Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Altera |
FPGA |
Industrial |
Ball |
1517 |
BGA |
Square |
Plastic/Epoxy |
900000 |
Yes |
.93 V |
CMOS |
600 |
.9 |
0.9 V |
Grid Array |
BGA1517,39X39,40 |
Field Programmable Gate Arrays |
.87 V |
1 mm |
100 °C (212 °F) |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B1517 |
3.5 mm |
40 mm |
No |
600 |
40 mm |
|||||||||||||||
|
Altera |
FPGA |
Other |
Ball |
1152 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.13 V |
1.1 |
Grid Array |
1.07 V |
1 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B1152 |
2.7 mm |
35 mm |
e1 |
622 MHz |
35 mm |
||||||||||||||||||||
Altera |
FPGA |
Other |
Ball |
1517 |
BGA |
Square |
Plastic/Epoxy |
900000 |
Yes |
.93 V |
CMOS |
600 |
.9 |
0.9 V |
Grid Array |
BGA1517,39X39,40 |
Field Programmable Gate Arrays |
.87 V |
1 mm |
100 °C (212 °F) |
0 °C (32 °F) |
Bottom |
S-PBGA-B1517 |
3.5 mm |
40 mm |
No |
600 |
40 mm |
||||||||||||||||
Altera |
FPGA |
Other |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.13 V |
1.1 |
Grid Array |
1.07 V |
1 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Bottom |
S-PBGA-B484 |
2 mm |
23 mm |
23 mm |
||||||||||||||||||||||||
Altera |
FPGA |
Other |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.13 V |
1.1 |
Grid Array |
1.07 V |
1 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Bottom |
S-PBGA-B484 |
2 mm |
23 mm |
23 mm |
||||||||||||||||||||||||
Altera |
FPGA |
Other |
Ball |
1152 |
HBGA |
Square |
Plastic/Epoxy |
462000 |
Yes |
1.13 V |
17434 |
TSMC |
540 |
1.1 |
Grid Array, Heat Sink/Slug |
BGA1152,34X34,40 |
1.07 V |
1 mm |
85 °C (185 °F) |
17434 CLBS |
0 °C (32 °F) |
Bottom |
S-PBGA-B1152 |
2.7 mm |
35 mm |
540 |
35 mm |
|||||||||||||||||
|
Altera |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
15408 |
Yes |
1.25 V |
CMOS |
84 |
1.2 |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
Matte Tin |
Quad |
S-PQFP-G144 |
1.65 mm |
20 mm |
No |
e3 |
84 |
20 mm |
|||||||||||||||||
|
Altera |
FPGA |
Industrial |
Ball |
1517 |
BGA |
Square |
Plastic/Epoxy |
490000 |
Yes |
.93 V |
18500 |
CMOS |
696 |
.9 |
0.9,1.5,2.5,2.5/3,1.2/3 V |
Grid Array |
BGA1517,39X39,40 |
Field Programmable Gate Arrays |
.87 V |
1 mm |
100 °C (212 °F) |
18500 CLBS |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B1517 |
3.5 mm |
40 mm |
No |
696 |
40 mm |
|||||||||||||
Altera |
FPGA |
Industrial |
Ball |
780 |
BGA |
Square |
Plastic/Epoxy |
Yes |
.93 V |
.9 |
Grid Array |
.87 V |
1 mm |
100 °C (212 °F) |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B780 |
3.35 mm |
29 mm |
29 mm |
||||||||||||||||||||||||
|
Altera |
FPGA |
Other |
Ball |
1152 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.13 V |
1.1 |
Grid Array |
1.07 V |
1 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B1152 |
2.7 mm |
35 mm |
e1 |
670 MHz |
35 mm |
||||||||||||||||||||
Altera |
FPGA |
Other |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.13 V |
1.1 |
Grid Array |
1.07 V |
1 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Bottom |
S-PBGA-B484 |
2 mm |
23 mm |
23 mm |
||||||||||||||||||||||||
Altera |
FPGA |
Other |
Ball |
1517 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.13 V |
1.1 |
Grid Array |
1.07 V |
1 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B1517 |
2.7 mm |
40 mm |
e0 |
622 MHz |
40 mm |
|||||||||||||||||||||
Altera |
FPGA |
Other |
Ball |
1152 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.13 V |
1.1 |
Grid Array |
1.07 V |
1 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B1152 |
2.7 mm |
35 mm |
e0 |
670 MHz |
35 mm |
|||||||||||||||||||||
|
Altera |
FPGA |
Industrial |
Ball |
1932 |
BGA |
Square |
Plastic/Epoxy |
1150000 |
Yes |
.93 V |
CMOS |
480 |
.9 |
0.9 V |
Grid Array |
BGA1932,44X44,40 |
Field Programmable Gate Arrays |
.87 V |
1 mm |
100 °C (212 °F) |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B1932 |
3.65 mm |
45 mm |
No |
480 |
45 mm |
|||||||||||||||
Altera |
FPGA |
Other |
Ball |
1152 |
BGA |
Square |
Plastic/Epoxy |
570000 |
Yes |
.93 V |
CMOS |
432 |
.9 |
0.9 V |
Grid Array |
BGA1152,34X34,40 |
Field Programmable Gate Arrays |
.87 V |
1 mm |
100 °C (212 °F) |
0 °C (32 °F) |
Bottom |
S-PBGA-B1152 |
3.5 mm |
35 mm |
No |
432 |
35 mm |
||||||||||||||||
Altera |
FPGA |
Ball |
164 |
FBGA |
Square |
Plastic/Epoxy |
10320 |
Yes |
CMOS |
106 |
1.2/3.3 V |
Grid Array, Fine Pitch |
BGA164,15X15,20 |
Field Programmable Gate Arrays |
.5 mm |
Bottom |
S-PBGA-B164 |
No |
106 |
|||||||||||||||||||||||||
Altera |
FPGA |
Other |
Ball |
1517 |
BGA |
Square |
Plastic/Epoxy |
695000 |
Yes |
.93 V |
26240 |
CMOS |
696 |
.9 |
0.9,1.5,2.5,2.5/3,1.2/3 V |
Grid Array |
BGA1517,39X39,40 |
Field Programmable Gate Arrays |
.87 V |
1 mm |
85 °C (185 °F) |
26240 CLBS |
0 °C (32 °F) |
Bottom |
S-PBGA-B1517 |
3.5 mm |
40 mm |
No |
696 |
40 mm |
||||||||||||||
Altera |
FPGA |
Industrial |
No Lead |
1517 |
BGA |
Square |
Plastic/Epoxy |
350000 |
Yes |
1.18 V |
13207 |
TSMC |
540 |
1.15 |
Grid Array |
BGA1517,39X39,40 |
1.12 V |
1 mm |
100 °C (212 °F) |
13207 CLBS |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B1517 |
2.7 mm |
40 mm |
540 |
40 mm |
|||||||||||||||||
Altera |
FPGA |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
CMOS |
1.5 |
Grid Array |
1.425 V |
1 mm |
Tin Lead |
Bottom |
S-PBGA-B672 |
3.5 mm |
27 mm |
No |
e0 |
27 mm |
|||||||||||||||||||||||
Altera |
FPGA |
Other |
Ball |
896 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.13 V |
1.1 |
Grid Array |
1.07 V |
1 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B896 |
2.7 mm |
31 mm |
e0 |
622 MHz |
31 mm |
|||||||||||||||||||||
|
Altera |
FPGA |
Automotive |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
Yes |
Grid Array |
125 °C (257 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
e1 |
||||||||||||||||||||||||||||
Altera |
FPGA |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
CMOS |
1.5 |
Grid Array |
1.425 V |
85 °C (185 °F) |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B672 |
No |
e0 |
||||||||||||||||||||||||
Altera |
FPGA |
Commercial Extended |
Ball |
1152 |
BGA |
Square |
Plastic/Epoxy |
350000 |
Yes |
1.13 V |
13207 |
TSMC |
385 |
1.1 |
Grid Array |
BGA1152,34X34,40 |
1.07 V |
1 mm |
85 °C (185 °F) |
13207 CLBS |
0 °C (32 °F) |
Bottom |
S-PBGA-B1152 |
2.7 mm |
35 mm |
385 |
35 mm |
|||||||||||||||||
Altera |
FPGA |
Industrial |
No Lead |
1517 |
BGA |
Square |
Plastic/Epoxy |
350000 |
Yes |
1.18 V |
13207 |
540 |
1.15 |
Grid Array |
BGA1517,39X39,40 |
1.12 V |
1 mm |
100 °C (212 °F) |
13207 CLBS |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B1517 |
2.7 mm |
40 mm |
540 |
40 mm |
||||||||||||||||||
Altera |
3 |
220 °C (428 °F) |
||||||||||||||||||||||||||||||||||||||||||
Altera |
FPGA |
Ball |
896 |
BGA |
Square |
Plastic/Epoxy |
362730 |
Yes |
CMOS |
384 |
1.1,1.2/3.3,2.5 V |
Grid Array |
BGA896,30X30,40 |
Field Programmable Gate Arrays |
1 mm |
Bottom |
S-PBGA-B896 |
No |
384 |
|||||||||||||||||||||||||
|
Altera |
FPGA |
Other |
Ball |
1517 |
BGA |
Square |
Plastic/Epoxy |
362000 |
Yes |
1.13 V |
CMOS |
704 |
1.1 |
1.1,1.2/3.3,2.5 V |
Grid Array |
BGA1517,39X39,40 |
Field Programmable Gate Arrays |
1.07 V |
1 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B1517 |
3 |
2.7 mm |
40 mm |
No |
e1 |
622 MHz |
704 |
40 mm |
|||||||||||
Altera |
FPGA |
Other |
Ball |
1152 |
BGA |
Square |
Plastic/Epoxy |
89178 |
Yes |
.93 V |
3747 |
452 |
0.9 |
Grid Array |
BGA1152,34X34,40 |
.87 V |
1 mm |
85 °C (185 °F) |
3747 CLBS |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B1152 |
2.6 mm |
35 mm |
e0 |
452 |
35 mm |
||||||||||||||||
Altera |
FPGA |
Ball |
36 |
BGA |
Square |
Plastic/Epoxy |
Yes |
Grid Array |
Bottom |
S-PBGA-B36 |
||||||||||||||||||||||||||||||||||
Altera |
FPGA |
Other |
Ball |
36 |
BGA |
Square |
Plastic/Epoxy |
Yes |
Grid Array |
85 °C (185 °F) |
0 °C (32 °F) |
Bottom |
S-PBGA-B36 |
|||||||||||||||||||||||||||||||
|
Altera |
FPGA |
Other |
Ball |
896 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.13 V |
1.1 |
Grid Array |
1.07 V |
1 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B896 |
2.7 mm |
31 mm |
e1 |
622 MHz |
31 mm |
||||||||||||||||||||
Altera |
FPGA |
Industrial |
Ball |
1932 |
BGA |
Square |
Plastic/Epoxy |
900000 |
Yes |
.93 V |
33962 |
CMOS |
480 |
.9 |
0.9 V |
Grid Array |
BGA1932,44X44,40 |
Field Programmable Gate Arrays |
.87 V |
1 mm |
100 °C (212 °F) |
33962 CLBS |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B1932 |
3.5 mm |
45 mm |
No |
480 |
45 mm |
||||||||||||||
|
Altera |
FPGA |
Other |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
10570 |
Yes |
1.575 V |
1200 |
CMOS |
362 |
1.5 |
1.5,1.5/3.3 V |
Grid Array |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
1.425 V |
1 mm |
85 °C (185 °F) |
1200 CLBS |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
3 |
3.5 mm |
27 mm |
No |
e1 |
30 s |
362 |
245 °C (473 °F) |
27 mm |
||||||||
|
Altera |
FPGA |
Industrial |
Ball |
1152 |
BGA |
Square |
Plastic/Epoxy |
570000 |
Yes |
.93 V |
CMOS |
396 |
.9 |
0.9 V |
Grid Array |
BGA1152,34X34,40 |
Field Programmable Gate Arrays |
.87 V |
1 mm |
100 °C (212 °F) |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B1152 |
3.5 mm |
35 mm |
No |
396 |
35 mm |
|||||||||||||||
Altera |
FPGA |
Other |
Ball |
1152 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.13 V |
1.1 |
Grid Array |
1.07 V |
1 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B1152 |
2.7 mm |
35 mm |
e0 |
670 MHz |
35 mm |
|||||||||||||||||||||
|
Altera |
FPGA |
Ball |
780 |
BGA |
Square |
Plastic/Epoxy |
353600 |
Yes |
.93 V |
14144 |
CMOS |
289 |
.9 |
0.9,1.2/3,1.5,2.5 V |
Grid Array |
BGA780,28X28,40 |
Field Programmable Gate Arrays |
.87 V |
1 mm |
14144 CLBS |
Tin Silver Copper |
Bottom |
S-PBGA-B780 |
4 |
3.4 mm |
33 mm |
No |
e1 |
717 MHz |
30 s |
289 |
245 °C (473 °F) |
33 mm |
||||||||||
Altera |
FPGA |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
15600 |
Yes |
CMOS |
366 |
1.2,1.5/3.3,3.3 V |
Grid Array |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
1 mm |
Tin Lead |
Bottom |
S-PBGA-B672 |
3 |
No |
e0 |
358 |
220 °C (428 °F) |
|||||||||||||||||||||
Altera |
220 °C (428 °F) |
|||||||||||||||||||||||||||||||||||||||||||
|
Altera |
FPGA |
Other |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
100448 |
Yes |
1.25 V |
100448 |
CMOS |
278 |
1.2 |
1.2,1.2/3.3,2.5 V |
Grid Array |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
85 °C (185 °F) |
100448 CLBS |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
3 |
2.15 mm |
23 mm |
No |
e1 |
450 MHz |
30 s |
278 |
260 °C (500 °F) |
23 mm |
|||||||
Altera |
FPGA |
Ball |
956 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
CMOS |
1.5 |
Grid Array |
1.425 V |
Tin Lead |
Bottom |
S-PBGA-B956 |
No |
e0 |
|||||||||||||||||||||||||||
Altera |
FPGA |
Ball |
1517 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.18 V |
1.15 |
Grid Array |
1.12 V |
1 mm |
Tin Lead |
Bottom |
S-PBGA-B1517 |
2.7 mm |
40 mm |
e0 |
670 MHz |
40 mm |
||||||||||||||||||||||||
Altera |
FPGA |
Other |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.13 V |
1.1 |
Grid Array |
1.07 V |
1 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Bottom |
S-PBGA-B484 |
2 mm |
23 mm |
23 mm |
||||||||||||||||||||||||
|
Altera |
FPGA |
Other |
Ball |
780 |
HBGA |
Square |
Plastic/Epoxy |
Yes |
.93 V |
.9 |
Grid Array, Heat Sink/Slug |
.87 V |
1 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B780 |
2.7 mm |
29 mm |
e1 |
500 MHz |
29 mm |
||||||||||||||||||||
Altera |
FPGA |
Other |
No Lead |
1517 |
BGA |
Square |
Plastic/Epoxy |
462000 |
Yes |
1.13 V |
17434 |
TSMC |
540 |
1.1 |
Grid Array |
BGA1517,39X39,40 |
1.07 V |
1 mm |
85 °C (185 °F) |
17434 CLBS |
0 °C (32 °F) |
Bottom |
S-PBGA-B1517 |
2.7 mm |
40 mm |
540 |
40 mm |
|||||||||||||||||
Altera |
FPGA |
Military |
Ball |
1020 |
BGA |
Square |
Plastic/Epoxy |
41250 |
Yes |
CMOS |
624 |
1.5,1.5/3.3 V |
Grid Array |
BGA1020,32X32,40 |
Field Programmable Gate Arrays |
1 mm |
135 °C (275 °F) |
-65 °C (-85 °F) |
Bottom |
S-PBGA-B1020 |
3 |
No |
624 |
220 °C (428 °F) |
||||||||||||||||||||
Altera |
FPGA |
Automotive |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.13 V |
1.1 |
Grid Array |
1.07 V |
1 mm |
125 °C (257 °F) |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B484 |
2 mm |
23 mm |
23 mm |
||||||||||||||||||||||||
Altera |
FPGA |
Other |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
Yes |
1.13 V |
1.1 |
Grid Array |
1.07 V |
1 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Bottom |
S-PBGA-B484 |
2 mm |
23 mm |
23 mm |
||||||||||||||||||||||||
Altera |
FPGA |
Ball |
780 |
BGA |
Square |
Plastic/Epoxy |
47500 |
Yes |
CMOS |
488 |
1.2/3.3 V |
Grid Array |
BGA780,28X28,40 |
Field Programmable Gate Arrays |
1 mm |
Tin Lead |
Bottom |
S-PBGA-B780 |
1 |
No |
e0 |
100 MHz |
488 |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.