Altera Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5SGXMA4K2F35I3LN	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	420000	Yes	.88 V	15850	CMOS	432	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)	15850 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No				432		35 mm
5AGXFA1D4F31I3N	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B896		2.7 mm	31 mm		e1	670 MHz				31 mm
5ASXMB3G6F31I3N	Altera	FPGA	Industrial	Ball	896	BGA	Square	Plastic/Epoxy	350000	Yes	1.18 V	13207	TSMC	250	1.15		Grid Array	BGA896,30X30,40		1.12 V	1 mm	100 °C (212 °F)	13207 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm					250		31 mm
5CGXBC5C7M11A7	Altera	FPGA	Automotive	Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B301		1.1 mm	11 mm							11 mm
5SGXMB9R2H43C2LN	Altera	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	840000	Yes	.88 V	31700	CMOS	600	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)	31700 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		4 mm	45 mm	No				600		45 mm
10AS016C4U19E3SG	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	160000	Yes	.93 V		CMOS	192	.9	0.9 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	.87 V	.8 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		3.25 mm	19 mm	No				192		19 mm
EP4CE10F17C8L	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	10320	Yes	1.03 V	645		179	1	1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	645 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e0	362 MHz		179		17 mm
EP3C16E144C8	Altera	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	84	1.2		Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.4 mm	85 °C (185 °F)	15408 CLBS	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No	e0	472.5 MHz	20 s	84	220 °C (428 °F)	20 mm
5CGXFC3C6U19C7N	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm							19 mm
10AX115R3F40I2SGE2	Altera	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	.93 V	42720			.9		Grid Array			.87 V	1 mm	100 °C (212 °F)	42720 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm							40 mm
5AGXBA5G6F35I3	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	670 MHz				35 mm
EP4SE530H35M3N	Altera	FPGA	Military	Ball	1152	BGA	Square	Plastic/Epoxy	531200	Yes	.93 V	21248	TSMC	744	0.9		Grid Array	BGA1152,34X34,40		.87 V	1 mm	125 °C (257 °F)	21248 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B1152		3.5 mm	42 mm					744		42 mm
5AGXBB1K4F40C6N	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517		2.7 mm	40 mm		e1	500 MHz				40 mm
10M02SFE144C8G	Altera	FPGA	Other	Gull Wing	144	QFP	Square	Plastic/Epoxy		Yes							Flatpack					85 °C (185 °F)		0 °C (32 °F)		Quad	S-PQFP-G144
10M02SCU169I6	Altera	FPGA		Ball	169	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B169
5SGXMA7N3F40C3	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	622000	Yes	.88 V	23472	CMOS	600	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)	23472 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No				600		40 mm
EP4CGX150CF31C8N	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B896		2.4 mm	31 mm							31 mm
5CGXBC4B6M13C7N	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B383		1.1 mm	13 mm							13 mm
EP1S30F1020C5	Altera	FPGA	Commercial Extended	Ball	1020	BGA	Square	Plastic/Epoxy	32470	Yes	1.575 V	3819	CMOS	726	1.5	1.5,1.5/3.3 V	Grid Array	BGA1020,31X31,50	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	3819 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No	e0		20 s	726	220 °C (428 °F)	33 mm
EP3SE260F1517C2LN	Altera	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	255000	Yes			CMOS	976		1.2/3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays		1 mm				Tin Silver Copper	Bottom	S-PBGA-B1517				No	e1	100 MHz		976
5SGSMD8N3F45I4	Altera	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy	695000	Yes	.88 V	26240	CMOS	840	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)	26240 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.9 mm	45 mm	No				840		45 mm
5AGXMA7K6F27C4	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	670 MHz				27 mm
5ASXMB5H6F40C6	Altera	FPGA	Other	No Lead	1517	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	540	1.1		Grid Array	BGA1517,39X39,40		1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm					540		40 mm
5ASXBB3H6F31I3N	Altera	FPGA	Industrial	Ball	896	BGA	Square	Plastic/Epoxy	350000	Yes	1.18 V	13207	TSMC	250	1.15		Grid Array	BGA896,30X30,40		1.12 V	1 mm	100 °C (212 °F)	13207 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm					250		31 mm
10AX027H1F35E1SP	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm							35 mm
5ASXFB3H4F31I3	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Lead	Bottom	S-PBGA-B896		2.7 mm	31 mm		e0	670 MHz				31 mm
5AGXMA7H6F27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	500 MHz				27 mm
5SGTMC5K3F40	Altera	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes							Grid Array				1 mm					Bottom	S-PBGA-B1517		3.4 mm	40 mm			12.5 MHz				40 mm
5CGXFC3E6U19C8N	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm							19 mm
5CGXFC5C7M11A7N	Altera	FPGA	Automotive	Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B301		1.1 mm	11 mm							11 mm
5AGXMA5G6F31C6	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B896		2.7 mm	31 mm		e0	500 MHz				31 mm
10M08DFV81A7	Altera	FPGA	Automotive	Ball	81	BGA	Square	Plastic/Epoxy		Yes							Grid Array					125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B81
5AGXBA5H6F27C5N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	622 MHz				27 mm
5AGXBB3D4F31C6N	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896		2.7 mm	31 mm		e1	500 MHz				31 mm
5AGXBB5K6F40I3N	Altera	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B1517		2.7 mm	40 mm		e1	670 MHz				40 mm
10AS066K3F35E2SP	Altera	FPGA		Ball	1152	BGA	Square	Plastic	660000	Yes			CMOS	396	.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B1152				No				396
5AGXMA1D6F27C5N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	622 MHz				27 mm
5AGTMD7G3F35I5	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	622 MHz				35 mm
5AGXBB5H4F40I3N	Altera	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B1517		2.7 mm	40 mm		e1	670 MHz				40 mm
10AX066K2F35I2SG	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	660000	Yes	.93 V		CMOS	396	.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm	No				396		35 mm
10M40DFF672I6G	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes							Grid Array								Tin Silver Copper	Bottom	S-PBGA-B672					e1
5SGTMC5K2F40I3	Altera	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	425000	Yes	.88 V	16040	CMOS	600	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)	16040 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No				600		40 mm
5SGXEA5N3F40I4N	Altera	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	490000	Yes	.88 V	18500	CMOS	600	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)	18500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No				600		40 mm
10AX027E3F27E2SG	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	270000	Yes	.93 V		CMOS	240	.9	0.9 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		3.25 mm	27 mm	No				240		27 mm
5AGXFA1H6F27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	500 MHz				27 mm
5SGSMD8K1F40I2	Altera	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	695000	Yes			CMOS	696		0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B1517				No				696
EP1S25B956C6ES	Altera	FPGA	Other	Ball	956	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B956				No	e0
EP2AGZ225FF35I3	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	224000	Yes	.93 V	8960		554	0.9		Grid Array	BGA1152,34X34,40		.87 V	1 mm	100 °C (212 °F)	8960 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1152		3.4 mm	35 mm		e0			554		35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.