Altera Field Programmable Gate Arrays (FPGA) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

10AX022E3F27E1LG

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

3.25 mm

27 mm

27 mm

5CGXFC3D6F23C8N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5AGXFB1G6F40C6

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1517

2.7 mm

40 mm

e0

500 MHz

40 mm

5SGXMA5N3F45C4

Altera

FPGA

Ball

1932

BGA

Square

Plastic/Epoxy

490000

Yes

CMOS

840

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1932,44X44,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1932

No

840

EP3SL340F1152I3N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

337500

Yes

CMOS

744

1.2/3.3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1 mm

Tin/Silver/Copper

Bottom

S-PBGA-B1152

No

e1

100 MHz

736

5CGXBC4E7M11C8

Altera

FPGA

Other

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

EP3C16U484I8

Altera

FPGA

Ball

484

FBGA

Square

Plastic/Epoxy

15408

Yes

1.25 V

CMOS

346

1.2

Grid Array, Fine Pitch

BGA484,22X22,32

Field Programmable Gate Arrays

1.15 V

.8 mm

Tin Lead

Bottom

S-PBGA-B484

1

2.05 mm

19 mm

No

e0

346

19 mm

5AGXMA7G4F31I3

Altera

FPGA

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B896

2.7 mm

31 mm

e0

670 MHz

31 mm

5AGXMA7D4F27I5N

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

242000

Yes

1.13 V

CMOS

336

1.1

1.1,1.2/3.3,2.5 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1.07 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B672

3

2.7 mm

27 mm

No

e1

622 MHz

336

27 mm

5AGXMB3D6F40C4N

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1517

2.7 mm

40 mm

e1

670 MHz

40 mm

EP1SGX40DF1020C7ES

Altera

FPGA

Other

Ball

1020

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1020

3.5 mm

33 mm

No

e0

33 mm

10AX090H4F34E3SP

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

900000

Yes

.93 V

CMOS

504

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

No

504

35 mm

5ASXMB5D6F35I5

Altera

FPGA

Industrial

No Lead

1152

BGA

Square

Plastic/Epoxy

462000

Yes

1.13 V

17434

TSMC

385

1.1

Grid Array

BGA1152,34X34,40

1.07 V

1 mm

100 °C (212 °F)

17434 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

385

35 mm

5ASTMD3E3F31I5N

Altera

FPGA

Ball

896

BGA

Square

Plastic/Epoxy

350000

Yes

1.13 V

CMOS

178

1.1

1.1,1.2/3.3,2.5 V

Grid Array

BGA896,30X30,40

Field Programmable Gate Arrays

1.07 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B896

2.7 mm

31 mm

No

e1

622 MHz

178

31 mm

EP1K30QI208-1F

Altera

FPGA

Industrial

Gull Wing

208

QFP

Square

Plastic/Epoxy

1728

Yes

CMOS

147

2.5,2.5/3.3 V

Flatpack

QFP208,1.2SQ,20

Field Programmable Gate Arrays

.5 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G208

3

No

e0

147

220 °C (428 °F)

5CGTFD7F5F27C6N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5AGXMA5G6F31I3

Altera

FPGA

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B896

2.7 mm

31 mm

e0

670 MHz

31 mm

EPF10K30ETI144-1DX

Altera

3

220 °C (428 °F)

EP1S40B956I5

Altera

FPGA

Ball

956

BGA

Square

Plastic/Epoxy

41250

Yes

1.575 V

CMOS

822

1.5

1.5,1.5/3.3 V

Grid Array

BGA956,31X31,50

Field Programmable Gate Arrays

1.425 V

1.27 mm

Tin Lead

Bottom

S-PBGA-B956

No

e0

426

220 °C (428 °F)

5CGXFC7A7U19C6

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5AGXFB3K6F40C4N

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1517

2.7 mm

40 mm

e1

670 MHz

40 mm

10AX016E3F27E2SP

Altera

FPGA

Ball

672

BGA

Square

Plastic

160000

Yes

CMOS

240

.9

0.9 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B672

No

240

5AGXMB7G6F40I3

Altera

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B1517

2.7 mm

40 mm

e0

670 MHz

40 mm

EP2AGX45CF29C5

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

42959

Yes

.93 V

1805

364

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

85 °C (185 °F)

1805 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

2.7 mm

29 mm

e0

364

29 mm

10AX115H3F34I2SGE2

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

42720

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

42720 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.35 mm

35 mm

35 mm

5CGXBC7D7F23C7N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXFC5F7M11A7

Altera

FPGA

Automotive

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

EP1S10F484I7ES

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B484

No

e0

5SGXEA5N3F45C2LN

Altera

FPGA

Other

Ball

1932

BGA

Square

Plastic/Epoxy

490000

Yes

.88 V

18500

CMOS

840

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1932,44X44,40

Field Programmable Gate Arrays

.82 V

1 mm

85 °C (185 °F)

18500 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1932

3.9 mm

45 mm

No

840

45 mm

5CSTFD6D4F31C82

Altera

FPGA

Ball

896

BGA

Square

Plastic/Epoxy

110000

Yes

CMOS

288

1.1,1.2/3.3,2.5 V

Grid Array

BGA896,30X30,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B896

No

288

5AGXBA7K4F35I3

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

670 MHz

35 mm

10AX027E2F27I1SG

Altera

FPGA

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

3.25 mm

27 mm

27 mm

5AGXFA3G6F27C5

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

622 MHz

27 mm

5CGXFC9E7F27C8N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5SGXEA7H2F35C3

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

622000

Yes

.88 V

23472

CMOS

552

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.82 V

1 mm

85 °C (185 °F)

23472 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

552

35 mm

10AX090K3F36I2LP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

900000

Yes

.93 V

CMOS

432

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

No

432

35 mm

5CGXFC5C7U19I7N

Altera

FPGA

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CEBA7F31C6N

Altera

FPGA

Other

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B896

2 mm

31 mm

31 mm

5SGXEA7K1F35C2

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

622000

Yes

.93 V

23472

CMOS

432

.9

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

23472 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

432

35 mm

5CGXBC9F7F27I7N

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

10AX090R4F40E3LP

Altera

FPGA

Ball

1517

BGA

Square

Plastic

900000

Yes

CMOS

342

.9

0.9 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1517

No

342

10AX115U3F45E2SP

Altera

FPGA

Ball

1932

BGA

Square

Plastic

1150000

Yes

CMOS

480

.9

0.9 V

Grid Array

BGA1932,44X44,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1932

No

480

5CGXBC5D7M13C8N

Altera

FPGA

Other

Ball

383

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B383

1.1 mm

13 mm

13 mm

5ASXMB3H6F40I5N

Altera

FPGA

Industrial

Ball

1517

HBGA

Square

Plastic/Epoxy

350000

Yes

1.13 V

13207

TSMC

540

1.1

Grid Array, Heat Sink/Slug

BGA1517,39X39,40

1.07 V

1 mm

100 °C (212 °F)

13207 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

2.7 mm

40 mm

540

40 mm

5CSXFC5D6F23C6N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

EP2AGX260FF29I5N

Altera

FPGA

Industrial

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

5CGXBC5F6M11A7

Altera

FPGA

Automotive

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5AGXMB5K4F35I5N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

622 MHz

35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.