Altera Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP3SL340F1152C4LN	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	337500	Yes			CMOS		744		1.2/3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm				Tin/Silver/Copper	Bottom	S-PBGA-B1152				No		e1	100 MHz		736
5CSXFC5C6F23I7	Altera	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm					Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
5CGXFC5B7M13C6	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B383		1.1 mm	13 mm								13 mm
5SGXMB5R3F40C3	Altera	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	490000	Yes			CMOS		432		0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B1517				No					432
EP3C10M164A7N	Altera	FPGA		Ball	164	FBGA	Square	Plastic/Epoxy	10320	Yes			CMOS		106		1.2/3.3 V	Grid Array, Fine Pitch	BGA164,15X15,20	Field Programmable Gate Arrays		.5 mm				Tin/Silver/Copper	Bottom	S-PBGA-B164				No		e1			106
5AGXMB3H6F35C4N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	670 MHz				35 mm
5CGXBC3C7U19C6	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
5CGXBC7F7U19I7	Altera	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array, Fine Pitch			1.07 V	.8 mm					Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
5CGXBC7F7F27C6	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5AGXBB3H6F40I5N	Altera	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B1517		2.7 mm	40 mm			e1	622 MHz				40 mm
EP4CE22F17	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.24 V	47				1.2		Grid Array, Low Profile			1.16 V	1 mm		47 CLBS			Bottom	S-PBGA-B256		1.55 mm	17 mm								17 mm
EP4SGX360NF45C3N	Altera	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	353600	Yes	.93 V	141440	CMOS		920	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	141440 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1932	4	3.8 mm	45 mm	No		e1	717 MHz	30 s	920	245 °C (473 °F)	45 mm
EP2AGZ350CF35C4N	Altera	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	.93 V					.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.6 mm	35 mm			e1	500 MHz				35 mm
EP2C35F484I6N	Altera	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	33216	Yes	1.25 V	2100	CMOS		322	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm		2100 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B484		2.6 mm	23 mm	No	Also requires 3.3 V supply	e1		40 s	306	260 °C (500 °F)	23 mm
5CGTFD9B5F31A7N	Altera	FPGA	Automotive	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B896		2 mm	31 mm								31 mm
EP4CE75F23C9LN	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	75408	Yes	1.03 V	4713			295	1	1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	4713 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	265 MHz	30 s	295	260 °C (500 °F)	23 mm
5AGZME5H3F35I3L	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	400000	Yes	1.18 V	15096			674	1.15		Grid Array	BGA1152,34X34,40		1.12 V	1 mm	100 °C (212 °F)	15096 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm						674		35 mm
10M08DAF484A7G	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy		Yes								Grid Array					125 °C (257 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484						e1
EP3SL340H1152C4L	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	337500	Yes	.94 V		CMOS		744	.9	1.2/3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.86 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152	4	3.9 mm	40 mm	No	It can also operate from 1.05 to 1.15 V supply	e0	717 MHz	20 s	744	220 °C (428 °F)	40 mm
EP3SL340H1152I3N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	337500	Yes	.94 V		CMOS		744	.9	1.2/3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.86 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B1152	4	3.9 mm	40 mm	No	It can also operate from 1.05 to 1.15 V supply	e1	717 MHz	30 s	744	245 °C (473 °F)	40 mm
5SGXEB5R2F43I2N	Altera	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	490000	Yes	.93 V	18500	CMOS		600	.9	0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	18500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		3.4 mm	42.5 mm	No					600		42.5 mm
EP4S100G3F45I2N	Altera	FPGA		Ball	1932	BGA	Square	Plastic/Epoxy	291200	Yes	.98 V	116480	CMOS		781	.95	0.95,1.2/3,1.5,2.5 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.92 V	1 mm		116480 CLBS		Tin Silver Copper	Bottom	S-PBGA-B	4	3.6 mm	45 mm	No		e1	800 MHz	30 s	781	245 °C (473 °F)	45 mm
EPF8820GM883B-3	Altera	FPGA	Military	Pin/Peg	192	PGA	Square	Ceramic	672	No			CMOS	38535Q/M;38534H;883B	152		3.3/5,5 V	Grid Array	PGA192,17X17	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)		-55 °C (-67 °F)	Tin Lead	Perpendicular	S-XPGA-P192				No		e0			148	220 °C (428 °F)
10AS022E5F27E3SP	Altera	FPGA		Ball	672	BGA	Square	Plastic	220000	Yes			CMOS		240	.9	0.9 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B672				No					240
5ASXBB3G4F31I3	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.18 V					1.15		Grid Array			1.12 V	1 mm				Tin Lead	Bottom	S-PBGA-B896		2.7 mm	31 mm			e0	670 MHz				31 mm
EP2AGX65EF29I3	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	60214	Yes	.93 V	2530			364	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	100 °C (212 °F)	2530 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B780		2.7 mm	29 mm			e0			364		29 mm
5SGSED6N1F45C2LN	Altera	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	583000	Yes	.88 V	22000	CMOS		840	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)	22000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.9 mm	45 mm	No					840		45 mm
5ASXFB3H6F35I3N	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	350000	Yes	1.18 V	13207	TSMC		385	1.15		Grid Array	BGA1152,34X34,40		1.12 V	1 mm	100 °C (212 °F)	13207 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm						385		35 mm
EP4S40G2F40C1	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes		91200						Grid Array				1 mm	85 °C (185 °F)	91200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B		3.8 mm	40 mm								40 mm
5CGXBC3F6U19C8	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
10AS057N2F40I1SG	Altera	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	.93 V					.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm								40 mm
EP20K1000EFI1020-1	Altera	FPGA	Industrial	Ball	1020	BGA	Square	Plastic/Epoxy	38400	Yes			CMOS		708		1.8,2.5,3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays		1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1020	3			No		e0			708	220 °C (428 °F)
5SGXMA4K2F35I2	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	420000	Yes			CMOS		432		0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B1152				No					432
5SGSMD3H3F35I3LN	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	236000	Yes	.88 V	8900	CMOS		432	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)	8900 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No					432		35 mm
5AGXMA7D6F35I5N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	622 MHz				35 mm
EP1SGX40FF672C5ES	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS			1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		3.5 mm	27 mm	No		e0					27 mm
5CGXFC7A7U19I7	Altera	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array, Fine Pitch			1.07 V	.8 mm					Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
5AGTFC7D3F31I3	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.18 V					1.15		Grid Array			1.12 V	1 mm				Tin Lead	Bottom	S-PBGA-B896		2.7 mm	31 mm			e0	670 MHz				31 mm
5CSEMA4U23C6	Altera	FPGA	Other	Ball	672	FBGA	Square	Plastic/Epoxy	40000	Yes	1.13 V		CMOS		145	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA672,28X28,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		1.85 mm	23 mm	No					145		23 mm
5CGTFD9A5F23C6	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
5CGXBC4B7F23A7N	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
5ASXMB3H6F35C6N	Altera	FPGA	Commercial Extended	Ball	1152	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC		385	1.1		Grid Array	BGA1152,34X34,40		1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm						385		35 mm
EP2AGX260EF29C6	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	244188	Yes			CMOS		372		0.9,1.2/3.3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm				Tin Lead	Bottom	S-PBGA-B780	3			No		e0		20 s	372	220 °C (428 °F)
EP2AGX260HF35C6N	Altera	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	.93 V					.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.6 mm	35 mm			e1	500 MHz				35 mm
5CGTFD9C5F27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5CGXFC7C6F31A7N	Altera	FPGA	Automotive	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B896		2 mm	31 mm								31 mm
5AGXMB1D6F31I3	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.18 V					1.15		Grid Array			1.12 V	1 mm				Tin Lead	Bottom	S-PBGA-B896		2.7 mm	31 mm			e0	670 MHz				31 mm
5AGXBA1D4F27I5	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm				Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm			e0	622 MHz				27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.