Altera Field Programmable Gate Arrays (FPGA) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

5CSEMA6F31C71

Altera

FPGA

Ball

896

BGA

Square

Plastic/Epoxy

110000

Yes

CMOS

288

1.1,1.2/3.3,2.5 V

Grid Array

BGA896,30X30,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B896

No

288

5AGXFB3K4F31I3N

Altera

FPGA

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B896

2.7 mm

31 mm

e1

670 MHz

31 mm

EP3C25U256A7

Altera

FPGA

Ball

256

LFBGA

Square

Plastic/Epoxy

24624

Yes

1.25 V

24624

CMOS

156

1.2

1.2/3.3 V

Grid Array, Low Profile, Fine Pitch

BGA256,16X16,32

Field Programmable Gate Arrays

1.15 V

.8 mm

24624 CLBS

Bottom

S-PBGA-B256

1.5 mm

14 mm

No

156

14 mm

5AGXMA7G6F27I3N

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B672

2.7 mm

27 mm

e1

670 MHz

27 mm

5AGXFB5G4F35C4

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

670 MHz

35 mm

10AS057N2F40E2LP

Altera

FPGA

Ball

1517

BGA

Square

Plastic

570000

Yes

CMOS

588

.9

0.9 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1517

No

588

5SGXEA7N3F40C4

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

622000

Yes

.88 V

23472

CMOS

600

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.82 V

1 mm

85 °C (185 °F)

23472 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

No

600

40 mm

EP4S40G5H40I3N

Altera

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

531200

Yes

.98 V

212480

CMOS

654

.95

0.95,1.2/3,1.5,2.5 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.92 V

1 mm

212480 CLBS

Tin Silver Copper

Bottom

S-PBGA-B

4

3.8 mm

42.5 mm

No

e1

717 MHz

30 s

654

245 °C (473 °F)

42.5 mm

10AS027H2F35E2SG

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

270000

Yes

.93 V

CMOS

384

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

No

384

35 mm

10M16SCU169C7

Altera

FPGA

Other

Ball

169

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B169

5AGXBA7H4F27C5N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.7 mm

27 mm

e1

622 MHz

27 mm

5ASXFB3E4F40C4

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1517

2.7 mm

40 mm

e0

670 MHz

40 mm

EP2AGZ400FF40I4N

Altera

FPGA

Industrial

Ball

1517

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

500 MHz

40 mm

5CGXBC9C6F27A7

Altera

FPGA

Automotive

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5ASTFD3K3F40I3

Altera

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B1517

2.7 mm

40 mm

e0

670 MHz

40 mm

5CGTFD5E5F23C6

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXBC4E6M11I7N

Altera

FPGA

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXFC7D7U19C8

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXFC3B6U19C8

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

10AS057K2F40I1LG

Altera

FPGA

Industrial

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

40 mm

5CGXBC5A7F23C6

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5AGXFA5K4F27C5

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

622 MHz

27 mm

5CGXBC5B7F27A7

Altera

FPGA

Automotive

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5CEFA2U15I7N

Altera

FPGA

Ball

324

LFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Low Profile, Fine Pitch

1.07 V

.8 mm

Bottom

S-PBGA-B324

1.5 mm

15 mm

15 mm

5CEFA4F23I7

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

EP4CGX22BF19C6N

Altera

FPGA

Other

Ball

324

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

1.55 mm

19 mm

19 mm

5CSEBA6F31I7N

Altera

FPGA

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Bottom

S-PBGA-B896

2 mm

31 mm

31 mm

10AX090K4F36I3SP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

900000

Yes

.93 V

CMOS

432

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

No

432

35 mm

5AGXMA5G6F35C4

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

670 MHz

35 mm

EP2AGZ300CF29I4

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

298000

Yes

.93 V

11920

281

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

100 °C (212 °F)

11920 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B780

2.6 mm

29 mm

e0

281

29 mm

10M25DAF256A7

Altera

FPGA

Automotive

Ball

256

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B256

5AGXMB7K6F40I5N

Altera

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1517

2.7 mm

40 mm

e1

622 MHz

40 mm

10AS057K2F40E1SP

Altera

FPGA

Ball

1517

BGA

Square

Plastic

570000

Yes

CMOS

696

.9

0.9 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1517

No

696

10AS057K4F40E3LP

Altera

FPGA

Ball

1517

BGA

Square

Plastic

570000

Yes

CMOS

696

.9

0.9 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1517

No

696

5AGXBB1D4F40I5

Altera

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Lead

Bottom

S-PBGA-B1517

2.7 mm

40 mm

e0

622 MHz

40 mm

5AGXBA5K6F31I3N

Altera

FPGA

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B896

2.7 mm

31 mm

e1

670 MHz

31 mm

EP3SL200H780C4LN

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

200000

Yes

.94 V

CMOS

488

.9

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.86 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

4

3.5 mm

33 mm

No

It can also operate from 1.05 to 1.15 V supply

e1

717 MHz

30 s

488

245 °C (473 °F)

33 mm

5AGXFA7H6F27I3

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

670 MHz

27 mm

5CGTFD7A5F27C7

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

10AS032H2F34I2SP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

320000

Yes

.93 V

11990

CMOS

384

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

11990 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.35 mm

35 mm

No

384

35 mm

5AGXMA7G4F35I3

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

670 MHz

35 mm

5AGXMA7G4F27C5N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.7 mm

27 mm

e1

622 MHz

27 mm

10AS048H2F34E2LP

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

480000

Yes

.93 V

CMOS

492

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

No

492

35 mm

10AX115U3F45I2SG

Altera

FPGA

Industrial

Ball

1932

BGA

Square

Plastic/Epoxy

1150000

Yes

.93 V

CMOS

480

.9

0.9 V

Grid Array

BGA1932,44X44,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1932

3.65 mm

45 mm

No

480

45 mm

10AX115N1F40E1LG

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

40 mm

5AGXBB3G4F35C5N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

622 MHz

35 mm

10AX057N2F40I2SG

Altera

FPGA

Industrial

Ball

1517

BGA

Square

Plastic/Epoxy

570000

Yes

.93 V

CMOS

588

.9

0.9 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

No

588

40 mm

EP4CE40F29C8

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

39600

Yes

1.25 V

535

1.2

1.2,1.2/3.3,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

3

2.4 mm

29 mm

No

e0

20 s

535

220 °C (428 °F)

29 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.