Square Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
M2GL060T-1FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy		Yes	1.26 V						1.2	Tray		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm					30 s		250 °C (482 °F)	23 mm
M2S060TS-1FGG484I	Microchip Technology	FPGA		Ball	484	BGA	Square		Plastic/Epoxy	56520	Yes	1.26 V				267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					40 s	267	250 °C (482 °F)	23 mm
XA6SLX45-3FGG484Q	Xilinx	FPGA		Ball	484	BGA	Square		Plastic/Epoxy	43661	Yes				AEC-Q100; TS 16949	316				1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1	62.5 MHz	30 s	316	250 °C (482 °F)
XC6SLX45T-3CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square		Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS		190		1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.21 ns	3411 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	862 MHz	30 s	190	260 °C (500 °F)	15 mm
XC6SLX9-3FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square		Plastic/Epoxy	9152	Yes	1.26 V	715	CMOS		186		1.2		1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	715 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	862 MHz	30 s	186	260 °C (500 °F)	17 mm
XC7A75T-2FGG676I	Xilinx	FPGA		Ball	676	BGA	Square		Plastic/Epoxy	75520	Yes	1.05 V	5900	CMOS		300		1		1 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.05 ns	5900 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	1286 MHz	30 s	300	250 °C (482 °F)	27 mm
XC7S100-2FGGA484C	Xilinx	FPGA	Other	Ball	484	BGA	Square		Plastic/Epoxy	102400	Yes	1.05 V	8000	HKMG		400		1			Grid Array	BGA484,22X22,40		.95 V	1 mm	85 °C (185 °F)	1.05 ns	8000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.44 mm	23 mm			e1	1286 MHz		400		23 mm
XCKU035-1FBVA676C	Xilinx	FPGA	Other	Ball	676	BGA	Square		Plastic/Epoxy	444343	Yes	.979 V	1700			520		.95		0.95 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.922 V	1 mm	85 °C (185 °F)		1700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.71 mm	27 mm	No		e1		30 s	520	250 °C (482 °F)	27 mm
10CX105YU484I6G	Intel	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	104000	Yes	.93 V	38000	TSMC		188		.9			Grid Array			.87 V		100 °C (212 °F)		38000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484									188
5CEBA4F23C7N	Intel	FPGA	Other	Ball	484	BGA	Square		Plastic/Epoxy	49000	Yes	1.13 V		CMOS		224		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No					224		23 mm
A3PE3000L-1FG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		341	3000000	1.2	Tray	1.2/1.5,1.2/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0	250 MHz		341		23 mm
EP1C3T144C7N	Intel	FPGA	Other	Gull Wing	144	LFQFP	Square		Plastic/Epoxy	2910	Yes	1.575 V	291			104		1.5		1.5,1.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)		291 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	320 MHz		104		20 mm
EP4CGX150DF31I7N	Intel	FPGA		Ball	896	BGA	Square		Plastic/Epoxy	149760	Yes	1.24 V	9360			475		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.16 V	1 mm			9360 CLBS		Tin Silver Copper	Bottom	S-PBGA-B896	3	2.4 mm	31 mm	No		e1	472.5 MHz		475		31 mm
ICE40LP1K-CM36TR	Lattice Semiconductor	FPGA	Industrial	Ball	36	VFBGA	Square		Plastic/Epoxy	1280	Yes	1.26 V	160	CMOS		25		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B36	3	1 mm	2.5 mm			e1			25	260 °C (500 °F)	2.5 mm
LCMXO640C-3TN144I	Lattice Semiconductor	FPGA	Industrial	Gull Wing	144	LFQFP	Square		Plastic/Epoxy	640	Yes	3.465 V	80			113		1.8		1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	100 °C (212 °F)		80 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3		40 s	113	260 °C (500 °F)	20 mm
LFE2-6E-5TN144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	LFQFP	Square		Plastic/Epoxy	6000	Yes	1.26 V	750			90		1.2		1.2 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.358 ns		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	311 MHz	40 s	90	260 °C (500 °F)	20 mm
LFXP2-8E-6TN144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	LFQFP	Square		Plastic/Epoxy	8000	Yes	1.26 V	1000	CMOS		100		1.2		1.2,1.2/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.399 ns		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	435 MHz	40 s	100	260 °C (500 °F)	20 mm
M2GL060-FGG676	Microchip Technology	FPGA	Other	Ball	676	BGA	Square		Plastic/Epoxy		Yes	1.26 V						1.2	Tray		Grid Array			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B676	3	2.44 mm	27 mm					30 s		250 °C (482 °F)	27 mm
M2GL060T-1FGG676I	Microchip Technology	FPGA	Industrial	Ball	676	BGA	Square		Plastic/Epoxy		Yes	1.26 V						1.2	Tray		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B676	3	2.44 mm	27 mm					30 s		250 °C (482 °F)	27 mm
M2S090TS-1FGG676	Microchip Technology	FPGA		Ball	676	BGA	Square		Plastic/Epoxy	86184	Yes	1.26 V				425		1.2			Grid Array	BGA676,26X26,40		1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm					40 s	425	250 °C (482 °F)	27 mm
XC3S1000-4FTG256I	Xilinx	FPGA		Ball	256	LBGA	Square		Plastic/Epoxy	17280	Yes	1.26 V	1920	CMOS		173	1000000	1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	1920 CLBS, 1000000 Gates		Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	630 MHz	30 s	173	260 °C (500 °F)	17 mm
XC3S400-4FGG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square		Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS		221	400000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	896 CLBS, 400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e1	630 MHz	30 s	221	260 °C (500 °F)	19 mm
XC7S6-1CSGA225Q	Xilinx	FPGA	Automotive	Ball	225	LFBGA	Square		Plastic/Epoxy	6000	Yes	1.05 V	469			100		1			Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32		.95 V	.8 mm	125 °C (257 °F)	1.27 ns	469 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		1.4 mm	13 mm			e1	1098 MHz		100		13 mm
XCVU9P-2FLGC2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square		Plastic/Epoxy	2586150	Yes	.876 V	147780			832		0.85			Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		147780 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2104		4.32 mm	47.5 mm						832		47.5 mm
XQRKU060-1CNA1509Y	Xilinx	FPGA	Military		1509	CGA	Square	120k Rad(Si)	Ceramic, Metal-Sealed Cofired	725550	Yes		41460		MIL-PRF-38535 CLASS Y	620			Box; Tray		Grid Array	CGA1509,39X39,40			1 mm	125 °C (257 °F)		41460 CLBS	-55 °C (-67 °F)		Bottom	S-CBGA-X1509		8.97 mm	40 mm		Tray contains 1 device				620		40 mm
10CL080YF780I7G	Intel	FPGA	Industrial	Ball	780	BGA	Square		Plastic/Epoxy		Yes	1.25 V	5079					1.2			Grid Array			1.15 V	1 mm	100 °C (212 °F)		5079 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		2.4 mm	29 mm								29 mm
10M08DCU324C8G	Intel	FPGA	Other	Ball	324	BGA	Square		Plastic/Epoxy	8000	Yes	1.25 V	500			250		1.2		1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)		500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B324	3	1.55 mm	15 mm	No					250		15 mm
10M08SCM153C8G	Intel	FPGA	Other	Ball	153	BGA	Square		Plastic/Epoxy	8000	Yes	3.15 V	500			250		3			Grid Array	BGA153,15X15,20		2.85 V	.5 mm	85 °C (185 °F)		500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B153	3	1 mm	8 mm		Also Operates at 3.3 V nominal supply				250		8 mm
5CGXFC3B6U15I7N	Intel	FPGA	Industrial	Ball	324	LFBGA	Square		Plastic/Epoxy	31000	Yes	1.13 V	1346	CMOS		112		1.1		1.1,1.2/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.07 V	.8 mm	100 °C (212 °F)		1346 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm	No					112		15 mm
5CGXFC9C6F23I7N	Intel	FPGA		Ball	484	BGA	Square		Plastic/Epoxy		Yes	1.13 V						1.1			Grid Array			1.07 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm			e1		30 s		260 °C (500 °F)	23 mm
A3PE1500-FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	38400	Yes	1.575 V	38400	CMOS		280	1500000	1.5	Tray	1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		38400 CLBS, 1500000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0	350 MHz		280		23 mm
APA300-FG256IX95	Microchip Technology	FPGA	Industrial	Ball	256	LBGA	Square		Plastic/Epoxy		Yes	2.7 V		CMOS			300000	2.5			Grid Array, Low Profile			2.3 V	1 mm	85 °C (185 °F)		300000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.7 mm	17 mm		Also Operates at 3 to 3.6 V supply		180 MHz			230 °C (446 °F)	17 mm
APA600-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square		Plastic/Epoxy	21504	Yes	2.7 V		CMOS		158	600000	2.5	Tray	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	85 °C (185 °F)		600000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	180 MHz	30 s	158	245 °C (473 °F)	28 mm
EP4CE55F23C6N	Intel	FPGA	Other	Ball	484	BGA	Square		Plastic/Epoxy	55856	Yes	1.25 V	3491			327		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		3491 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	472.5 MHz		327		23 mm
EP4CE6E22C8LN	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square		Plastic/Epoxy	6272	Yes	1.03 V	392			91		1		1,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	.97 V	.5 mm	85 °C (185 °F)		392 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e3	362 MHz		91		20 mm
EP4CE6F17A7N	Intel	FPGA	Automotive	Ball	256	LBGA	Square		Plastic/Epoxy	6272	Yes	1.25 V	392			179		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	125 °C (257 °F)		392 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz		179		17 mm
EP4SGX180FF35C3N	Intel	FPGA	Other	Ball	1152	BGA	Square		Plastic/Epoxy	175750	Yes	.93 V	7030			564		.9		0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		7030 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	3.4 mm	35 mm	No		e1	717 MHz		564		35 mm
LCMXO2-1200ZE-2TG100I	Lattice Semiconductor	FPGA		Gull Wing	100	QFP	Square		Plastic/Epoxy	1280	Yes	1.26 V				79		1.2	Tray	1.2 V	Flatpack	QFP100,.63SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	133 MHz	30 s	79	260 °C (500 °F)	14 mm
LCMXO3LF-9400E-6MG256I	Lattice Semiconductor	FPGA		Ball	256	VFBGA	Square		Plastic/Epoxy	9400	Yes	1.26 V	1175			206		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)		1175 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1 mm	9 mm			e1			206	260 °C (500 °F)	9 mm
LFMXO5-25-7BBG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square		Plastic/Epoxy	25000	Yes	1.05 V	3125	FDSOI		160		1			Grid Array, Low Profile, Fine Pitch			.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm						160		14 mm
LFMXO5-25-9BBG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square		Plastic/Epoxy	25000	Yes	1.05 V	3125	FDSOI		160		1			Grid Array, Low Profile, Fine Pitch			.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm						160		14 mm
M2GL090T-1FG484MX399	Microchip Technology	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy		Yes	1.26 V						1.2			Grid Array			1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484		2.44 mm	23 mm			e0					23 mm
M2GL090T-1FG484MX418	Microchip Technology	FPGA	Military	Ball	484	BGA	Square		Plastic/Epoxy		Yes	1.26 V						1.2			Grid Array			1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-PBGA-B484		2.44 mm	23 mm								23 mm
M2S005-TQG144	Microchip Technology	FPGA		Gull Wing	144	LFQFP	Square		Plastic/Epoxy	6060	Yes	1.26 V				84		1.2			Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20		1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	MATTE TIN	Quad	S-PQFP-G144	3	1.6 mm	20 mm					40 s	84	250 °C (482 °F)	20 mm
M2S090T-1FGG676I	Microchip Technology	FPGA		Ball	676	BGA	Square		Plastic/Epoxy	86184	Yes	1.26 V				425		1.2			Grid Array	BGA676,26X26,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm					40 s	425	250 °C (482 °F)	27 mm
XC3S1000-4FGG320I	Xilinx	FPGA		Ball	320	BGA	Square		Plastic/Epoxy	17280	Yes	1.26 V	1920	CMOS		221	1000000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	1920 CLBS, 1000000 Gates		Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e1	630 MHz	30 s	221	260 °C (500 °F)	19 mm
XC3S500E-4FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square		Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS		190	500000	1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	1164 CLBS, 500000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	572 MHz	30 s	149	260 °C (500 °F)	17 mm
XC3S700AN-4FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS		372	700000	1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	1472 CLBS, 700000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	667 MHz	30 s	288	250 °C (482 °F)	23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.