, 108904 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e0	250 MHz	30 s	94	240 °C (464 °F)	12 mm
AGL125V2-CSG196I	Microchip Technology	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	3072	Yes	1.575 V		CMOS	133	125000	1.2		Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		1.14 V	.5 mm	100 °C (212 °F)		125000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.2 mm	8 mm	No		e1		30 s	133	260 °C (500 °F)	8 mm
AGL125V5-CSG196I	Microchip Technology	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	3072	Yes	1.575 V		CMOS	133	125000	1.5		Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		1.425 V	.5 mm	100 °C (212 °F)		125000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B196	3	1.2 mm	8 mm	No				30 s	133	260 °C (500 °F)	8 mm
AGL250V2-CSG196I	Microchip Technology	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	6144	Yes	1.575 V		CMOS	145	250000	1.2		Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		1.14 V	.5 mm	100 °C (212 °F)		250000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.2 mm	8 mm	No		e1		30 s	145	260 °C (500 °F)	8 mm
AGL400V5-CS196I	Microchip Technology	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	9216	Yes	1.575 V		CMOS	143	400000	1.5		Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		1.425 V	.5 mm	100 °C (212 °F)		400000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B196		1.2 mm	8 mm	No					143		8 mm
M1AGL1000V2-CS281I	Microchip Technology	FPGA	Industrial	Ball	281	TFBGA	Square	Plastic/Epoxy	24576	Yes	1.575 V		CMOS	215	1000000	1.2		Grid Array, Thin Profile, Fine Pitch	BGA281,19X19,20		1.14 V	.5 mm	100 °C (212 °F)		1000000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B281		1.05 mm	10 mm	No		e0			215		10 mm
M2S025T-FCS325	Microchip Technology	FPGA		Ball	325	TFBGA	Square	Plastic/Epoxy	27696	Yes	1.26 V			180		1.2		Grid Array, Thin Profile, Fine Pitch	BGA325,21X21,20		1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B325		1.01 mm	11 mm					30 s	180	240 °C (464 °F)	11 mm
M2S060T-FCS325I	Microchip Technology	FPGA		Ball	325	TFBGA	Square	Plastic/Epoxy	56520	Yes	1.26 V			200		1.2		Grid Array, Thin Profile, Fine Pitch	BGA325,21X21,20		1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B325		1.01 mm	11 mm					30 s	200	240 °C (464 °F)	11 mm
M2S060TS-FCS325	Microchip Technology	FPGA		Ball	325	TFBGA	Square	Plastic/Epoxy	56520	Yes	1.26 V			200		1.2		Grid Array, Thin Profile, Fine Pitch	BGA325,21X21,20		1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B325		1.01 mm	11 mm					30 s	200	240 °C (464 °F)	11 mm
XCV100E-8CSG144I	Xilinx	FPGA		Ball	144	TFBGA	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS	94	32400	1.8	1.2/3.6,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	1.71 V	.8 mm		0.4 ns	600 CLBS, 32400 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	416 MHz	30 s	94	260 °C (500 °F)	12 mm
XC6SLX16-3NCPG196C	Xilinx	FPGA	Other	Ball	196	TFBGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array, Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e1	806 MHz				8 mm
XC2V40-6CS144I	Xilinx	FPGA		Ball	144	TFBGA	Square	Plastic/Epoxy	576	Yes	1.575 V	64	CMOS	88	40000	1.5	1.5,1.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	1.425 V	.8 mm		0.35 ns	64 CLBS, 40000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e0	820 MHz	30 s	88	240 °C (464 °F)	12 mm
XC7S15-L1CPGA196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	12800	Yes	.98 V	1000		100		0.95		Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		.92 V	.5 mm	100 °C (212 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196		1.1 mm	8 mm			e1	1098 MHz		100		8 mm
XC2S30-5CS144C	Xilinx	FPGA	Other	Ball	144	TFBGA	Square	Plastic/Epoxy	972	Yes	2.625 V	216		96	30000	2.5	1.5/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	2.375 V	.8 mm	85 °C (185 °F)	0.7 ns	216 CLBS, 30000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No	Maximum usable gates 30000	e0	263 MHz	30 s	92	240 °C (464 °F)	12 mm
XCSG40XL-5CSG280C	Xilinx	FPGA	Other	Ball	280	TFBGA	Square	Plastic/Epoxy		Yes	3.6 V	784	CMOS		13000	3.3		Grid Array, Thin Profile, Fine Pitch			3 V	.8 mm	85 °C (185 °F)	1 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No	Maximum usable gates 40000	e1	250 MHz				16 mm
XCV100E-6CSG144I	Xilinx	FPGA		Ball	144	TFBGA	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS	94	32400	1.8	1.2/3.6,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	1.71 V	.8 mm		0.47 ns	600 CLBS, 32400 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	357 MHz	30 s	94	260 °C (500 °F)	12 mm
XC3S100E-4CPG132IS1	Xilinx	FPGA	Industrial	Ball	132	TFBGA	Square	Plastic/Epoxy	2160	Yes	1.26 V	240	CMOS	83	100000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	240 CLBS, 100000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	572 MHz	30 s	72	260 °C (500 °F)	8 mm
XC2V250-4CSG144I	Xilinx	FPGA		Ball	144	TFBGA	Square	Plastic/Epoxy	3456	Yes	1.575 V	384	CMOS	92	250000	1.5	1.5,1.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	1.425 V	.8 mm		0.44 ns	384 CLBS, 250000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	650 MHz	30 s	92	260 °C (500 °F)	12 mm
XC3S2000-4CP132C	Xilinx	FPGA	Other	Ball	132	TFBGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array, Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B132		1.1 mm	8 mm	No							8 mm
XC3S250E-4CPG132CS1	Xilinx	FPGA	Other	Ball	132	TFBGA	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS	92	250000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.76 ns	612 CLBS, 250000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	572 MHz	30 s	85	260 °C (500 °F)	8 mm
XC2V80-6CSG144C	Xilinx	FPGA	Other	Ball	144	TFBGA	Square	Plastic/Epoxy	1152	Yes	1.575 V	128	CMOS	92	80000	1.5	1.5,1.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	1.425 V	.8 mm	85 °C (185 °F)	0.35 ns	128 CLBS, 80000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	820 MHz	30 s	92	260 °C (500 °F)	12 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.