Altera Field Programmable Gate Arrays (FPGA) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

10AX090N3F40I2SG

Altera

FPGA

Industrial

Ball

1517

BGA

Square

Plastic/Epoxy

900000

Yes

.93 V

CMOS

600

.9

0.9 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

No

600

40 mm

5AGXMB3H4F35C5N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

622 MHz

35 mm

10AT090N2F40E2LP

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

900000

Yes

.93 V

CMOS

600

.9

0.9 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

No

600

40 mm

5CGXFC4A7F23C6

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXFC4A7F23C8

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5ASXFB5G6F35C5N

Altera

FPGA

Other

Ball

1152

HBGA

Square

Plastic/Epoxy

462000

Yes

1.13 V

17434

TSMC

540

1.1

Grid Array, Heat Sink/Slug

BGA1152,34X34,40

1.07 V

1 mm

85 °C (185 °F)

17434 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

2.7 mm

35 mm

540

35 mm

EP3C16E144I8N

Altera

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

15408

Yes

1.25 V

CMOS

84

1.2

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.15 V

.5 mm

Matte Tin

Quad

S-PQFP-G144

1.65 mm

20 mm

No

e3

84

20 mm

5SGXEA5K2F40I2N

Altera

FPGA

Industrial

Ball

1517

BGA

Square

Plastic/Epoxy

490000

Yes

.93 V

18500

CMOS

696

.9

0.9,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

18500 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

No

696

40 mm

10AX048E2F29I1SP

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

5AGXFA5K6F35C4N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

670 MHz

35 mm

5CGXFC4F7F23C6

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5AGXFB1D4F40C5

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1517

2.7 mm

40 mm

e0

622 MHz

40 mm

5AGXBB1G6F35C4

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

670 MHz

35 mm

10AX115U3F45I2LG

Altera

FPGA

Industrial

Ball

1932

BGA

Square

Plastic/Epoxy

1150000

Yes

.93 V

CMOS

480

.9

0.9 V

Grid Array

BGA1932,44X44,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1932

3.65 mm

45 mm

No

480

45 mm

10AX057K4F36E3SP

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

570000

Yes

.93 V

CMOS

432

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

No

432

35 mm

EP3C10M164A7

Altera

FPGA

Ball

164

FBGA

Square

Plastic/Epoxy

10320

Yes

CMOS

106

1.2/3.3 V

Grid Array, Fine Pitch

BGA164,15X15,20

Field Programmable Gate Arrays

.5 mm

Bottom

S-PBGA-B164

No

106

5SGSED8K3F40C2

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

695000

Yes

.93 V

26240

CMOS

696

.9

0.9,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

26240 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

No

696

40 mm

5ASXMB3D6F40I3

Altera

FPGA

Industrial

No Lead

1517

BGA

Square

Plastic/Epoxy

350000

Yes

1.18 V

13207

TSMC

540

1.15

Grid Array

BGA1517,39X39,40

1.12 V

1 mm

100 °C (212 °F)

13207 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

2.7 mm

40 mm

540

40 mm

EP1SGX25DF672I5ES

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

1 mm

Tin Lead

Bottom

S-PBGA-B672

3.5 mm

27 mm

No

e0

27 mm

5AGXMA7K6F31C5

Altera

FPGA

Other

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B896

2.7 mm

31 mm

e0

622 MHz

31 mm

10M50DCF672A7G

Altera

FPGA

Automotive

Ball

672

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

e1

EP1S80F672C5ES

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

No

e0

5ASXFB3D6F35C5N

Altera

FPGA

Commercial Extended

Ball

1152

BGA

Square

Plastic/Epoxy

350000

Yes

1.13 V

13207

TSMC

385

1.1

Grid Array

BGA1152,34X34,40

1.07 V

1 mm

85 °C (185 °F)

13207 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

2.7 mm

35 mm

385

35 mm

5ASXMB3E6F40I3

Altera

FPGA

Industrial

No Lead

1517

BGA

Square

Plastic/Epoxy

350000

Yes

1.18 V

13207

540

1.15

Grid Array

BGA1517,39X39,40

1.12 V

1 mm

100 °C (212 °F)

13207 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

2.7 mm

40 mm

540

40 mm

EP20K60EFI196-2

Altera

3

220 °C (428 °F)

5AGTFD3E3F31C5

Altera

FPGA

Ball

896

BGA

Square

Plastic/Epoxy

362730

Yes

CMOS

384

1.1,1.2/3.3,2.5 V

Grid Array

BGA896,30X30,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B896

No

384

5AGXMB3G4F40C5N

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

362000

Yes

1.13 V

CMOS

704

1.1

1.1,1.2/3.3,2.5 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1517

3

2.7 mm

40 mm

No

e1

622 MHz

704

40 mm

EP2AGX95DF35C5

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

89178

Yes

.93 V

3747

452

0.9

Grid Array

BGA1152,34X34,40

.87 V

1 mm

85 °C (185 °F)

3747 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.6 mm

35 mm

e0

452

35 mm

10M02DFV36I6

Altera

FPGA

Ball

36

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B36

10M02DCV36C7

Altera

FPGA

Other

Ball

36

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B36

5AGXFB1D4F31C5N

Altera

FPGA

Other

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B896

2.7 mm

31 mm

e1

622 MHz

31 mm

10AX090U3F45I2SP

Altera

FPGA

Industrial

Ball

1932

BGA

Square

Plastic/Epoxy

900000

Yes

.93 V

33962

CMOS

480

.9

0.9 V

Grid Array

BGA1932,44X44,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

33962 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1932

3.5 mm

45 mm

No

480

45 mm

EP1SGX10DF672C5N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

10570

Yes

1.575 V

1200

CMOS

362

1.5

1.5,1.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1.425 V

1 mm

85 °C (185 °F)

1200 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e1

30 s

362

245 °C (473 °F)

27 mm

10AX057K3F35I2SG

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

570000

Yes

.93 V

CMOS

396

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

No

396

35 mm

5AGXMA7K4F35C4

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

670 MHz

35 mm

EP4SGX360FH29I4N

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

353600

Yes

.93 V

14144

CMOS

289

.9

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

14144 CLBS

Tin Silver Copper

Bottom

S-PBGA-B780

4

3.4 mm

33 mm

No

e1

717 MHz

30 s

289

245 °C (473 °F)

33 mm

EP2S15F672I3

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

15600

Yes

CMOS

366

1.2,1.5/3.3,3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1 mm

Tin Lead

Bottom

S-PBGA-B672

3

No

e0

358

220 °C (428 °F)

EP2A70B724I-8

Altera

220 °C (428 °F)

EP3CLS100F484C8N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

100448

Yes

1.25 V

100448

CMOS

278

1.2

1.2,1.2/3.3,2.5 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

100448 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.15 mm

23 mm

No

e1

450 MHz

30 s

278

260 °C (500 °F)

23 mm

EP1S25B956I7ES

Altera

FPGA

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B956

No

e0

5ASXMB5D4F40I3

Altera

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B1517

2.7 mm

40 mm

e0

670 MHz

40 mm

5CGXBC9A7F23C6N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

EP2AGX190DF29C6N

Altera

FPGA

Other

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

5ASXBB5E6F40C6

Altera

FPGA

Other

No Lead

1517

BGA

Square

Plastic/Epoxy

462000

Yes

1.13 V

17434

TSMC

540

1.1

Grid Array

BGA1517,39X39,40

1.07 V

1 mm

85 °C (185 °F)

17434 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

2.7 mm

40 mm

540

40 mm

EP1SGX40DF1020I6

Altera

FPGA

Military

Ball

1020

BGA

Square

Plastic/Epoxy

41250

Yes

CMOS

624

1.5,1.5/3.3 V

Grid Array

BGA1020,32X32,40

Field Programmable Gate Arrays

1 mm

135 °C (275 °F)

-65 °C (-85 °F)

Bottom

S-PBGA-B1020

3

No

624

220 °C (428 °F)

5CGXFC3B7F23A7

Altera

FPGA

Automotive

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXBC9A6F23C8N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

EP3SE50F780I2L

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

47500

Yes

CMOS

488

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin Lead

Bottom

S-PBGA-B780

1

No

e0

100 MHz

488

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.