Altera Field Programmable Gate Arrays (FPGA) 2,400+

Reset All
Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

10M08SAE144C8GES

Altera

FPGA

10M02SCE144C8GES

Altera

FPGA

10M08SAU169C8GES

Altera

FPGA

10M08SAM153C8GES

Altera

FPGA

10M50SAE144C8GES

Altera

FPGA

10M08DAF256C8GES

Altera

FPGA

Tin Lead

e0

EP4CGX15BN11C8N

Altera

FPGA

Other

Butt

148

HVBCC

Square

14400

Yes

1.24 V

900

72

1.2

1.2,1.2/3.3,2.5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LGA148,22X22,20

Field Programmable Gate Arrays

1.16 V

.5 mm

85 °C (185 °F)

900 CLBS

0 °C (32 °F)

Gold Over Nickel

Bottom

S-XBCC-B148

3

.8 mm

11 mm

No

e4

472.5 MHz

72

11 mm

5CEFA7U19C8NES

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

56415

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

56415 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

1.9 mm

19 mm

e1

19 mm

5CGXBC9F6F23I7

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5AGZME1H2F35I3L

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

220000

Yes

1.18 V

8302

414

1.15

Grid Array

BGA1152,34X34,40

1.12 V

1 mm

100 °C (212 °F)

8302 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

414

35 mm

EP3SE260H780I4LN

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

255000

Yes

.94 V

CMOS

488

.9

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.86 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B780

4

3.5 mm

33 mm

No

It can also operate from 1.05 to 1.15 V supply

e1

717 MHz

30 s

488

245 °C (473 °F)

33 mm

5CGXBC5F7F27C6N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5SGXEA3E3H29C3

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

340000

Yes

CMOS

360

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B780

No

360

5CGXBC7C6F31C7

Altera

FPGA

Other

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B896

2 mm

31 mm

31 mm

5AGXBA1G4F27I3

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

670 MHz

27 mm

5AGZME5K3F40I3N

Altera

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1517

2.7 mm

40 mm

e1

670 MHz

40 mm

EP3SL340F1760C4

Altera

FPGA

Other

Ball

1760

BGA

Square

Plastic/Epoxy

337500

Yes

.94 V

CMOS

1120

.9

1.2/3.3 V

Grid Array

BGA1760,42X42,40

Field Programmable Gate Arrays

.86 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1760

4

3.9 mm

42.5 mm

No

It can also operate from 1.05 to 1.15 V supply

e0

717 MHz

20 s

1120

220 °C (428 °F)

42.5 mm

5CSEMA5U19A7N

Altera

FPGA

Automotive

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

EP2AGZ300EF35I3N

Altera

FPGA

Industrial

Ball

1152

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.6 mm

35 mm

e1

500 MHz

35 mm

5CGXFC9D7U19C7

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

EP1AGX35DF484I6N

Altera

FPGA

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.25 V

33520

1.2

Grid Array

1.15 V

1 mm

100 °C (212 °F)

33520 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B484

2.44 mm

23 mm

No

23 mm

10AX027H2F34E2SP

Altera

FPGA

Ball

1152

BGA

Square

Plastic

270000

Yes

CMOS

384

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1152

No

384

10AX066N3F40E2SP

Altera

FPGA

Ball

1517

BGA

Square

Plastic

660000

Yes

CMOS

588

.9

0.9 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1517

No

588

5SGXEB6R3F40I4

Altera

FPGA

Industrial

Ball

1517

BGA

Square

Plastic/Epoxy

597000

Yes

.88 V

22540

CMOS

432

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.82 V

1 mm

100 °C (212 °F)

22540 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

No

432

40 mm

5CGXBC9C7F31C7

Altera

FPGA

Other

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B896

2 mm

31 mm

31 mm

5CGXFC7B6F31A7

Altera

FPGA

Automotive

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B896

2 mm

31 mm

31 mm

5ASTFD5E3F31C4

Altera

FPGA

Ball

896

BGA

Square

Plastic/Epoxy

503500

Yes

CMOS

178

1.1,1.2/3.3,2.5 V

Grid Array

BGA896,30X30,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B896

No

178

EP2AGX65FU17C4N

Altera

FPGA

Other

Ball

358

LFBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Low Profile, Fine Pitch

.87 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B358

1.7 mm

17 mm

e1

500 MHz

17 mm

5AGXBA1H4F31I3

Altera

FPGA

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B896

2.7 mm

31 mm

e0

670 MHz

31 mm

5SGXEBBR2H43C2LN

Altera

FPGA

Other

Ball

1760

BGA

Square

Plastic/Epoxy

952000

Yes

.88 V

35920

CMOS

600

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1760,42X42,40

Field Programmable Gate Arrays

.82 V

1 mm

85 °C (185 °F)

35920 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1760

4 mm

45 mm

No

600

45 mm

5AGXFA1D6F31I3N

Altera

FPGA

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B896

2.7 mm

31 mm

e1

670 MHz

31 mm

5SGXMA3K3F40C2N

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

340000

Yes

.93 V

12830

CMOS

696

.9

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

12830 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

No

696

40 mm

5SGXMA4H3F35C2LN

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

420000

Yes

.88 V

15850

CMOS

552

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.82 V

1 mm

85 °C (185 °F)

15850 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

552

35 mm

EP1SGX10CF672C5N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

10570

Yes

1.575 V

1200

CMOS

362

1.5

1.5,1.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1.425 V

1 mm

85 °C (185 °F)

1200 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e1

30 s

362

245 °C (473 °F)

27 mm

EP4SGX230DF29I2X

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

228000

Yes

.93 V

9120

372

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

100 °C (212 °F)

9120 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.5 mm

29 mm

372

29 mm

5AGXBB3G4F40I3N

Altera

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1517

2.7 mm

40 mm

e1

670 MHz

40 mm

5CGXFC7F6F27A7N

Altera

FPGA

Automotive

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5CGTFD7B5F27I7N

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

EP1S30F780I7ES

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B780

No

e0

5SGXMB6R2F40C1N

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

597000

Yes

.93 V

22540

CMOS

432

.9

0.9,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

22540 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

No

432

40 mm

10AS027E2F27E1SG

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

270000

Yes

.93 V

CMOS

240

.9

0.9 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

3.25 mm

27 mm

No

240

27 mm

EP3SE260F1517I4

Altera

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

255000

Yes

.94 V

CMOS

976

.9

1.2/3.3 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.86 V

1 mm

Tin Lead

Bottom

S-PBGA-B1517

3

3.9 mm

40 mm

No

It can also operate from 1.05 to 1.15 V supply

e0

717 MHz

20 s

976

220 °C (428 °F)

40 mm

10AS027H1F35I1SP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

35 mm

10M16SAE144I6

Altera

FPGA

Gull Wing

144

QFP

Square

Plastic/Epoxy

Yes

Flatpack

Quad

S-PQFP-G144

EPF10K100EFI484-1DX

Altera

3

220 °C (428 °F)

5AGXMA7H4F35I3

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

670 MHz

35 mm

5CSEBA6U19I7

Altera

FPGA

Ball

484

FBGA

Square

Plastic/Epoxy

110000

Yes

1.13 V

CMOS

66

1.1

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA484,22X22,32

Field Programmable Gate Arrays

1.07 V

.8 mm

Bottom

S-PBGA-B484

1.9 mm

19 mm

No

66

19 mm

10AX090N3F40E2SP

Altera

FPGA

Ball

1517

BGA

Square

Plastic

900000

Yes

CMOS

600

.9

0.9 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1517

No

600

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.