Square Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
RT3PE3000L-LG484B	Microchip Technology	FPGA	Military	No Lead	484	LGA	Square			75264	Yes	1.575 V	75264	CMOS	MIL-STD-883 Class B	341	3000000	1.2		1.2/1.5,1.2/3.3 V	Grid Array	LGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)		Bottom	S-XBGA-N484		3.83 mm	23 mm	No			250 MHz		341		23 mm
RT4G150-CQ352B	Microchip Technology	FPGA		Flat	352	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	151824	Yes	1.26 V			MIL-STD-883 Class B	166		1.2			Flatpack, Guard Ring	TPAK352,2.9SQ,20		1.14 V	.5 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-CQFP-F352			48 mm						166		48 mm
RT4G150-CQ352E	Microchip Technology	FPGA		Flat	352	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	151824	Yes	1.26 V				166		1.2			Flatpack, Guard Ring	TPAK352,2.9SQ,20		1.14 V	.5 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-CQFP-F352			48 mm						166		48 mm
RT4G150-CQ352V	Microchip Technology	FPGA		Flat	352	GQFF	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	151824	Yes	1.26 V			MIL-PRF-38535 Class V	166		1.2			Flatpack, Guard Ring	TPAK352,2.9SQ,20		1.14 V	.5 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-CQFP-F352			48 mm						166		48 mm
T20Q144I4	Efinix	FPGA		Gull Wing	144	LFQFP	Square		Plastic/Epoxy	19728	Yes	1.25 V		SMIC		97		1.2			Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20		1.15 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Quad	S-PQFP-G144		1.6 mm	20 mm						97		20 mm
XC2VP7-6FFG672I	Xilinx	FPGA		Ball	672	BGA	Square		Plastic/Epoxy	11088	Yes	1.575 V	1232	CMOS		396		1.5		1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	1232 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No		e1	1200 MHz	30 s	396	250 °C (482 °F)	27 mm
XC3S250E-4PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square		Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS		158	250000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.76 ns	612 CLBS, 250000 Gates	0 °C (32 °F)	Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	572 MHz	30 s	126	245 °C (473 °F)	28 mm
XC3S50AN-5FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square		Plastic/Epoxy	1584	Yes	1.26 V	176	CMOS		144	50000	1.2		1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	176 CLBS, 50000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No			770 MHz		112		17 mm
XC7S75-2FGGA676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square		Plastic/Epoxy	76800	Yes	1.05 V	6000	HKMG		400		1			Grid Array	BGA676,26X26,40		.95 V	1 mm	100 °C (212 °F)	1.05 ns	6000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676		2.44 mm	27 mm			e1	1286 MHz		400		27 mm
10M25DCF484I6G	Intel	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	25000	Yes	1.25 V	1563			360		1.2			Grid Array	BGA484,22X22,40		1.15 V	1 mm	100 °C (212 °F)		1563 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484		2 mm	23 mm			e1			360		23 mm
5CEBA7U19C7N	Intel	FPGA	Other	Ball	484	FBGA	Square		Plastic/Epoxy	150000	Yes	1.13 V		CMOS		240		1.1		1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	1.9 mm	19 mm	No		e1		30 s	240	260 °C (500 °F)	19 mm
5SGXMA3H2F35C3N	Intel	FPGA	Other	Ball	1152	BGA	Square		Plastic/Epoxy	340000	Yes	.88 V	12830	CMOS		432		.85		0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)		12830 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No					432		35 mm
5SGXMA3H2F35I3N	Intel	FPGA	Industrial	Ball	1152	BGA	Square		Plastic/Epoxy	340000	Yes	.88 V	12830	CMOS		432		.85		0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)		12830 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1152	4	3.6 mm	35 mm	No		e1		30 s	432	245 °C (473 °F)	35 mm
A3P250-2PQG208	Microchip Technology	FPGA	Commercial	Gull Wing	208	FQFP	Square		Plastic/Epoxy		Yes	1.575 V	6144	CMOS			250000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		6144 CLBS, 250000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s		245 °C (473 °F)	28 mm
A3PE3000-FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		341	3000000	1.5	Tray	1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0	350 MHz	20 s	341	225 °C (437 °F)	23 mm
A54SX16PPQ208I	Microsemi	FPGA	Industrial	Gull Wing	208	FQFP	Square		Plastic/Epoxy		Yes	3.6 V	1452	CMOS			16000	3.3			Flatpack, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	0.9 ns	1452 CLBS, 16000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Can also be operated at 5 V; 24000 system gates also available	e0	240 MHz	20 s		225 °C (437 °F)	28 mm
A54SX16-PPQ208I	Actel	FPGA	Industrial	Gull Wing	208	FQFP	Square		Plastic/Epoxy	1452	Yes	3.6 V	1452	CMOS		175	16000	3.3		3.3,3.3/5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	0.9 ns	1452 CLBS, 16000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Can also be operated at 5 V; 24000 system gates also available	e0	240 MHz		175		28 mm
EP2SGX60EF1152C4N	Intel	FPGA	Other	Ball	1152	BGA	Square		Plastic/Epoxy	60440	Yes	1.25 V	60440	CMOS		534		1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5.117 ns	60440 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	3.5 mm	35 mm	No		e1	717 MHz		534		35 mm
EP3C25F256I7	Intel	FPGA	Industrial	Ball	256	LBGA	Square		Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS		156		1.2			Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		24624 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz		156		17 mm
EP4CE22E22C8L	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square		Plastic/Epoxy	22320	Yes	1.03 V	1395			79		1		1,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	.97 V	.5 mm	85 °C (185 °F)		1395 CLBS	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e0	362 MHz		79		20 mm
EP4CE40U19I7N	Intel	FPGA		Ball	484	FBGA	Square		Plastic/Epoxy	39600	Yes		2475			328		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm			2475 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.05 mm	19 mm	No		e1		30 s	328	260 °C (500 °F)	19 mm
EP4SGX230FF35I3G	Intel	FPGA	Industrial	Ball	1152	BGA	Square		Plastic/Epoxy	228000	Yes	.93 V	9120			564		.9			Grid Array	BGA1152,34X34,40		.87 V	1 mm	100 °C (212 °F)		9120 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm						564		35 mm
ICE40LP384-CM49TR1K	Lattice Semiconductor	FPGA	Industrial	Ball	49	VFBGA	Square		Plastic/Epoxy		Yes	1.26 V	48	CMOS				1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		48 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B49		1 mm	3 mm								3 mm
LCMXO2-2000ZE-1TG100I	Lattice Semiconductor	FPGA		Gull Wing	100	LFQFP	Square		Plastic/Epoxy	2112	Yes	1.26 V				79		1.2	Tray	1.2 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3		30 s	79	260 °C (500 °F)	14 mm
LCMXO2-4000HC-5FTG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LBGA	Square		Plastic/Epoxy	4320	Yes	3.465 V				206		2.5	Tray	2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	17 mm
LCMXO3L-1300E-5MG256C	Lattice Semiconductor	FPGA	Other	Ball	256	VFBGA	Square		Plastic/Epoxy		Yes	1.26 V	160					1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1 mm	9 mm			e1				260 °C (500 °F)	9 mm
LCMXO3L-1300E-6MG256I	Lattice Semiconductor	FPGA		Ball	256	VFBGA	Square		Plastic/Epoxy	1300	Yes	1.26 V	160			206		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1 mm	9 mm			e1			206	260 °C (500 °F)	9 mm
LCMXO3LF-1300C-6BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square		Plastic/Epoxy	1300	Yes	3.465 V	160			206		2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LFE2-12E-7FN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square		Plastic/Epoxy	12000	Yes	1.26 V	1500			193		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.304 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	420 MHz	40 s	193	250 °C (482 °F)	17 mm
LFE2M50E-6FN484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square		Plastic/Epoxy	50000	Yes	1.26 V	6000			270		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.331 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	357 MHz		270	250 °C (482 °F)	23 mm
M2GL025T-1VF256I	Microchip Technology	FPGA		Ball	256	LFBGA	Square		Plastic/Epoxy	27696	Yes	1.26 V				138		1.2	Tray		Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256		1.56 mm	14 mm			e0			138		14 mm
M2GL050T-1FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	56340	Yes	1.26 V				267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No				30 s	267	250 °C (482 °F)	23 mm
MPF300T-FCG484E	Microchip Technology	FPGA		Ball	484	BGA	Square		Plastic/Epoxy	300000	Yes	1.03 V		CMOS		244		1			Grid Array	BGA484,22X22,40		.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm		It also Operates at 1.05 V nominal supply				244		23 mm
XA7A50T-1CSG325Q	Xilinx	FPGA	Automotive	Ball	325	LFBGA	Square		Plastic/Epoxy	52160	Yes	1.05 V	4075	HKMG	AEC-Q100	150		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	125 °C (257 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm	No		e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XC2S200-5FG456I	Xilinx	FPGA		Ball	456	BGA	Square		Plastic/Epoxy	5292	Yes	2.625 V	1176			288	200000	2.5		1.5/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	100 °C (212 °F)	0.7 ns	1176 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	263 MHz	30 s	284	225 °C (437 °F)	23 mm
XC2S200-6PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square		Plastic/Epoxy	5292	Yes	2.625 V	1176			284	200000	2.5		1.5/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)	0.6 ns	1176 CLBS, 200000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates 200000	e3	263 MHz	30 s	284	245 °C (473 °F)	28 mm
XC3S200-4VQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square		Plastic/Epoxy	4320	Yes	1.26 V	480	CMOS		63	200000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.61 ns	480 CLBS, 200000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	630 MHz	30 s	63	260 °C (500 °F)	14 mm
XC3S250E-4TQG144CS1	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square		Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS		108	250000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.76 ns	612 CLBS, 250000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	572 MHz	30 s	80	260 °C (500 °F)	20 mm
XC3S50-5TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square		Plastic/Epoxy	1728	Yes	1.26 V	192	CMOS		97	50000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.53 ns	192 CLBS, 50000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	725 MHz	30 s	97	260 °C (500 °F)	20 mm
XC4VFX12-10FFG668I	Xilinx	FPGA		Ball	668	BGA	Square		Plastic/Epoxy	12312	Yes	1.26 V	1368	CMOS		320		1.2			Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm			1368 CLBS		Tin Silver Copper	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No		e1	1028 MHz	30 s	320	250 °C (482 °F)	27 mm
XC6SLX25-3FT256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square		Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS		186		1.2		1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	1879 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	862 MHz	30 s	186	225 °C (437 °F)	17 mm
XC7K410T-2FF676I	Xilinx	FPGA		Ball	676	BGA	Square		Plastic/Epoxy	406720	Yes			CMOS		400				1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B676				No		e0	1818 MHz		400
XCAU10P-L1FFVB676I	Xilinx	FPGA		Ball	676	BGA	Square		Plastic/Epoxy	96250	Yes	.742 V	5500			228		0.72			Grid Array	BGA676,26X26,40		.698 V	1 mm	100 °C (212 °F)		5500 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm		Also Operates at 0.85 V nominal supply	e1		30 s	228	250 °C (482 °F)	27 mm
10CL010ZM164I8G	Intel	FPGA	Industrial	Ball	164	TFBGA	Square		Plastic/Epoxy	10320	Yes	1.03 V	645			176		1			Grid Array, Thin Profile, Fine Pitch	BGA164,15X15,20		.97 V	.5 mm	100 °C (212 °F)		645 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B164		1.2 mm	8 mm		-40 to 125 °C range is available as extended industrial				176		8 mm
1SG280HN1F43I1VG	Intel	FPGA		Ball	1760	BGA	Square		Plastic/Epoxy	2753000	Yes		344125			704					Grid Array	BGA1760,42X42,40			1 mm	100 °C (212 °F)		344125 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		3.881 mm	42.5 mm						704		42.5 mm
5CGXFC4C7F23C8N	Intel	FPGA	Other	Ball	484	BGA	Square		Plastic/Epoxy	50000	Yes	1.13 V	1886	CMOS		240		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		1886 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			240		23 mm
A3P060-VQ100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	TFQFP	Square		Plastic/Epoxy		Yes	1.575 V	1536	CMOS			60000	1.5	Tray		Flatpack, Thin Profile, Fine Pitch			1.425 V	.5 mm	100 °C (212 °F)		1536 CLBS, 60000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	350 MHz	20 s		235 °C (455 °F)	14 mm
EP1C12F256C7	Intel	FPGA	Other	Ball	256	BGA	Square		Plastic/Epoxy	12060	Yes	1.575 V	1206			185		1.5		1.5,1.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		1206 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No		e0	320 MHz	20 s	185	220 °C (428 °F)	17 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.