Square Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCVU13P-2FHGB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000			832		0.85			Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		216000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2104		4.32 mm	52.5 mm						832		52.5 mm
10CL010YM164C6G	Intel	FPGA	Other	Ball	164	TFBGA	Square	Plastic/Epoxy		Yes	1.25 V	645					1.2			Grid Array, Thin Profile, Fine Pitch			1.15 V	.5 mm	85 °C (185 °F)		645 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B164		1.2 mm	8 mm								8 mm
10CL040YU484C8G	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.25 V	2475					1.2			Grid Array, Fine Pitch			1.15 V	.8 mm	85 °C (185 °F)		2475 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm								19 mm
10CL055YU484C8G	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.25 V	3491					1.2			Grid Array, Fine Pitch			1.15 V	.8 mm	85 °C (185 °F)		3491 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm								19 mm
10CL080ZF484I8G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	81264	Yes	1.03 V	5079			423		1			Grid Array	BGA484,22X22,40		.97 V	1 mm	100 °C (212 °F)		5079 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm		-40 to 125 °C range is available as extended industrial				423		23 mm
10M04SAM153I7G	Intel	FPGA	Industrial	Ball	153	BGA	Square	Plastic/Epoxy	4000	Yes	3.15 V	250			246		3			Grid Array	BGA153,15X15,20		2.85 V	.5 mm	100 °C (212 °F)		250 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B153	3	1 mm	8 mm		Also Operates at 3.3 V nominal supply				246		8 mm
10M25DCF256I7G	Intel	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	25000	Yes	1.25 V	1563			360		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		1563 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			360		17 mm
10M25SCE144I7G	Intel	FPGA	Industrial	Gull Wing	144	QFP	Square	Plastic/Epoxy	25000	Yes	3.15 V	1563			360		3		3/3.3 V	Flatpack	HQFP144,.87SQ,20	Field Programmable Gate Arrays	2.85 V	.5 mm	100 °C (212 °F)		1563 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144	3	1.65 mm	20 mm	No	Also Operates at 3.3 V nominal supply				360		20 mm
10M40DAF256C8G	Intel	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	40000	Yes	1.25 V	2500			500		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		2500 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			500		17 mm
10M40SCE144C8G	Intel	FPGA	Other	Gull Wing	144	QFP	Square	Plastic/Epoxy	40000	Yes	3.15 V	2500			500		3		3/3.3 V	Flatpack	HQFP144,.87SQ,20	Field Programmable Gate Arrays	2.85 V	.5 mm	85 °C (185 °F)		2500 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144	3	1.65 mm	20 mm	No	Also Operates at 3.3 V nominal supply				500		20 mm
1SG250HU2F50E1VG	Intel	FPGA		Ball	2397	BGA	Square	Plastic/Epoxy	2422000	Yes		302750			736					Grid Array	BGA2397,49X49,40			1 mm	100 °C (212 °F)		302750 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2397		3.881 mm	50 mm						736		50 mm
1SG250HU2F50I1VG	Intel	FPGA		Ball	2397	BGA	Square	Plastic/Epoxy	2422000	Yes		302750			736					Grid Array	BGA2397,49X49,40			1 mm	100 °C (212 °F)		302750 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2397		3.881 mm	50 mm						736		50 mm
5CEBA2F17A7N	Intel	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy	25000	Yes	1.13 V		CMOS		128		1.1		1.1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm	No					128		17 mm
5CEFA5F23C6N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	76500	Yes	1.13 V		CMOS		240		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No					240		23 mm
5CGXFC5C6U19I7N	Intel	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1			Grid Array, Fine Pitch			1.07 V	.8 mm						Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
A3P060-1TQG144I	Microchip Technology	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.575 V	1536	CMOS			60000	1.5	Tray		Flatpack, Low Profile, Fine Pitch			1.425 V	.5 mm	100 °C (212 °F)		1536 CLBS, 60000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	350 MHz				20 mm
A3P125-VQG100	Microchip Technology	FPGA	Commercial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.575 V	3072	CMOS			125000	1.5	Tray		Flatpack, Thin Profile, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		3072 CLBS, 125000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	350 MHz				14 mm
A3P250-FGG256T	Microchip Technology	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	6144	Yes	1.575 V	6144	CMOS	AEC-Q100	157	250000	1.5	Tray	1.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e1	350 MHz	30 s	157	250 °C (482 °F)	17 mm
A3PE1500-2PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	38400	Yes	1.575 V	38400	CMOS		147	1500000	1.5	Tray	1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)		38400 CLBS, 1500000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s	147	245 °C (473 °F)	28 mm
A42MX16-VQG100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	1232	Yes	3.6 V	1232	CMOS			24000	3.3	Tray		Flatpack, Thin Profile, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	2.8 ns	1232 CLBS, 24000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Also Operates at 5 V supply	e3	94 MHz	30 s		260 °C (500 °F)	14 mm
APA150-TQG100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	6144	Yes	2.7 V		CMOS		66	150000	2.5	Tray	2.5,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	85 °C (185 °F)		150000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	180 MHz	30 s	66	260 °C (500 °F)	14 mm
EP1C6Q240I7N	Intel	FPGA	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	5980	Yes	1.575 V	598			185		1.5		1.5,1.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	100 °C (212 °F)		598 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3	320 MHz		185		32 mm
EP2SGX60EF1152C5N	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	60440	CMOS		534		1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5.962 ns	60440 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	3.5 mm	35 mm	No		e1	640 MHz		534		35 mm
EP4CE10F17I8LN	Intel	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	10320	Yes	1.03 V	645			179		1		1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	.97 V	1 mm			645 CLBS		Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	362 MHz		179		17 mm
EP4CE10U14I7N	Intel	FPGA	Automotive	Ball	256	BGA	Square	Plastic	10320	Yes	1.25 V	645			179		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	125 °C (257 °F)		645 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256				No		e1	472.5 MHz		179
EP4CE22F17I8L	Intel	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	22320	Yes	1.03 V	1395			153		1		1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	.97 V	1 mm			1395 CLBS		Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	362 MHz		153		17 mm
EP4SGX230FF35I3N	Intel	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	228000	Yes	.93 V	9120			564		.9		0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		9120 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		3.6 mm	35 mm	No		e1	717 MHz		564		35 mm
ICE40LP384-CM49TR	Lattice Semiconductor	FPGA	Industrial	Ball	49	VFBGA	Square	Plastic/Epoxy	384	Yes	1.26 V	48	CMOS		37		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	48 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B49	3	1 mm	3 mm			e1		30 s	37	260 °C (500 °F)	3 mm
LCMXO2-1200HC-5MG132I	Lattice Semiconductor	FPGA		Ball	132	BGA	Square	Plastic/Epoxy	1280	Yes	3.465 V				104		2.5	Tray	2.5/3.3 V	Grid Array	BGA132,14X14,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No	Also Operates at 3.3 V nominal supply	e1	133 MHz	30 s	104	250 °C (482 °F)	8 mm
LCMXO2-4000HE-6MG132C	Lattice Semiconductor	FPGA	Other	Ball	132	LFBGA	Square	Plastic/Epoxy	4320	Yes	1.26 V				104		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1		30 s	104	250 °C (482 °F)	8 mm
LCMXO2-7000HC-4FG484IAK7	Lattice Semiconductor	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	6864	Yes	3.6 V				334		2.5	Tray		Grid Array	BGA484,22X22,40		2.375 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm		Also Operates at 3.3 V nominal supply	e1		30 s	334	250 °C (482 °F)	23 mm
LCMXO2280C-5TN144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2280	Yes	3.465 V	285			113		1.8		1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)		285 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3		30 s	113	260 °C (500 °F)	20 mm
LCMXO2280E-4FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	2280	Yes	1.26 V	285			211		1.2		1.2 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		285 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No		e1		40 s	211	260 °C (500 °F)	17 mm
LCMXO3L-1300C-5BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	1300	Yes	3.465 V	160			206		2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LFE3-17EA-6FTN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	17000	Yes	1.26 V				133		1.2		1.2 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.379 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	375 MHz	30 s	133	260 °C (500 °F)	17 mm
LFE3-35EA-8FN484I	Lattice Semiconductor	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	33000	Yes	1.26 V				295		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.281 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	500 MHz		295	250 °C (482 °F)	23 mm
LFXP2-8E-5MN132C	Lattice Semiconductor	FPGA	Other	Ball	132	LFBGA	Square	Plastic/Epoxy	8000	Yes	1.26 V	1000	CMOS		86		1.2		1.2,1.2/3.3,3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.494 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1	435 MHz	40 s	86	260 °C (500 °F)	8 mm
M1A3P600-2FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.575 V	13824	CMOS			600000	1.5	Tray		Grid Array			1.425 V	1 mm	100 °C (212 °F)		13824 CLBS, 600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1		30 s		250 °C (482 °F)	23 mm
M2GL010T-1FG484MX417	Microchip Technology	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V				233		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm			e0		20 s	233	240 °C (464 °F)	23 mm
M2GL025TS-1FCSG325I	Microchip Technology	FPGA	Industrial	Ball	325	BGA	Square	Plastic/Epoxy	27696	Yes	1.26 V		CMOS		180		1.2	Tray	1.2 V	Grid Array	BGA325,21X21,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B325	3		11 mm	No					180		11 mm
M2S025TS-1FGG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	27696	Yes	1.26 V				267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					40 s	267	250 °C (482 °F)	23 mm
M2S090-1FGG484	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	86184	Yes	1.26 V				267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					40 s	267	250 °C (482 °F)	23 mm
M2S090TS-1FGG484T2	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	86184	Yes	1.26 V			AEC-Q100	267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.44 mm	23 mm					40 s	267	250 °C (482 °F)	23 mm
MPF100TL-FCSG325I	Microchip Technology	FPGA		Ball	325	LFBGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS		170		1			Grid Array, Low Profile, Fine Pitch	BGA325,21X21,20		.97 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B325		1.45 mm	11 mm		It also Operates at 1.05 V nominal supply				170		11 mm
RT3PE3000L-1CG896PROTO	Microchip Technology	FPGA		Pin/Peg	896	PGA	Square	Ceramic, Metal-Sealed Cofired		No	1.575 V	75264	CMOS			3000000	1.2			Grid Array			1.14 V	1 mm			75264 CLBS, 3000000 Gates			Perpendicular	S-CPGA-P896		6.75 mm	31 mm								31 mm
RT3PE3000L-1CQ256B	Microchip Technology	FPGA	Military	Flat	256	GQFF	Square	Ceramic, Metal-Sealed Cofired	75264	Yes	1.575 V	75264	CMOS	MIL-STD-883 Class B		3000000	1.2		1.2/1.5,1.2/3.3 V	Flatpack, Guard Ring	TPAK256,3SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F256		3.3 mm	36 mm	No			250 MHz				36 mm
RT3PE3000L-1LG484E	Microchip Technology	FPGA	Military	No Lead	484	LGA	Square		75264	Yes	1.575 V	75264	CMOS	38535V;38534K;883S	341	3000000	1.2		1.2/1.5,1.2/3.3 V	Grid Array	LGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)		Bottom	S-XBGA-N484		3.83 mm	23 mm	No			250 MHz		341		23 mm
RT3PE3000L-CQ256B	Microchip Technology	FPGA	Military	Flat	256	GQFF	Square	Ceramic, Metal-Sealed Cofired	75264	Yes	1.575 V	75264	CMOS	MIL-STD-883 Class B		3000000	1.2		1.2/1.5,1.2/3.3 V	Flatpack, Guard Ring	TPAK256,3SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F256		3.3 mm	36 mm	No		e0	250 MHz	20 s		225 °C (437 °F)	36 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.