Square Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7VX690T-2FFG1761I	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS		850		1		1,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	54150 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761	4	3.5 mm	42.5 mm	No		e1	1818 MHz	30 s	850	245 °C (473 °F)	42.5 mm
XCKU060-2FFVA1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	2760			624		.95		0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		2760 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm	No		e1		30 s	624	245 °C (473 °F)	40 mm
10CX220YU484E5G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	220000	Yes	.93 V	80330	TSMC		188		.9			Grid Array			.87 V		100 °C (212 °F)		80330 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484									188
10M02DCU324A7G	Intel	FPGA	Automotive	Ball	324	BGA	Square	Plastic/Epoxy	2000	Yes	1.25 V	125			246		1.2		1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays	1.15 V	.8 mm	125 °C (257 °F)		125 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324	3	1.55 mm	15 mm	No					246		15 mm
5AGXFB7H4F35I3G	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	504000	Yes	1.18 V	19024	TSMC		704		1.15			Grid Array, Heat Sink/Slug	BGA1152,34X34,40		1.12 V	1 mm	100 °C (212 °F)		19024 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm						704		35 mm
5CGXFC5C6F23C6N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	76500	Yes	1.13 V		CMOS		240		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			240		23 mm
5CGXFC7C6U19I7N	Intel	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	149500	Yes	1.13 V		CMOS		240		1.1		1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm					Tin Silver Copper	Bottom	S-PBGA-B484		1.9 mm	19 mm	No		e1			240		19 mm
A3P060-TQG144I	Microchip Technology	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.575 V	1536	CMOS			60000	1.5			Flatpack, Low Profile, Fine Pitch			1.425 V	.5 mm	100 °C (212 °F)		1536 CLBS, 60000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	350 MHz				20 mm
AGL250V2-FGG144	Microchip Technology	FPGA	Other	Ball	144	LBGA	Square	Plastic/Epoxy	6144	Yes	1.575 V		CMOS		97	250000	1.2			Grid Array, Low Profile	BGA144,12X12,40		1.14 V	1 mm	85 °C (185 °F)		250000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1		30 s	97	260 °C (500 °F)	13 mm
APA1000-PQG208M	Microchip Technology	FPGA	Military	Gull Wing	208	FQFP	Square	Plastic/Epoxy	56320	Yes	2.7 V		CMOS		158	1000000	2.5	Tray	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	125 °C (257 °F)		1000000 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	180 MHz	30 s	158	245 °C (473 °F)	28 mm
EP3C25F256A7N	Intel	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	24624	Yes	2.625 V	24624	CMOS		156		2.5		1.2/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	125 °C (257 °F)		24624 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		3.5 mm	17 mm	No					156		17 mm
LCMXO1200C-5TN100C	Lattice Semiconductor	FPGA	Other	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	1200	Yes	3.465 V	150			73		1.8		1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)		150 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3		40 s	73	260 °C (500 °F)	14 mm
LCMXO2-1200HC-6SG32C	Lattice Semiconductor	FPGA	Other	No Lead	32	HVQCCN	Square		1280	Yes	3.6 V	160			21		2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20		2.375 V	.5 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)		Quad	S-XQCC-N32	1	1 mm	5 mm		Also Operates at 3.3 V nominal supply				21	260 °C (500 °F)	5 mm
M2S150TS-1FCV484I	Microchip Technology	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2	Tray		Grid Array, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B484		3.15 mm	19 mm		LG-MIN, WD-MIN	e0		30 s		240 °C (464 °F)	19 mm
MPF200T-FCG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	192000	Yes	1.03 V		CMOS		244		1			Grid Array	BGA484,22X22,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm		It also Operates at 1.05 V nominal supply				244		23 mm
XC6SLX4-3TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	3840	Yes	1.26 V	300	CMOS		100		1.2		1.2,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.21 ns	300 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	862 MHz	30 s	100	260 °C (500 °F)	20 mm
XC7S50-1FGGA484Q	Xilinx	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075			250		1			Grid Array	BGA484,22X22,40		.95 V	1 mm	125 °C (257 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.44 mm	23 mm			e1	1098 MHz		250		23 mm
XCKU15P-2FFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340			668		0.85			Grid Array	BGA1156,34X34,40		.825 V	1 mm	100 °C (212 °F)		65340 CLBs	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.71 mm	35 mm			e1		30 s	668	245 °C (473 °F)	35 mm
10CX105YF672E6G	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	104000	Yes	.93 V	38000	TSMC		236		.9			Grid Array			.87 V		100 °C (212 °F)		38000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B672									236
10M04DCF256C8G	Intel	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	4000	Yes	1.25 V	250			246		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		250 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			246		17 mm
5CEBA5F23C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	77000	Yes	1.13 V	2908			240		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		2908 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No					240		23 mm
5CGXFC5C6F27I7N	Intel	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	76500	Yes	1.13 V		CMOS		368		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm					Tin/Silver/Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No		e1		30 s	368	260 °C (500 °F)	27 mm
5SGXMA7H3F35C3	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	622000	Yes	.88 V	23472	CMOS		552		.85		0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)		23472 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No					552		35 mm
EP2C50F672C8N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	50528	Yes	1.25 V	3158	CMOS		450		1.2		1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		3158 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No	Also requires 3.3 V supply	e1	402.5 MHz		434		27 mm
LIFCL-40-7MG289I	Lattice Semiconductor	FPGA	Industrial	Ball	289	TFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI		74		1			Grid Array, Thin Profile, Fine Pitch	BGA289,17X17,20		.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B289		1.2 mm	9.5 mm						74		9.5 mm
M2GL090T-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	86316	Yes	1.26 V		CMOS		267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No				30 s	267	250 °C (482 °F)	23 mm
XA7A35T-1CSG324I	Xilinx	FPGA		Ball	324	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600	HKMG		210		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.27 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1098 MHz	30 s	210	260 °C (500 °F)	15 mm
XC7A75T-1FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900			300		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns	5900 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	1098 MHz	30 s	300	260 °C (500 °F)	17 mm
XC7K160T-2FBG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	162240	Yes	1.03 V	12675	CMOS		285		1		1,1.8,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	12675 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No		e1	1286 MHz	30 s	285	250 °C (482 °F)	23 mm
XQ4013E-3HQ240N	Xilinx	FPGA	Military	Gull Wing	240	FQFP	Square	Plastic/Epoxy	1368	Yes	5.5 V	576	CMOS	MIL-PRF-38535	192	10000	5		5 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm	125 °C (257 °F)	2.01 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Maximum usable gates = 30000	e0	125 MHz	30 s	192	225 °C (437 °F)	32 mm
10M40DCF672C8G	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	40000	Yes	1.25 V	2500			500		1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		2500 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No		e1			500		27 mm
5AGXMA7G4F35I5N	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	242000	Yes	1.13 V	9168			544		1.1		1.1,1.2/3.3,2.5 V	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	100 °C (212 °F)		9168 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	2.7 mm	35 mm	No		e1			544		35 mm
LCMXO2-1200ZE-1MG132C	Lattice Semiconductor	FPGA	Other	Ball	132	BGA	Square	Plastic/Epoxy	1280	Yes	1.26 V				104		1.2	Tray	1.2 V	Grid Array	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1	133 MHz	30 s	104	250 °C (482 °F)	8 mm
M2GL050T-1FG896I	Microchip Technology	FPGA	Industrial	Ball	896	BGA	Square	Plastic/Epoxy	56340	Yes	1.26 V				377		1.2	Tray	1.2 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B896	3	2.44 mm	31 mm	No					377		31 mm
XC3S500E-4VQG100I	Xilinx	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS		66	500000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	1164 CLBS, 500000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	572 MHz	30 s	59	260 °C (500 °F)	14 mm
XC6SLX100-3FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		480		1.2		1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	7911 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	862 MHz	30 s	480	250 °C (482 °F)	27 mm
XC7A35T-L2CPG236E	Xilinx	FPGA	Other	Ball	236	LFBGA	Square	Plastic/Epoxy	33280	Yes	.93 V	2600			250		0.9		0.9 V	Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20	Field Programmable Gate Arrays	.87 V	.5 mm	100 °C (212 °F)	1.51 ns	2600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm	No	Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	250	260 °C (500 °F)	10 mm
XC7K70T-1FBG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	65600	Yes	1.03 V	5125	CMOS		300		1		1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm		0.74 ns	5125 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	No		e1	1098 MHz	30 s	300	250 °C (482 °F)	27 mm
XC7S100-L1FGGA484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	102400	Yes	.98 V	8000	HKMG		400		0.95			Grid Array	BGA484,22X22,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	8000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.44 mm	23 mm			e1	1098 MHz		400		23 mm
10CL006ZU256I8G	Intel	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	6272	Yes	1.03 V	392			176		1			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		.97 V	.8 mm	100 °C (212 °F)		392 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm		-40 to 125 °C range is available as extended industrial				176		14 mm
10CL080ZU484I8G	Intel	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	81264	Yes	1.03 V	5079			423		1			Grid Array, Fine Pitch	BGA484,22X22,32		.97 V	.8 mm	100 °C (212 °F)		5079 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm		-40 to 125 °C range is available as extended industrial				423		19 mm
10CL120YF780C8G	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.25 V	7443					1.2			Grid Array			1.15 V	1 mm	85 °C (185 °F)		7443 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		2.4 mm	29 mm								29 mm
10M04SCM153I7G	Intel	FPGA	Industrial	Ball	153	BGA	Square	Plastic/Epoxy	4000	Yes	3.15 V	250			246		3		3/3.3 V	Grid Array	BGA153,15X15,20	Field Programmable Gate Arrays	2.85 V	.5 mm	100 °C (212 °F)		250 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B153	3	1 mm	8 mm	No	Also Operates at 3.3 V nominal supply				246		8 mm
A3P060-VQ100	Microchip Technology	FPGA	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.575 V	1536	CMOS			60000	1.5	Tray		Flatpack, Thin Profile, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		1536 CLBS, 60000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	350 MHz	20 s		235 °C (455 °F)	14 mm
A3P125-TQG144	Microchip Technology	FPGA	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.575 V	3072	CMOS			125000	1.5	Tray		Flatpack, Low Profile, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		3072 CLBS, 125000 Gates	0 °C (32 °F)	Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	350 MHz				20 mm
A42MX09-PLG84	Microchip Technology	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	684	CMOS			14000	3.3	Tube		Chip Carrier			3 V	1.27 mm	70 °C (158 °F)	2.5 ns	684 CLBS, 14000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	4.572 mm	29.3116 mm	No	Also Operates at 5 V supply	e3	117 MHz				29.3116 mm
A42MX09-PLG84A	Microchip Technology	FPGA	Automotive	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	684	CMOS			14000	5	Tube		Chip Carrier			4.75 V	1.27 mm	125 °C (257 °F)	2 ns	684 CLBS, 14000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J84	3	4.572 mm	29.3116 mm	No	Can also be operated at 5.0 V supply	e3	174 MHz				29.3116 mm
EP3C5M164C8N	Intel	FPGA	Other	Ball	164	BGA	Square	Plastic/Epoxy	5136	Yes	2.625 V	5136	CMOS		106		2.5		1.2/3.3 V	Grid Array	BGA164,15X15,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)		5136 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B164				No					106

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.