Altera Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5CGXBC4D6F23C7N	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
5AGXBA7G4F27C4N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm			e1	670 MHz				27 mm
EP2AGX190EF29I3N	Altera	FPGA	Industrial	Ball	780	HBGA	Square	Plastic/Epoxy	181165	Yes	.93 V		CMOS	372	.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm	No		e1	500 MHz		372		29 mm
EP2C5F256I6	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	4608	Yes	1.25 V	312	CMOS	158	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm		312 CLBS		Tin Lead	Bottom	S-PBGA-B256		1.55 mm	17 mm	No	Also requires 3.3 V supply	e0			150		17 mm
5CSEMA4U23A7	Altera	FPGA	Automotive	Ball	672	FBGA	Square	Plastic/Epoxy	40000	Yes	1.13 V		CMOS	145	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA672,28X28,32	Field Programmable Gate Arrays	1.07 V	.8 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B672		1.85 mm	23 mm	No					145		23 mm
5CSXFC5C6U23A7N	Altera	FPGA	Automotive	Ball	672	FBGA	Square	Plastic/Epoxy	85000	Yes	1.13 V		CMOS	145	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA672,28X28,32	Field Programmable Gate Arrays	1.07 V	.8 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B672		1.85 mm	23 mm	No					145		23 mm
EP1C4F324I7	Altera	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	4000	Yes	1.575 V	400		249	1.5	1.5,1.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)	400 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No		e0	320 MHz	20 s	249	220 °C (428 °F)	19 mm
5SGXEB6R1F43C2LN	Altera	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	597000	Yes	.88 V	22540	CMOS	600	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)	22540 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.4 mm	42.5 mm	No					600		42.5 mm
5AGZME3E3H29I4N	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	360000	Yes	.88 V	13584		342	0.85		Grid Array	BGA780,28X28,40		.82 V	1 mm	100 °C (212 °F)	13584 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.6 mm	33 mm						342		33 mm
EP2AGX45CU17C4	Altera	FPGA		Ball	358	FBGA	Square	Plastic/Epoxy	42959	Yes			CMOS	156		0.9,1.2/3.3,1.5,2.5 V	Grid Array, Fine Pitch	BGA358,20X20,32	Field Programmable Gate Arrays		.8 mm				Tin Lead	Bottom	S-PBGA-B358	3			No		e0		20 s	156	235 °C (455 °F)
5AGXMA3G4F27C6	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm			e0	500 MHz				27 mm
EP2C35U484C6N	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	33216	Yes	1.25 V	2076	CMOS	322	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)	2076 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.2 mm	19 mm	No	Also requires 3.3 V supply	e1	500 MHz	30 s	306	260 °C (500 °F)	19 mm
5SGXEA4K3F35C2L	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	420000	Yes	.88 V	15850	CMOS	432	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)	15850 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No					432		35 mm
5AGTFD3D3F35I5	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	622 MHz				35 mm
5SGXMA9K3H40I3N	Altera	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	840000	Yes	.88 V	31700	CMOS	696	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)	31700 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.9 mm	45 mm	No					696		45 mm
10AX066N3F40E2LP	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	660000	Yes	.93 V		CMOS	588	.9	0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No					588		40 mm
5AGXBB3G4F31I5N	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B896		2.7 mm	31 mm			e1	622 MHz				31 mm
EP3C55F780I7N	Altera	FPGA	Industrial	Ball	780	BGA	Rectangular	Plastic/Epoxy	55856	Yes	1.25 V	55856	CMOS	377	1.2		Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	55856 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	R-PBGA-B780	3	3.5 mm	29 mm	No		e1	472.5 MHz	30 s	377	260 °C (500 °F)	29 mm
5CGXBC4C7M13C7N	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B383		1.1 mm	13 mm								13 mm
5AGXBB7G4F35I3	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	670 MHz				35 mm
5ASTFD5G3F31I3	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Lead	Bottom	S-PBGA-B896		2.7 mm	31 mm			e0	670 MHz				31 mm
EP1C3T144C7ES	Altera	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.575 V	2910			1.5		Flatpack, Low Profile, Fine Pitch			1.425 V	.5 mm		2910 CLBS		Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	320 MHz				20 mm
EP1SGX25CF672I7N	Altera	FPGA	Military	Ball	672	BGA	Square	Plastic/Epoxy	25660	Yes	1.575 V		CMOS	455	1.5	1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	135 °C (275 °F)		-65 °C (-85 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e1		40 s	455	245 °C (473 °F)	27 mm
10AS022C3U19E2LG	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	220000	Yes	.93 V		CMOS	192	.9	0.9 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	.87 V	.8 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		3.25 mm	19 mm	No					192		19 mm
5CGXFC4D7F27C7N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5CGXBC7F7F31C8	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B896		2 mm	31 mm								31 mm
10M50DAF256I6	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B256
10M16SFE144A7G	Altera	FPGA	Automotive	Gull Wing	144	QFP	Square	Plastic/Epoxy		Yes							Flatpack					125 °C (257 °F)		-40 °C (-40 °F)		Quad	S-PQFP-G144
10AX090H4F34I3SP	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	900000	Yes	.93 V		CMOS	504	.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm	No					504		35 mm
5SGXEA7K3F40C3N	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	622000	Yes	.88 V	23472	CMOS	696	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)	23472 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No					696		40 mm
5CGXFC4F6U19C6N	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
EP2AGZ225CF40I4	Altera	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	224000	Yes	.93 V	8960		734	0.9		Grid Array	BGA1517,39X39,40		.87 V	1 mm	100 °C (212 °F)	8960 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1517		3.5 mm	40 mm			e0			734		40 mm
5SGXMABN2F45C2	Altera	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	952000	Yes	.93 V	35920	CMOS	840	.9	0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	35920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932	4	3.9 mm	45 mm	No					840		45 mm
5CGXFC3D7U19I7	Altera	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm					Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
5CGXBC3E6F23I7N	Altera	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm					Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
5SGXMA7H3F35C4N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	622000	Yes	.88 V	23472	CMOS	552	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)	23472 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No					552		35 mm
5AGXMB1H4F40I3	Altera	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Lead	Bottom	S-PBGA-B1517		2.7 mm	40 mm			e0	670 MHz				40 mm
5ASXMB5H4F31C5	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B896		2.7 mm	31 mm			e0	622 MHz				31 mm
EP4CGX15CN11C8	Altera	FPGA	Other	No Lead	148	VQCCN	Square			Yes	1.25 V				1.2		Chip Carrier, Very Thin Profile			1.15 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)		Quad	S-XQCC-N148		.8 mm	11 mm								11 mm
5SGSMD4E2H29C1N	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	360000	Yes	.93 V	13584	CMOS	360	.9	0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	13584 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.6 mm	33 mm	No					360		33 mm
5AGXFA1K4F31I3N	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B896		2.7 mm	31 mm			e1	670 MHz				31 mm
5AGXBB7G4F35I3N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	670 MHz				35 mm
EP20K1000EBI652-3V	Altera																																				220 °C (428 °F)
5CSEMA5F31C71	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	85000	Yes			CMOS	288		1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B896				No					288
10AX032E1F29E1LG	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm								29 mm
EP3SL70F780I3N	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	67500	Yes	.94 V		CMOS	488	.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply	e1	717 MHz	30 s	488	245 °C (473 °F)	29 mm
5CEFA4M13C6	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B383		1.1 mm	13 mm								13 mm
EP2A40F33I-7	Altera																											3									220 °C (428 °F)

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.