Altera Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP3SL200F1152C4LN	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	200000	Yes	.94 V		CMOS	744	.9	1.2/3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.86 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	4	3.9 mm	35 mm	No	It can also operate from 1.05 to 1.15 V supply	e1	717 MHz	30 s	744	245 °C (473 °F)	35 mm
EP4CGX15BN11C7N	Altera	FPGA	Other	Butt	148	HVBCC	Square		14400	Yes	1.24 V	900		72	1.2	1.2,1.2/3.3,2.5 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	SLGA148,22X22,20	Field Programmable Gate Arrays	1.16 V	.5 mm	85 °C (185 °F)	900 CLBS	0 °C (32 °F)	Gold Over Nickel	Bottom	S-XBCC-B148	3	.8 mm	11 mm	No		e4	472.5 MHz		72		11 mm
EP1C12F256I6	Altera	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12060	Yes	1.575 V	1206		185	1.5	1.5,1.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)	1206 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No		e0	405 MHz		185	220 °C (428 °F)	17 mm
EP2AGX65HF29I5N	Altera	FPGA	Industrial	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
EP2AGX125DF25C6NES	Altera	FPGA	Other	Ball	572	BGA	Square	Plastic/Epoxy		Yes	.93 V	124100			.9		Grid Array			.87 V	1 mm	85 °C (185 °F)	124100 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B572		3.5 mm	25 mm	No			500 MHz				25 mm
5SGXEA4K1F40C1N	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	420000	Yes	.93 V	15850	CMOS	696	.9	0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	15850 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No					696		40 mm
5SGXMA7N3F45	Altera	FPGA		Ball	1932	BGA	Square	Plastic/Epoxy		Yes							Grid Array				1 mm					Bottom	S-PBGA-B1932		3.4 mm	45 mm				12.5 MHz				45 mm
5SGXEA9K1H40I2N	Altera	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	840000	Yes	.93 V	31700	CMOS	696	.9	0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	31700 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.9 mm	45 mm	No					696		45 mm
10AX057H2F34I1SP	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm								35 mm
5AGXFB5K4F35C5	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	622 MHz				35 mm
5CGXBC5B6F23I7N	Altera	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm					Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
5SGXEA9K3H40I3LN	Altera	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	840000	Yes	.88 V	31700	CMOS	696	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)	31700 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.9 mm	45 mm	No					696		45 mm
EP4SE360H29I3N	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	353600	Yes	.93 V	14144	CMOS	488	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm		14144 CLBS		Tin Silver Copper	Bottom	S-PBGA-B780	4	3.4 mm	33 mm	No		e1	717 MHz	30 s	488	245 °C (473 °F)	33 mm
5CGXFC5E7F27A7	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5AGZME7E3F40I3	Altera	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Lead	Bottom	S-PBGA-B1517		2.7 mm	40 mm			e0	670 MHz				40 mm
10M08DAV81A7	Altera	FPGA	Automotive	Ball	81	BGA	Square	Plastic/Epoxy		Yes							Grid Array					125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B81
5CGXBC4D6M11C7	Altera	FPGA	Other	Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B301		1.1 mm	11 mm								11 mm
10AS032H2F34E1SG	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	320000	Yes	.93 V		CMOS	384	.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm	No					384		35 mm
EPF10K100EFC672-3DX	Altera																											3									220 °C (428 °F)
5CGXBC7C7U19C7N	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
10AX057H4F34E3LP	Altera	FPGA		Ball	1152	BGA	Square	Plastic	570000	Yes			CMOS	492	.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B1152				No					492
5SGSMD5H1F35C2L	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	457000	Yes	.88 V	17260	CMOS	552	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)	17260 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No					552		35 mm
5CGXBC9A6F27I7N	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm					Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5AGXFA5K6F31C4N	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896		2.7 mm	31 mm			e1	670 MHz				31 mm
5CGXFC4F7F23C7	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
10AT115S2F45E1LG	Altera	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B1932		3.65 mm	45 mm								45 mm
10AX066H4F34I3SGES	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm								35 mm
EP2AGX125EF29C6NES	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V	124100			.9		Grid Array			.87 V	1 mm	85 °C (185 °F)	124100 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.5 mm	29 mm	No			500 MHz				29 mm
5CGXBC4C7M11I7N	Altera	FPGA		Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm					Bottom	S-PBGA-B301		1.1 mm	11 mm								11 mm
5AGXFA5H6F27I5	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm			e0	622 MHz				27 mm
5CGXFC9C6F31C8	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B896		2 mm	31 mm								31 mm
5CGXBC7F7F31C8N	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B896		2 mm	31 mm								31 mm
EP4SE820H35M3	Altera	FPGA	Military	Ball	1152	BGA	Square	Plastic/Epoxy	813050	Yes	.93 V	32522		744	0.9		Grid Array	BGA1152,34X34,40		.87 V	1 mm	125 °C (257 °F)	32522 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B1152		3.5 mm	42 mm						744		42 mm
EP2AGZ350EF35I3	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	348500	Yes	.93 V	13940		554	0.9		Grid Array	BGA1152,34X34,40		.87 V	1 mm	100 °C (212 °F)	13940 CLBs	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.6 mm	35 mm			e0			554		35 mm
10M16DFF484I7	Altera	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B484
EP20K100BI356-1V	Altera	FPGA		Ball	356	BGA	Square	Plastic/Epoxy	4160	Yes			CMOS	246		2.5,2.5/3.3 V	Grid Array	BGA356,26X26,50	Field Programmable Gate Arrays		1.27 mm					Bottom	S-PBGA-B356				No					246	220 °C (428 °F)
10M08DCV36C8	Altera	FPGA	Other	Ball	36	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B36
EPF10K100BQI208-3DX	Altera																											3									220 °C (428 °F)
5CGXBC7C7U19C6	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
EP4CGX30DF14C8	Altera	FPGA	Other	Ball	169	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B169		1.55 mm	14 mm								14 mm
5CGXFC5E6U19A7	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
EP2AGX95EF35I5ES	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V	93675			.9		Grid Array			.87 V	1 mm	100 °C (212 °F)	93675 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm	No			500 MHz				35 mm
5CGXBC9C6U19C7N	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
EP1C6F256C7	Altera	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	5980	Yes	1.575 V	598		185	1.5	1.5,1.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	598 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No		e0	320 MHz	20 s	185	220 °C (428 °F)	17 mm
5ASXMB3G6F40C6N	Altera	FPGA
5CGXBC4C6M11C8N	Altera	FPGA	Other	Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B301		1.1 mm	11 mm								11 mm
5SGXMABK3H40C2LN	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	952000	Yes	.88 V	35920	CMOS	696	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)	35920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.9 mm	45 mm	No					696		45 mm
5AGXFB1G4F40I5N	Altera	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B1517		2.7 mm	40 mm			e1	622 MHz				40 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.