FPGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
M2GL025T-1FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	27696	Yes	1.26 V			267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No					267		23 mm
M2GL060-FG676I	Microchip Technology	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2	Tray		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm			e0		20 s		225 °C (437 °F)	27 mm
M2S005-VFG400	Microchip Technology	FPGA		Ball	400	LFBGA	Square	Plastic/Epoxy	6060	Yes	1.26 V			171		1.2			Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.51 mm	17 mm					40 s	171	250 °C (482 °F)	17 mm
XC3S1200E-4FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS	190	1200000	1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	2168 CLBS, 1200000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	572 MHz	30 s	150	260 °C (500 °F)	17 mm
XC7S6-1CPGA196Q	Xilinx	FPGA	Automotive	Ball	196	TFBGA	Square	Plastic/Epoxy	6000	Yes	1.05 V	469		100		1			Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		.95 V	.5 mm	125 °C (257 °F)	1.27 ns	469 CLBS	-40 °C (-40 °F)	Matte Tin	Bottom	S-PBGA-B196		1.1 mm	8 mm			e3	1098 MHz		100		8 mm
XCAU20P-2FFVB676E	Xilinx	FPGA
10M04DCF256I7G	Intel	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	4000	Yes	1.25 V	250		246		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		250 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1		30 s	246	260 °C (500 °F)	17 mm
10M04DCU324C8G	Intel	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	4000	Yes	1.25 V	250		246		1.2		1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)		250 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B324	3	1.55 mm	15 mm	No					246		15 mm
5CEBA7F23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	150000	Yes	1.13 V		CMOS	240		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No					240		23 mm
A3P250-VQ100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS		250000	1.5	Tray		Flatpack, Thin Profile, Fine Pitch			1.425 V	.5 mm	100 °C (212 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	350 MHz	20 s		235 °C (455 °F)	14 mm
AGLN060V2-VQG100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.575 V	1536	CMOS		60000	1.2			Flatpack, Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		1536 CLBS, 60000 Gates	-40 °C (-40 °F)	Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3					14 mm
EP1C3T144I7	Intel	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2910	Yes	1.575 V	291		104		1.5		1.5,1.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	100 °C (212 °F)		291 CLBS	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	320 MHz		104		20 mm
EP3C120F484C8N	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	119088	Yes	1.25 V	119088	CMOS	283		1.2			Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		119088 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e1	472.5 MHz		283		23 mm
EP4CE15M8I7N	Intel	FPGA		Ball	164	TFBGA	Square	Plastic/Epoxy	15408	Yes		15408		89		1		1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA164,15X15,20	Field Programmable Gate Arrays		.5 mm			15408 CLBS		Tin Silver Copper	Bottom	S-PBGA-B164	3	1.2 mm	8 mm	No		e1			89		8 mm
EP4CE22E22I8LN	Intel	FPGA		Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	22320	Yes	1.03 V	1395		79		1		1,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	.97 V	.5 mm			1395 CLBS		Matte Tin	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e3	362 MHz		79		20 mm
LCMXO2-1200HC-5SG32C	Lattice Semiconductor	FPGA	Other	No Lead	32	HVQCCN	Square		1280	Yes	3.6 V	160		21		2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20		2.375 V	.5 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)		Quad	S-XQCC-N32	1	1 mm	5 mm		Also Operates at 3.3 V nominal supply				21	260 °C (500 °F)	5 mm
LCMXO2-7000HE-6BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	6864	Yes	1.26 V			206		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No		e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO640C-3MN100I	Lattice Semiconductor	FPGA	Industrial	Ball	100	LFBGA	Square	Plastic/Epoxy	640	Yes	3.465 V	80		74		1.8		1.8/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA100,14X14,20	Field Programmable Gate Arrays	1.71 V	.5 mm	100 °C (212 °F)		80 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B100	3	1.35 mm	8 mm	No		e1		30 s	74	260 °C (500 °F)	8 mm
LFCPNX-100-8ASG256A	Lattice Semiconductor	FPGA
LIFCL-17-8BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V			48		1			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B256	3	1.7 mm	14 mm					30 s	48	260 °C (500 °F)	14 mm
M1A3P400-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.575 V	9216	CMOS		400000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	100 °C (212 °F)		9216 CLBS, 400000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3		30 s		245 °C (473 °F)	28 mm
M1AGL250V5-VQG100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	6144	Yes	1.575 V		CMOS	68	250000	1.5			Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ		1.425 V	.5 mm	100 °C (212 °F)		250000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3			68		14 mm
M2GL025T-1FG484IX417	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V			267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.44 mm	23 mm						267		23 mm
M2GL090-FGG676I	Microchip Technology	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	86316	Yes	1.26 V		CMOS	425		1.2	Tray	1.2 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No				30 s	425	250 °C (482 °F)	27 mm
MPF300T-1FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	512		1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				512		35 mm
XC3S400-4TQ144I	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS	97	400000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm		0.61 ns	896 CLBS, 400000 Gates		Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	630 MHz		97		20 mm
XC3S50AN-4FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	1584	Yes	1.26 V	176	CMOS	144	50000	1.2		1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	176 CLBS, 50000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm	No			667 MHz		112		17 mm
XC6SLX150-3CSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	338		1.2		1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.21 ns	11519 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	862 MHz	30 s	338	260 °C (500 °F)	19 mm
XC6SLX150-3FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	338		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	11519 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	862 MHz	30 s	338	250 °C (482 °F)	23 mm
XC7A35T-L2CSG325E	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	33280	Yes	.93 V	2600		250		0.9		0.9 V	Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32	Field Programmable Gate Arrays	.87 V	.8 mm	100 °C (212 °F)	1.51 ns	2600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm	No	Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7K410T-1FBG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	CMOS	500		1		1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm		0.74 ns	31775 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900	4	2.54 mm	31 mm	No		e1	1098 MHz	30 s	500	245 °C (473 °F)	31 mm
XC7K410T-2FFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	CMOS	400		1		1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	31775 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm	No		e1	1286 MHz	30 s	400	250 °C (482 °F)	27 mm
XC7S100-2FGGA676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	102400	Yes	1.05 V	8000	HKMG	400		1			Grid Array	BGA676,26X26,40		.95 V	1 mm	100 °C (212 °F)	1.05 ns	8000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676		2.44 mm	27 mm			e1	1286 MHz		400		27 mm
XC7S100-L1FGGA676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	102400	Yes	.98 V	8000	HKMG	400		0.95			Grid Array	BGA676,26X26,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	8000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676		2.44 mm	27 mm			e1	1098 MHz		400		27 mm
XC7S75-1FGGA676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	76800	Yes	1.05 V	6000	HKMG	400		1			Grid Array	BGA676,26X26,40		.95 V	1 mm	85 °C (185 °F)	1.27 ns	6000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676		2.44 mm	27 mm			e1	1098 MHz		400		27 mm
10CL006YE144C6G	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	1.25 V	392				1.2			Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch			1.15 V	.5 mm	85 °C (185 °F)		392 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm								20 mm
10CL025YE144C6G	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	1.25 V	1539				1.2			Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch			1.15 V	.5 mm	85 °C (185 °F)		1539 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm								20 mm
10M08DAF484I7P	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	8000	Yes	1.25 V	500		250		1.2			Grid Array	BGA484,22X22,40		1.15 V	1 mm	100 °C (212 °F)		500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2 mm	23 mm						250		23 mm
10M25DAF256A7G	Intel	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	25000	Yes	1.25 V	1563		360		1.2			Grid Array	BGA256,16X16,40		1.15 V	1 mm	125 °C (257 °F)		1563 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm			e1			360		17 mm
5CEBA4F17C6N	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	49000	Yes	1.13 V		CMOS	128		1.1		1.1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm	No					128		17 mm
5CEFA2F23C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	25000	Yes	1.13 V		CMOS	304		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No					304		23 mm
A3PE1500-1FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.575 V	38400	CMOS		1500000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		38400 CLBS, 1500000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0		20 s		225 °C (437 °F)	23 mm
A3PN010-1QNG48I	Microchip Technology	FPGA	Industrial	No Lead	48	HQCCN	Square			Yes	1.575 V	260	CMOS		10000	1.5	Tray		Chip Carrier, Heat Sink/Slug			1.425 V	.4 mm	85 °C (185 °F)		260 CLBS, 10000 Gates	-40 °C (-40 °F)		Quad	S-XQCC-N48	3		6 mm	No							6 mm
EP2C35F672I8	Intel	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	33216	Yes	1.25 V	2076	CMOS	475		1.2		1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm			2076 CLBS		Tin Lead	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No	Also requires 3.3 V supply	e0	402.5 MHz		459		27 mm
EP3C80F484C7N	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	81264	Yes	1.25 V	81264	CMOS	295		1.2			Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		81264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e1	472.5 MHz		295		23 mm
EP4CE55F23I7	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	55856	Yes	1.25 V	3491		327		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm			3491 CLBS		Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e0	472.5 MHz		327		23 mm
ICE40LP384-CM36TR	Lattice Semiconductor	FPGA	Industrial	Ball	36	VFBGA	Square	Plastic/Epoxy	384	Yes	1.26 V	48	CMOS	25		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	48 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B36	3	1 mm	2.5 mm			e1			25	260 °C (500 °F)	2.5 mm
ICE40LP384-CM36TR1K	Lattice Semiconductor	FPGA	Industrial	Ball	36	VFBGA	Square	Plastic/Epoxy	384	Yes	1.26 V	48	CMOS	25		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	48 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B36	3	1 mm	2.5 mm			e1			25	260 °C (500 °F)	2.5 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.