Altera Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5CGXBC7C7U19C6N	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
5SGSMD3E3H29C4	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	236000	Yes	.88 V	8900	CMOS	360	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)	8900 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.6 mm	33 mm	No					360		33 mm
5AGXFA1D4F27C4	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm			e0	670 MHz				27 mm
10AS027E3F29E2SP	Altera	FPGA		Ball	780	BGA	Square	Plastic	270000	Yes			CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B780				No					360
5AGXMB3G6F35I3N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	670 MHz				35 mm
5ASXBB3G4F31I3N	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B896		2.7 mm	31 mm			e1	670 MHz				31 mm
EP2AGX95CF35C6N	Altera	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.6 mm	35 mm			e1	500 MHz				35 mm
5SGXMA3K3F40C2LN	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	340000	Yes	.88 V	12830	CMOS	696	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)	12830 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No					696		40 mm
5SGXMA4H3F35I3LN	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	420000	Yes	.88 V	15850	CMOS	552	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)	15850 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No					552		35 mm
EP20K300ERI208-1	Altera																																				220 °C (428 °F)
EP4CGX75CF27C7	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2.4 mm	27 mm								27 mm
5AGXFB3K4F31C4	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B896		2.7 mm	31 mm			e0	670 MHz				31 mm
5SGSMD4E3H29I3N	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	360000	Yes	.88 V	13584	CMOS	360	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)	13584 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.6 mm	33 mm	No					360		33 mm
5AGXBB3H6F40C5	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1517		2.7 mm	40 mm			e0	622 MHz				40 mm
5AGXFB7K6F40C5	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1517		2.7 mm	40 mm			e0	622 MHz				40 mm
5ASXFB3H4F40C5	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1517		2.7 mm	40 mm			e0	622 MHz				40 mm
5CSEBA6F31C8N	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B896		2 mm	31 mm								31 mm
10AX090N2F45E2LP	Altera	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	900000	Yes	.93 V		CMOS	768	.9	0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B1932		3.65 mm	45 mm	No					768		45 mm
EP1S80F1508C5N	Altera	FPGA	Commercial Extended	Ball	1508	BGA	Square	Plastic/Epoxy	79040	Yes	1.575 V		CMOS	1238	1.5	1.5,1.5/3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1508	3			No		e1			1238	245 °C (473 °F)
EP1K50TI144-2X	Altera	FPGA	Industrial	Gull Wing	144	QFP	Square	Plastic/Epoxy	2880	Yes			CMOS	102		2.5,2.5/3.3 V	Flatpack	QFP144,.87SQ,20	Field Programmable Gate Arrays		.5 mm	85 °C (185 °F)		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3			No		e0			102	220 °C (428 °F)
10M08DFV36C7G	Altera	FPGA	Other	Ball	36	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B36
EP3SL340F1760I4LN	Altera	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	337500	Yes	.94 V		CMOS	1120	.9	1.2/3.3 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.86 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.9 mm	42.5 mm	No	It can also operate from 1.05 to 1.15 V supply	e1	717 MHz	30 s	1120	245 °C (473 °F)	42.5 mm
EP4CGX50BF23C7N	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm								23 mm
5ASXFB5H6F40C6	Altera	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434		540	1.1		Grid Array, Heat Sink/Slug	BGA1517,39X39,40		1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm						540		40 mm
10AX048H2F34I1LP	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm								35 mm
10AX048E4F29I3SP	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	480000	Yes	.93 V		CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					360		29 mm
5CEFA7U19I7	Altera	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	149500	Yes	1.13 V		CMOS	230	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm					Bottom	S-PBGA-B484		1.9 mm	19 mm	No					230		19 mm
EP2AGX260DF35I3N	Altera	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.6 mm	35 mm			e1	500 MHz				35 mm
10AX066K3F40E2LP	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	660000	Yes	.93 V		CMOS	696	.9	0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No					696		40 mm
EP1SGX10GF672I7ES	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V	1 mm				Tin Lead	Bottom	S-PBGA-B672		3.5 mm	27 mm	No		e0					27 mm
EP1C3T144C6ES	Altera	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.575 V	2910			1.5		Flatpack, Low Profile, Fine Pitch			1.425 V	.5 mm		2910 CLBS		Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	405 MHz				20 mm
EP1S30F780C7ES	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780				No		e0
EP4SE820H40C4N	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	813050	Yes	.93 V	325220	CMOS	976	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	325220 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.8 mm	42.5 mm	No		e1	717 MHz	30 s	976	245 °C (473 °F)	42.5 mm
5AGXFB5D6F40I5	Altera	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Lead	Bottom	S-PBGA-B1517		2.7 mm	40 mm			e0	622 MHz				40 mm
EP4SGX360NF45I4	Altera	FPGA		Ball	1932	BGA	Square	Plastic/Epoxy	353600	Yes	.93 V	141440	CMOS	920	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm		141440 CLBS		Tin Lead	Bottom	S-PBGA-B1932	4	3.8 mm	45 mm	No		e0	717 MHz	20 s	920	220 °C (428 °F)	45 mm
5SGXMA5N1F45C2	Altera	FPGA		Ball	1932	BGA	Square	Plastic/Epoxy	490000	Yes			CMOS	840		0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B1932				No					840
5SGXMBBR3H43I4	Altera	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	952000	Yes			CMOS	600		0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B1760				No					600
5AGTMC3K3F31I5N	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B896		2.7 mm	31 mm			e1	622 MHz				31 mm
EP3C16U256I8N	Altera	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	15408	Yes	1.25 V		CMOS	168	1.2		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm				Tin Silver Copper	Bottom	S-PBGA-B256		1.5 mm	14 mm	No		e1			168		14 mm
10AS02H2F34ISGAA2	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm								35 mm
5CEBA7F31A7N	Altera	FPGA	Automotive	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B896		2 mm	31 mm								31 mm
5AGXBA3K4F27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm			e1	500 MHz				27 mm
EP20K400EQC208-1	Altera																											3									220 °C (428 °F)
5CGXBC9A7U19C6	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
5ASXFB3E4F40I5	Altera	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Lead	Bottom	S-PBGA-B1517		2.7 mm	40 mm			e0	622 MHz				40 mm
5SGXEA5K1F40C2L	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	490000	Yes	.88 V	18500	CMOS	696	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)	18500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No					696		40 mm
EP2C8F256I6	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	8256	Yes	1.25 V	540	CMOS	182	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm		540 CLBS		Tin Lead	Bottom	S-PBGA-B256		1.55 mm	17 mm	No	Also requires 3.3 V supply	e0			174		17 mm
5SGXEABK1H40C2	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	952000	Yes	.93 V	35920	CMOS	696	.9	0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	35920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.9 mm	45 mm	No					696		45 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.