Altera Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5CGXFC5F7U19I7	Altera	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array, Fine Pitch			1.07 V	.8 mm						Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
EP1SGX10DF1020I6N	Altera	FPGA		Ball	1020	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS			1.5		Grid Array			1.425 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No		e1					33 mm
10AX115U3F45I2LP	Altera	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy	1150000	Yes	.93 V		CMOS	480		.9	0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.65 mm	45 mm	No					480		45 mm
10AX057K2F35I1SG	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V					.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm								35 mm
10AX057H4F34I3SG	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	570000	Yes	.93 V		CMOS	492		.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm	No					492		35 mm
5CGTFD9E5F23I7	Altera	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm						Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
10AS057N3F40I2SG	Altera	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	570000	Yes	.93 V		CMOS	588		.9	0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No					588		40 mm
EPF6010AFI100-2	Altera	FPGA		Ball	100	BGA	Square	Plastic/Epoxy		Yes	3.6 V	880			10000	3.3		Grid Array			3 V	1 mm		2 ns	880 CLBS, 10000 Gates		Tin Lead	Bottom	S-PBGA-B100	3		11 mm	No		e0	153 MHz			220 °C (428 °F)	11 mm
5AGXMA7G6F35C4	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	670 MHz				35 mm
5CGXBC9F6F23A7N	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
5AGXMB1K6F35I5N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	622 MHz				35 mm
5AGXFB7K6F35I5N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	622 MHz				35 mm
5CGXFC9D6U19C8	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
5AGXFA1G6F27C4	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm			e0	670 MHz				27 mm
5CGXFC7E7F27A7	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
10AX090S2F45I1LP	Altera	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy		Yes	.93 V					.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.65 mm	45 mm								45 mm
EP1S25B672C7ES	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS			1.5		Grid Array			1.425 V		85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672				No		e0
5CGTFD5D5F23I7	Altera	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm						Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
5ASXBB5D6F40I3N	Altera	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	462000	Yes	1.18 V	17434	TSMC	540		1.15		Grid Array	BGA1517,39X39,40		1.12 V	1 mm	100 °C (212 °F)		17434 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm						540		40 mm
10AS016C3U19I2SP	Altera	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	160000	Yes	.93 V	6151	CMOS	192		.9	0.9 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	.87 V	.8 mm	100 °C (212 °F)		6151 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		3.25 mm	19 mm	No					192		19 mm
5SGXEA7K1F40I2N	Altera	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	622000	Yes	.93 V	23472	CMOS	696		.9	0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		23472 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No					696		40 mm
EP2AGX190DF29C4N	Altera	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V					.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
5AGXFB3K6F35C5	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	622 MHz				35 mm
EP1S60F672C5	Altera	FPGA	Commercial Extended	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS			1.5		Grid Array			1.425 V		85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672				No		e0
5CEBA2M13C8	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B383		1.1 mm	13 mm								13 mm
5AGXMB7G6F40I5N	Altera	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B1517		2.7 mm	40 mm			e1	622 MHz				40 mm
EP3SE80F780C2N	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	80000	Yes	.94 V		CMOS	488		.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply	e1	800 MHz	30 s	488	245 °C (473 °F)	29 mm
5CGXFC5C6M11C7	Altera	FPGA	Other	Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B301		1.1 mm	11 mm								11 mm
5CGXFC4F7F27I7N	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm						Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5CGXFC5F7M13C6	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B383		1.1 mm	13 mm								13 mm
EP2C15AF256I7N	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	14448	Yes	1.25 V		CMOS	152		1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No	Also requires 3.3 V supply	e1			144		17 mm
10AX115H1F34E1MP	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V					.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm								35 mm
5CGXFC5A7F27C8N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
10AX022E3F29E2SG	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	220000	Yes	.93 V		CMOS	288		.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					288		29 mm
5SGXMA5K1F40C2N	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	490000	Yes	.93 V	18500	CMOS	696		.9	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		18500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No					696		40 mm
5AGXFA7D6F35I3N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V					1.15		Grid Array			1.12 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	670 MHz				35 mm
5AGXMA7G6F35C5	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	622 MHz				35 mm
5CGXFC7C7F27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
10AX090S1F45I1LG	Altera	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy		Yes	.93 V					.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.65 mm	45 mm								45 mm
EP1S25F780C5N	Altera	FPGA	Commercial Extended	Ball	780	BGA	Square	Plastic/Epoxy	25660	Yes	1.575 V	2852	CMOS	706		1.5	1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		2852 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e1		40 s	706	245 °C (473 °F)	29 mm
EP2C50F672I6N	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	50528	Yes	1.25 V	3182	CMOS	450		1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm			3182 CLBS		Tin Silver Copper	Bottom	S-PBGA-B672		2.6 mm	27 mm	No	Also requires 3.3 V supply	e1			434		27 mm
5AGXBB7H6F40I3N	Altera	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.18 V					1.15		Grid Array			1.12 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B1517		2.7 mm	40 mm			e1	670 MHz				40 mm
EP1K10TI100-2P	Altera	FPGA	Industrial	Gull Wing	100	QFP	Square	Plastic/Epoxy	576	Yes			CMOS	66			2.5,2.5/3.3 V	Flatpack	TQFP100,.63SQ	Field Programmable Gate Arrays		.5 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3			No		e0			66	220 °C (428 °F)
5CGXBC7B6F27I7	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm						Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5AGXBA7G4F27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm			e1	500 MHz				27 mm
5CGXBC9F7F23C8	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
10M50DFF484C7G	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	50000	Yes			CMOS	360		1.2	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1			360
5AGTFC7D3F35I3N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V					1.15		Grid Array			1.12 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	670 MHz				35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.